Available 24/7 at SENICO ELECTRONICS INTL CO., LIMITED
    SENICO ELECTRONICS INTL CO., LIMITED

    IC Sockets

    Manufacturer Series Packaging Product Status Type Number of Positions or Pins (Grid) Pitch - Mating Contact Finish - Mating Contact Finish Thickness - Mating Contact Material - Mating Mounting Type Features Termination Pitch - Post Contact Finish - Post Contact Finish Thickness - Post Contact Material - Post Housing Material Operating Temperature















































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































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    Photo Mfr. Part # Availability Price Quantity Datasheet RoHs Series Packaging Product Status Type Number of Positions or Pins (Grid) Pitch - Mating Contact Finish - Mating Contact Finish Thickness - Mating Contact Material - Mating Mounting Type Features Termination Pitch - Post Contact Finish - Post Contact Finish Thickness - Post Contact Material - Post Housing Material Operating Temperature
    510-87-100-11-001101

    510-87-100-11-001101

    CONN SOCKET PGA 100POS GOLD

    Preci-Dip

    4,973
    RFQ
    510-87-100-11-001101

    Datasheet

    510-87-100-11-001101 510 Bulk Active PGA 100 (11 x 11) 0.100" (2.54mm) Gold Flash Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
    299-83-610-10-002101

    299-83-610-10-002101

    CONN IC DIP SOCKET 10POS GOLD

    Preci-Dip

    2,467
    RFQ
    299-83-610-10-002101

    Datasheet

    299-83-610-10-002101 299 Bulk Active DIP, 0.6" (15.24mm) Row Spacing 10 (2 x 5) 0.100" (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole, Right Angle, Horizontal Closed Frame Solder 0.100" (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
    ICF-628-TM-O-TR

    ICF-628-TM-O-TR

    .100" SURFACE MOUNT SCREW MACHIN

    Samtec Inc.

    4,413
    RFQ
    ICF-628-TM-O-TR

    Datasheet

    ICF-628-TM-O-TR ICF Tape & Reel (TR) Active DIP, 0.6" (15.24mm) Row Spacing 28 (2 x 14) 0.100" (2.54mm) Tin - Beryllium Copper Surface Mount Open Frame Solder 0.100" (2.54mm) Tin - Beryllium Copper Liquid Crystal Polymer (LCP) -55°C ~ 125°C
    ICF-628-T-I-TR

    ICF-628-T-I-TR

    .100" SURFACE MOUNT SCREW MACHIN

    Samtec Inc.

    3,664
    RFQ
    ICF-628-T-I-TR

    Datasheet

    ICF-628-T-I-TR ICF Tape & Reel (TR) Active DIP, 0.6" (15.24mm) Row Spacing 28 (2 x 14) 0.100" (2.54mm) Tin - Beryllium Copper Surface Mount Open Frame Solder 0.100" (2.54mm) Tin - Beryllium Copper Liquid Crystal Polymer (LCP) -55°C ~ 125°C
    116-87-624-41-011101

    116-87-624-41-011101

    CONN IC DIP SOCKET 24POS GOLD

    Preci-Dip

    3,083
    RFQ
    116-87-624-41-011101

    Datasheet

    116-87-624-41-011101 116 Bulk Active DIP, 0.6" (15.24mm) Row Spacing 24 (2 x 12) 0.100" (2.54mm) Gold Flash Beryllium Copper Through Hole Elevated, Open Frame Solder 0.100" (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
    20-1518-00

    20-1518-00

    CONN IC DIP SOCKET 20POS GOLD

    Aries Electronics

    2,421
    RFQ
    20-1518-00

    Datasheet

    20-1518-00 518 Bulk Active DIP, 0.2" (5.08mm) Row Spacing 20 (2 x 10) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Surface Mount Open Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled -
    35-0518-10H

    35-0518-10H

    CONN SOCKET SIP 35POS GOLD

    Aries Electronics

    3,854
    RFQ
    35-0518-10H

    Datasheet

    35-0518-10H 518 Bulk Active SIP 35 (1 x 35) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled -
    40-0518-10H

    40-0518-10H

    CONN SOCKET SIP 40POS GOLD

    Aries Electronics

    4,008
    RFQ
    40-0518-10H

    Datasheet

    40-0518-10H 518 Bulk Active SIP 40 (1 x 40) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled -
    614-87-650-41-001101

    614-87-650-41-001101

    CONN IC DIP SOCKET 50POS GOLD

    Preci-Dip

    3,477
    RFQ
    614-87-650-41-001101

    Datasheet

    614-87-650-41-001101 614 Bulk Active DIP, 0.6" (15.24mm) Row Spacing 50 (2 x 25) 0.100" (2.54mm) Gold Flash Beryllium Copper Through Hole Carrier, Open Frame Solder 0.100" (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
    212-1-24-006

