Available 24/7 at SENICO ELECTRONICS INTL CO., LIMITED
    SENICO ELECTRONICS INTL CO., LIMITED

    IC Sockets

    Manufacturer Series Packaging Product Status Type Number of Positions or Pins (Grid) Pitch - Mating Contact Finish - Mating Contact Finish Thickness - Mating Contact Material - Mating Mounting Type Features Termination Pitch - Post Contact Finish - Post Contact Finish Thickness - Post Contact Material - Post Housing Material Operating Temperature















































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































    Reset All
    Apply All
    Result:
    Photo Mfr. Part # Availability Price Quantity Datasheet RoHs Series Packaging Product Status Type Number of Positions or Pins (Grid) Pitch - Mating Contact Finish - Mating Contact Finish Thickness - Mating Contact Material - Mating Mounting Type Features Termination Pitch - Post Contact Finish - Post Contact Finish Thickness - Post Contact Material - Post Housing Material Operating Temperature
    39-0518-10T

    39-0518-10T

    CONN SOCKET SIP 39POS GOLD

    Aries Electronics

    4,462
    RFQ
    39-0518-10T

    Datasheet

    39-0518-10T 518 Bulk Active SIP 39 (1 x 39) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled -
    14-3518-101H

    14-3518-101H

    CONN IC DIP SOCKET 14POS GOLD

    Aries Electronics

    3,795
    RFQ
    14-3518-101H

    Datasheet

    14-3518-101H 518 Bulk Active DIP, 0.3" (7.62mm) Row Spacing 14 (2 x 7) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled -
    116-87-642-41-006101

    116-87-642-41-006101

    CONN IC DIP SOCKET 42POS GOLD

    Preci-Dip

    3,587
    RFQ
    116-87-642-41-006101

    Datasheet

    116-87-642-41-006101 116 Bulk Active DIP, 0.6" (15.24mm) Row Spacing 42 (2 x 21) 0.100" (2.54mm) Gold Flash Beryllium Copper Through Hole Elevated, Open Frame Solder 0.100" (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
    116-83-432-41-018101

    116-83-432-41-018101

    CONN IC DIP SOCKET 32POS GOLD

    Preci-Dip

    4,553
    RFQ
    116-83-432-41-018101

    Datasheet

    116-83-432-41-018101 116 Bulk Active DIP, 0.4" (10.16mm) Row Spacing 32 (2 x 16) 0.100" (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Elevated, Open Frame Solder 0.100" (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
    ICA-308-ZWGT-3

    ICA-308-ZWGT-3

    .100" SCREW MACHINE DIP SOCKET

    Samtec Inc.

    4,002
    RFQ
    ICA-308-ZWGT-3

    Datasheet

    ICA-308-ZWGT-3 ICA Tube Active DIP, 0.3" (7.62mm) Row Spacing 8 (2 x 4) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Tin 10.0µin (0.25µm) Brass Polyester, Glass Filled -55°C ~ 125°C
    ICA-422-ZSTT

    ICA-422-ZSTT

    .100" SCREW MACHINE DIP SOCKET

    Samtec Inc.

    4,354
    RFQ
    ICA-422-ZSTT

    Datasheet

    ICA-422-ZSTT ICA Tube Active DIP, 0.4" (10.16mm) Row Spacing 22 (2 x 11) 0.100" (2.54mm) Tin - Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Tin - Brass Polyester, Glass Filled -55°C ~ 105°C
    614-83-632-31-012101

    614-83-632-31-012101

    CONN IC DIP SOCKET 32POS GOLD

    Preci-Dip

    4,763
    RFQ
    614-83-632-31-012101

    Datasheet

    614-83-632-31-012101 614 Bulk Active DIP, 0.6" (15.24mm) Row Spacing 32 (2 x 16) 0.100" (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Carrier, Open Frame Solder 0.100" (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
    510-87-101-13-001101

    510-87-101-13-001101

    CONN SOCKET PGA 101POS GOLD

    Preci-Dip

    2,754
    RFQ
    510-87-101-13-001101

    Datasheet

    510-87-101-13-001101 510 Bulk Active PGA 101 (13 x 13) 0.100" (2.54mm) Gold Flash Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
    510-87-101-13-061101

    510-87-101-13-061101

    CONN SOCKET PGA 101POS GOLD

    Preci-Dip

    3,480
    RFQ
    510-87-101-13-061101

    Datasheet

    510-87-101-13-061101 510 Bulk Active PGA 101 (13 x 13) 0.100" (2.54mm) Gold Flash Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
    528-AG11D-ESL

