Available 24/7 at SENICO ELECTRONICS INTL CO., LIMITED
    SENICO ELECTRONICS INTL CO., LIMITED

    IC Sockets

    Manufacturer Series Packaging Product Status Type Number of Positions or Pins (Grid) Pitch - Mating Contact Finish - Mating Contact Finish Thickness - Mating Contact Material - Mating Mounting Type Features Termination Pitch - Post Contact Finish - Post Contact Finish Thickness - Post Contact Material - Post Housing Material Operating Temperature















































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































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    Photo Mfr. Part # Availability Price Quantity Datasheet RoHs Series Packaging Product Status Type Number of Positions or Pins (Grid) Pitch - Mating Contact Finish - Mating Contact Finish Thickness - Mating Contact Material - Mating Mounting Type Features Termination Pitch - Post Contact Finish - Post Contact Finish Thickness - Post Contact Material - Post Housing Material Operating Temperature
    04-0508-21

    04-0508-21

    CONN SOCKET SIP 4POS GOLD

    Aries Electronics

    2,845
    RFQ
    04-0508-21

    Datasheet

    04-0508-21 508 Bulk Active SIP 4 (1 x 4) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole - Wire Wrap - Gold 10.0µin (0.25µm) Brass Polyamide (PA46), Nylon 4/6 -55°C ~ 125°C
    04-0508-31

    04-0508-31

    CONN SOCKET SIP 4POS GOLD

    Aries Electronics

    4,204
    RFQ
    04-0508-31

    Datasheet

    04-0508-31 508 Bulk Active SIP 4 (1 x 4) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole - Wire Wrap - Gold 10.0µin (0.25µm) Brass Polyamide (PA46), Nylon 4/6 -55°C ~ 125°C
    04-1508-21

    04-1508-21

    CONN IC DIP SOCKET 4POS GOLD

    Aries Electronics

    4,489
    RFQ
    04-1508-21

    Datasheet

    04-1508-21 508 Bulk Active DIP, 0.2" (5.08mm) Row Spacing 4 (2 x 2) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Closed Frame Wire Wrap 0.100" (2.54mm) Gold 10.0µin (0.25µm) Brass Polyamide (PA46), Nylon 4/6 -55°C ~ 125°C
    04-1508-31

    04-1508-31

    CONN IC DIP SOCKET 4POS GOLD

    Aries Electronics

    4,832
    RFQ
    04-1508-31

    Datasheet

    04-1508-31 508 Bulk Active DIP, 0.2" (5.08mm) Row Spacing 4 (2 x 2) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Closed Frame Wire Wrap 0.100" (2.54mm) Gold 10.0µin (0.25µm) Brass Polyamide (PA46), Nylon 4/6 -55°C ~ 125°C
    116-83-318-41-004101

    116-83-318-41-004101

    CONN IC DIP SOCKET 18POS GOLD

    Preci-Dip

    2,696
    RFQ
    116-83-318-41-004101

    Datasheet

    116-83-318-41-004101 116 Bulk Active DIP, 0.3" (7.62mm) Row Spacing 18 (2 x 9) 0.100" (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Elevated, Open Frame Solder 0.100" (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
    16-0513-11H

    16-0513-11H

    CONN SOCKET SIP 16POS GOLD

    Aries Electronics

    2,983
    RFQ
    16-0513-11H

    Datasheet

    16-0513-11H 0513 Bulk Active SIP 16 (1 x 16) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole - Solder 0.100" (2.54mm) Gold 10.0µin (0.25µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled -
    IC-316-SGG

    IC-316-SGG

    CONN IC DIP SOCKET 16POS GOLD

    Samtec Inc.

    4,823
    RFQ
    IC-316-SGG

    Datasheet

    IC-316-SGG IC Bulk Obsolete DIP, 0.3" (7.62mm) Row Spacing 16 (2 x 8) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Gold 30.0µin (0.76µm) Phosphor Bronze Polyester, Glass Filled -55°C ~ 125°C
    APH-1004-T-T

    APH-1004-T-T

    APH-1004-T-T

    Samtec Inc.