    212-1-24-006

    CONN IC DIP SOCKET 24POS GOLD

    CNC Tech

    3,363
    RFQ
    212-1-24-006

    Datasheet

    212-1-24-006 - Tube Active DIP, 0.6" (15.24mm) Row Spacing 24 (2 x 12) 0.100" (2.54mm) Gold - Beryllium Copper Surface Mount Open Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Polybutylene Terephthalate (PBT) -40°C ~ 105°C
    299-87-612-10-002101

    299-87-612-10-002101

    CONN IC DIP SOCKET 12POS GOLD

    Preci-Dip

    4,384
    RFQ
    299-87-612-10-002101

    Datasheet

    299-87-612-10-002101 299 Bulk Active DIP, 0.6" (15.24mm) Row Spacing 12 (2 x 6) 0.100" (2.54mm) Gold Flash Beryllium Copper Through Hole, Right Angle, Horizontal Closed Frame Solder 0.100" (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
    510-87-088-12-051101

    510-87-088-12-051101

    CONN SOCKET PGA 88POS GOLD

    Preci-Dip

    3,831
    RFQ
    510-87-088-12-051101

    Datasheet

    510-87-088-12-051101 510 Bulk Active PGA 88 (12 x 12) 0.100" (2.54mm) Gold Flash Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
    510-87-088-12-052101

    510-87-088-12-052101

    CONN SOCKET PGA 88POS GOLD

    Preci-Dip

    4,001
    RFQ
    510-87-088-12-052101

    Datasheet

    510-87-088-12-052101 510 Bulk Active PGA 88 (12 x 12) 0.100" (2.54mm) Gold Flash Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
    116-83-328-41-012101

    116-83-328-41-012101

    CONN IC DIP SOCKET 28POS GOLD

    Preci-Dip

    3,514
    RFQ
    116-83-328-41-012101

    Datasheet

    116-83-328-41-012101 116 Bulk Active DIP, 0.3" (7.62mm) Row Spacing 28 (2 x 14) 0.100" (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Elevated, Open Frame Solder 0.100" (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
    7-1437536-2

    7-1437536-2

    CONN IC DIP SOCKET 36POS GOLD

    TE Connectivity AMP Connectors

    3,566
    RFQ
    7-1437536-2

    Datasheet

    7-1437536-2 500 Tube Obsolete DIP, 0.6" (15.24mm) Row Spacing 36 (2 x 18) 0.100" (2.54mm) Gold 25.0µin (0.63µm) Beryllium Copper Through Hole Closed Frame Solder 0.100" (2.54mm) - - Brass - -55°C ~ 125°C
    114-83-642-41-117101

    114-83-642-41-117101

    CONN IC DIP SOCKET 42POS GOLD

    Preci-Dip

    2,289
    RFQ
    114-83-642-41-117101

    Datasheet

    114-83-642-41-117101 114 Bulk Active DIP, 0.6" (15.24mm) Row Spacing 42 (2 x 21) 0.100" (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Surface Mount Open Frame Solder 0.100" (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
    ICF-316-F-O

    ICF-316-F-O

    .100" SURFACE MOUNT SCREW MACHIN

    Samtec Inc.

    4,746
    RFQ
    ICF-316-F-O

    Datasheet

    ICF-316-F-O ICF Tube Active DIP, 0.3" (7.62mm) Row Spacing 16 (2 x 8) 0.100" (2.54mm) Gold 3.00µin (0.076µm) Beryllium Copper Surface Mount Open Frame Solder 0.100" (2.54mm) Tin - Beryllium Copper Liquid Crystal Polymer (LCP) -55°C ~ 125°C
    ICF-316-F-I

    ICF-316-F-I

    .100" SURFACE MOUNT SCREW MACHIN

    Samtec Inc.

    2,864
    RFQ
    ICF-316-F-I

    Datasheet

    ICF-316-F-I ICF Tube Active DIP, 0.3" (7.62mm) Row Spacing 16 (2 x 8) 0.100" (2.54mm) Gold 3.00µin (0.076µm) Beryllium Copper Surface Mount Open Frame Solder 0.100" (2.54mm) Tin - Beryllium Copper Liquid Crystal Polymer (LCP) -55°C ~ 125°C
    116-83-624-41-002101

    116-83-624-41-002101

    CONN IC DIP SOCKET 24POS GOLD

    Preci-Dip

    4,082
    RFQ
    116-83-624-41-002101

    Datasheet

    116-83-624-41-002101 116 Bulk Active DIP, 0.6" (15.24mm) Row Spacing 24 (2 x 12) 0.100" (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Elevated, Open Frame Solder 0.100" (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
    HLS-0204-T-31

    HLS-0204-T-31

    .100" SCREW MACHINE SOCKET ARRAY

    Samtec Inc.

    3,819
    RFQ
    HLS-0204-T-31

    Datasheet

    HLS-0204-T-31 HLS Tube Active SIP 8 (2 x 4) 0.100" (2.54mm) Tin - - Through Hole Closed Frame Solder 0.100" (2.54mm) - - - Thermoplastic -55°C ~ 140°C
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