    528-AG11D-ESL

    CONN IC DIP SOCKET 28POS GOLD

    TE Connectivity AMP Connectors

    4,138
    RFQ
    528-AG11D-ESL

    Datasheet

    528-AG11D-ESL 500 Bulk Obsolete DIP, 0.6" (15.24mm) Row Spacing 28 (2 x 14) 0.100" (2.54mm) Gold 5.00µin (0.127µm) Beryllium Copper Through Hole Closed Frame Solder 0.100" (2.54mm) Tin-Lead 5.00µin (0.127µm) Brass, Copper Polyester -55°C ~ 125°C
    10-3513-10H

    10-3513-10H

    CONN IC DIP SOCKET 10POS GOLD

    Aries Electronics

    2,251
    RFQ
    10-3513-10H

    Datasheet

    10-3513-10H Lo-PRO®file, 513 Bulk Active DIP, 0.3" (7.62mm) Row Spacing 10 (2 x 5) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Closed Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled -55°C ~ 105°C
    110-83-650-41-001101

    110-83-650-41-001101

    CONN IC DIP SOCKET 50POS GOLD

    Preci-Dip

    2,839
    RFQ
    110-83-650-41-001101

    Datasheet

    110-83-650-41-001101 110 Bulk Active DIP, 0.6" (15.24mm) Row Spacing 50 (2 x 25) 0.100" (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
    116-83-428-41-012101

    116-83-428-41-012101

    CONN IC DIP SOCKET 28POS GOLD

    Preci-Dip

    2,442
    RFQ
    116-83-428-41-012101

    Datasheet

    116-83-428-41-012101 116 Bulk Active DIP, 0.4" (10.16mm) Row Spacing 28 (2 x 14) 0.100" (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Elevated, Open Frame Solder 0.100" (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
    26-3513-10

    26-3513-10

    CONN IC DIP SOCKET 26POS GOLD

    Aries Electronics

    4,691
    RFQ
    26-3513-10

    Datasheet

    26-3513-10 Lo-PRO®file, 513 Bulk Active DIP, 0.3" (7.62mm) Row Spacing 26 (2 x 13) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Closed Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled -55°C ~ 105°C
    08-6503-30

    08-6503-30

    CONN IC DIP SOCKET 8POS GOLD

    Aries Electronics

    2,133
    RFQ
    08-6503-30

    Datasheet

    08-6503-30 503 Bulk Active DIP, 0.6" (15.24mm) Row Spacing 8 (2 x 4) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Closed Frame Wire Wrap 0.100" (2.54mm) Tin 200.0µin (5.08µm) Phosphor Bronze Polyamide (PA46), Nylon 4/6, Glass Filled -55°C ~ 105°C
    19-0513-11

    19-0513-11

    CONN SOCKET SIP 19POS GOLD

    Aries Electronics

    3,590
    RFQ
    19-0513-11

    Datasheet

    19-0513-11 0513 Bulk Active SIP 19 (1 x 19) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole - Solder 0.100" (2.54mm) Gold 10.0µin (0.25µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled -
    36-0518-10H

    36-0518-10H

    CONN SOCKET SIP 36POS GOLD

    Aries Electronics

    3,552
    RFQ
    36-0518-10H

    Datasheet

    36-0518-10H 518 Bulk Active SIP 36 (1 x 36) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled -
    36-1518-10H

    36-1518-10H

    CONN IC DIP SOCKET 36POS GOLD

    Aries Electronics

    4,991
    RFQ
    36-1518-10H

    Datasheet

    36-1518-10H 518 Bulk Active DIP, 0.2" (5.08mm) Row Spacing 36 (2 x 18) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled -
    115-83-640-41-001101

    115-83-640-41-001101

    CONN IC DIP SOCKET 40POS GOLD

    Preci-Dip

    3,301
    RFQ

    -

    115-83-640-41-001101 115 Bulk Active DIP, 0.6" (15.24mm) Row Spacing 40 (2 x 20) 0.100" (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
    116-83-624-41-008101

    116-83-624-41-008101

    CONN IC DIP SOCKET 24POS GOLD

    Preci-Dip

    2,531
    RFQ
    116-83-624-41-008101

    Datasheet

    116-83-624-41-008101 116 Bulk Active DIP, 0.6" (15.24mm) Row Spacing 24 (2 x 12) 0.100" (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Elevated, Open Frame Solder 0.100" (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
    Total 19086 Record«Prev1... 230231232233234235236237...955Next»
    HOME

    HOME

    PRODUCT

    PRODUCT

    PHONE

    PHONE

    USER

    USER