Photo | Mfr. Part # | Availability | Quantity | Datasheet | RoHs | Series | Packaging | Product Status | Type | Number of Positions or Pins (Grid) | Pitch - Mating | Contact Finish - Mating | Contact Finish Thickness - Mating | Contact Material - Mating | Mounting Type | Features | Termination | Pitch - Post | Contact Finish - Post | Contact Finish Thickness - Post | Contact Material - Post | Housing Material | Operating Temperature |
---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
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04-0508-21CONN SOCKET SIP 4POS GOLD |
2,845 |
|
![]() Datasheet |
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508 | Bulk | Active | SIP | 4 (1 x 4) | 0.100" (2.54mm) | Gold | 10.0µin (0.25µm) | Beryllium Copper | Through Hole | - | Wire Wrap | - | Gold | 10.0µin (0.25µm) | Brass | Polyamide (PA46), Nylon 4/6 | -55°C ~ 125°C |
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04-0508-31CONN SOCKET SIP 4POS GOLD |
4,204 |
|
![]() Datasheet |
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508 | Bulk | Active | SIP | 4 (1 x 4) | 0.100" (2.54mm) | Gold | 10.0µin (0.25µm) | Beryllium Copper | Through Hole | - | Wire Wrap | - | Gold | 10.0µin (0.25µm) | Brass | Polyamide (PA46), Nylon 4/6 | -55°C ~ 125°C |
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04-1508-21CONN IC DIP SOCKET 4POS GOLD |
4,489 |
|
![]() Datasheet |
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508 | Bulk | Active | DIP, 0.2" (5.08mm) Row Spacing | 4 (2 x 2) | 0.100" (2.54mm) | Gold | 10.0µin (0.25µm) | Beryllium Copper | Through Hole | Closed Frame | Wire Wrap | 0.100" (2.54mm) | Gold | 10.0µin (0.25µm) | Brass | Polyamide (PA46), Nylon 4/6 | -55°C ~ 125°C |
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04-1508-31CONN IC DIP SOCKET 4POS GOLD |
4,832 |
|
![]() Datasheet |
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508 | Bulk | Active | DIP, 0.2" (5.08mm) Row Spacing | 4 (2 x 2) | 0.100" (2.54mm) | Gold | 10.0µin (0.25µm) | Beryllium Copper | Through Hole | Closed Frame | Wire Wrap | 0.100" (2.54mm) | Gold | 10.0µin (0.25µm) | Brass | Polyamide (PA46), Nylon 4/6 | -55°C ~ 125°C |
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116-83-318-41-004101CONN IC DIP SOCKET 18POS GOLD |
2,696 |
|
![]() Datasheet |
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116 | Bulk | Active | DIP, 0.3" (7.62mm) Row Spacing | 18 (2 x 9) | 0.100" (2.54mm) | Gold | 29.5µin (0.75µm) | Beryllium Copper | Through Hole | Elevated, Open Frame | Solder | 0.100" (2.54mm) | Tin | - | Brass | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled | -55°C ~ 125°C |
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16-0513-11HCONN SOCKET SIP 16POS GOLD |
2,983 |
|
![]() Datasheet |
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0513 | Bulk | Active | SIP | 16 (1 x 16) | 0.100" (2.54mm) | Gold | 10.0µin (0.25µm) | Beryllium Copper | Through Hole | - | Solder | 0.100" (2.54mm) | Gold | 10.0µin (0.25µm) | Brass | Polyamide (PA46), Nylon 4/6, Glass Filled | - |
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IC-316-SGGCONN IC DIP SOCKET 16POS GOLD |
4,823 |
|
![]() Datasheet |
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IC | Bulk | Obsolete | DIP, 0.3" (7.62mm) Row Spacing | 16 (2 x 8) | 0.100" (2.54mm) | Gold | 30.0µin (0.76µm) | Beryllium Copper | Through Hole | Open Frame | Solder | 0.100" (2.54mm) | Gold | 30.0µin (0.76µm) | Phosphor Bronze | Polyester, Glass Filled | -55°C ~ 125°C |
|
APH-1004-T-TAPH-1004-T-T |
4,170 |
|
- |
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* | - | Active | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - |
|
APH-1404-T-TAPH-1404-T-T |
4,379 |
|
- |
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* | - | Active | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - |
|
APH-1504-T-TAPH-1504-T-T |
4,387 |
|
- |
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* | - | Active | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - |
|
APH-0604-T-TAPH-0604-T-T |
3,798 |
|
- |
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* | - | Active | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - |
|
APH-1604-T-TAPH-1604-T-T |
3,830 |
|
- |
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* | - | Active | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - |
|
APH-0204-T-TAPH-0204-T-T |
2,756 |
|
- |
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* | - | Active | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - |
|
APH-0804-T-TAPH-0804-T-T |
3,290 |
|
- |
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* | - | Active | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - |
|
APH-1804-T-TAPH-1804-T-T |
3,181 |
|
- |
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* | - | Active | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - |
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116-87-420-41-004101CONN IC DIP SOCKET 20POS GOLD |
4,035 |
|
![]() Datasheet |
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116 | Bulk | Active | DIP, 0.4" (10.16mm) Row Spacing | 20 (2 x 10) | 0.100" (2.54mm) | Gold | Flash | Beryllium Copper | Through Hole | Elevated, Open Frame | Solder | 0.100" (2.54mm) | Tin | - | Brass | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled | -55°C ~ 125°C |
|
ICO-316-NTT.100" LOW PROFILE SCREW MACHINE |
2,632 |
|
![]() Datasheet |
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ICO | Tube | Active | DIP, 0.3" (7.62mm) Row Spacing | 16 (2 x 8) | 0.100" (2.54mm) | Tin | - | Beryllium Copper | Through Hole | Open Frame | Solder | 0.100" (2.54mm) | Tin | - | Brass | Polyester, Glass Filled | -55°C ~ 105°C |
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2-1437542-9CONN IC DIP SOCKET 20POS GOLD |
2,056 |
|
![]() Datasheet |
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700 | - | Obsolete | DIP, 0.3" (7.62mm) Row Spacing | 20 (2 x 10) | 0.100" (2.54mm) | Gold | 20.0µin (0.51µm) | Beryllium Copper | Through Hole | Carrier, Closed Frame | Solder | 0.100" (2.54mm) | Gold | 20.0µin (0.51µm) | Beryllium Copper | Aluminum Alloy | -55°C ~ 125°C |
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121-83-628-41-001101CONN IC DIP SOCKET 28POS GOLD |
3,382 |
|
![]() Datasheet |
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121 | Bulk | Active | DIP, 0.6" (15.24mm) Row Spacing | 28 (2 x 14) | 0.100" (2.54mm) | Gold | 29.5µin (0.75µm) | Beryllium Copper | Through Hole | Open Frame | Wire Wrap | 0.100" (2.54mm) | Tin | - | Brass | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled | -55°C ~ 125°C |
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614-87-640-31-012101CONN IC DIP SOCKET 40POS GOLD |
2,741 |
|
![]() Datasheet |
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614 | Bulk | Active | DIP, 0.6" (15.24mm) Row Spacing | 40 (2 x 20) | 0.100" (2.54mm) | Gold | Flash | Beryllium Copper | Through Hole | Carrier, Open Frame | Solder | 0.100" (2.54mm) | Tin | - | Brass | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled | -55°C ~ 125°C |