    4,170
    RFQ

    -

    APH-1004-T-T * - Active - - - - - - - - - - - - - - -
    APH-1404-T-T

    APH-1404-T-T

    APH-1404-T-T

    Samtec Inc.

    4,379
    RFQ

    -

    APH-1404-T-T * - Active - - - - - - - - - - - - - - -
    APH-1504-T-T

    APH-1504-T-T

    APH-1504-T-T

    Samtec Inc.

    4,387
    RFQ

    -

    APH-1504-T-T * - Active - - - - - - - - - - - - - - -
    APH-0604-T-T

    APH-0604-T-T

    APH-0604-T-T

    Samtec Inc.

    3,798
    RFQ

    -

    APH-0604-T-T * - Active - - - - - - - - - - - - - - -
    APH-1604-T-T

    APH-1604-T-T

    APH-1604-T-T

    Samtec Inc.

    3,830
    RFQ

    -

    APH-1604-T-T * - Active - - - - - - - - - - - - - - -
    APH-0204-T-T

    APH-0204-T-T

    APH-0204-T-T

    Samtec Inc.

    2,756
    RFQ

    -

    APH-0204-T-T * - Active - - - - - - - - - - - - - - -
    APH-0804-T-T

    APH-0804-T-T

    APH-0804-T-T

    Samtec Inc.

    3,290
    RFQ

    -

    APH-0804-T-T * - Active - - - - - - - - - - - - - - -
    APH-1804-T-T

    APH-1804-T-T

    APH-1804-T-T

    Samtec Inc.

    3,181
    RFQ

    -

    APH-1804-T-T * - Active - - - - - - - - - - - - - - -
    116-87-420-41-004101

    116-87-420-41-004101

    CONN IC DIP SOCKET 20POS GOLD

    Preci-Dip

    4,035
    RFQ
    116-87-420-41-004101

    Datasheet

    116-87-420-41-004101 116 Bulk Active DIP, 0.4" (10.16mm) Row Spacing 20 (2 x 10) 0.100" (2.54mm) Gold Flash Beryllium Copper Through Hole Elevated, Open Frame Solder 0.100" (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
    ICO-316-NTT

    ICO-316-NTT

    .100" LOW PROFILE SCREW MACHINE

    Samtec Inc.

    2,632
    RFQ
    ICO-316-NTT

    Datasheet

    ICO-316-NTT ICO Tube Active DIP, 0.3" (7.62mm) Row Spacing 16 (2 x 8) 0.100" (2.54mm) Tin - Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Tin - Brass Polyester, Glass Filled -55°C ~ 105°C
    2-1437542-9

    2-1437542-9

    CONN IC DIP SOCKET 20POS GOLD

    TE Connectivity AMP Connectors

    2,056
    RFQ
    2-1437542-9

    Datasheet

    2-1437542-9 700 - Obsolete DIP, 0.3" (7.62mm) Row Spacing 20 (2 x 10) 0.100" (2.54mm) Gold 20.0µin (0.51µm) Beryllium Copper Through Hole Carrier, Closed Frame Solder 0.100" (2.54mm) Gold 20.0µin (0.51µm) Beryllium Copper Aluminum Alloy -55°C ~ 125°C
    121-83-628-41-001101

    121-83-628-41-001101

    CONN IC DIP SOCKET 28POS GOLD

    Preci-Dip

    3,382
    RFQ
    121-83-628-41-001101

    Datasheet

    121-83-628-41-001101 121 Bulk Active DIP, 0.6" (15.24mm) Row Spacing 28 (2 x 14) 0.100" (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Open Frame Wire Wrap 0.100" (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
    614-87-640-31-012101

    614-87-640-31-012101

    CONN IC DIP SOCKET 40POS GOLD

    Preci-Dip

    2,741
    RFQ
    614-87-640-31-012101

    Datasheet

    614-87-640-31-012101 614 Bulk Active DIP, 0.6" (15.24mm) Row Spacing 40 (2 x 20) 0.100" (2.54mm) Gold Flash Beryllium Copper Through Hole Carrier, Open Frame Solder 0.100" (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
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