Available 24/7 at SENICO ELECTRONICS INTL CO., LIMITED
    SENICO ELECTRONICS INTL CO., LIMITED

    IC Sockets

    Manufacturer Series Packaging Product Status Type Number of Positions or Pins (Grid) Pitch - Mating Contact Finish - Mating Contact Finish Thickness - Mating Contact Material - Mating Mounting Type Features Termination Pitch - Post Contact Finish - Post Contact Finish Thickness - Post Contact Material - Post Housing Material Operating Temperature















































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































    Reset All
    Apply All
    Result:
    Photo Mfr. Part # Availability Price Quantity Datasheet RoHs Series Packaging Product Status Type Number of Positions or Pins (Grid) Pitch - Mating Contact Finish - Mating Contact Finish Thickness - Mating Contact Material - Mating Mounting Type Features Termination Pitch - Post Contact Finish - Post Contact Finish Thickness - Post Contact Material - Post Housing Material Operating Temperature
    117-43-620-41-005000

    117-43-620-41-005000

    CONN IC DIP SOCKET 20POS GOLD

    Mill-Max Manufacturing Corp.

    2,586
    RFQ
    117-43-620-41-005000

    Datasheet

    117-43-620-41-005000 117 Tube Active DIP, 0.6" (15.24mm) Row Spacing 20 (2 x 10) 0.070" (1.78mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame Solder 0.070" (1.78mm) Tin 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
    APO-320-T-J

    APO-320-T-J

    .100" LOW PROFILE SCREW MACHINE

    Samtec Inc.

    2,935
    RFQ
    APO-320-T-J

    Datasheet

    APO-320-T-J APO Tube Active DIP, 0.3" (7.62mm) Row Spacing 20 (2 x 10) 0.100" (2.54mm) Tin - Phosphor Bronze Through Hole Open Frame Solder 0.100" (2.54mm) Tin - Phosphor Bronze Polybutylene Terephthalate (PBT), Glass Filled -
    APO-308-T-R

    APO-308-T-R

    .100" LOW PROFILE SCREW MACHINE

    Samtec Inc.

    4,920
    RFQ
    APO-308-T-R

    Datasheet

    APO-308-T-R APO Bulk Active DIP, 0.3" (7.62mm) Row Spacing 8 (2 x 4) 0.100" (2.54mm) Tin - Phosphor Bronze Through Hole Open Frame Solder 0.100" (2.54mm) Tin - Phosphor Bronze Polybutylene Terephthalate (PBT), Glass Filled -
    30-0518-10T

    30-0518-10T

    CONN SOCKET SIP 30POS GOLD

    Aries Electronics

    4,797
    RFQ
    30-0518-10T

    Datasheet

    30-0518-10T 518 Bulk Active SIP 30 (1 x 30) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled -
    HLS-0108-G-22

    HLS-0108-G-22

    .100" SCREW MACHINE SOCKET ARRAY

    Samtec Inc.

    4,224
    RFQ
    HLS-0108-G-22

    Datasheet

    HLS-0108-G-22 HLS Tube Active SIP 8 (1 x 8) 0.100" (2.54mm) Gold 30.0µin (0.76µm) - Through Hole Closed Frame Solder 0.100" (2.54mm) Gold 10.0µin (0.25µm) - Thermoplastic -55°C ~ 140°C
    110-83-652-41-001101

    110-83-652-41-001101

    CONN IC DIP SOCKET 52POS GOLD

    Preci-Dip

    4,731
    RFQ
    110-83-652-41-001101

    Datasheet

    110-83-652-41-001101 110 Bulk Active DIP, 0.6" (15.24mm) Row Spacing 52 (2 x 26) 0.100" (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
    117-83-430-41-105101

    117-83-430-41-105101

    CONN IC DIP SOCKET 30POS GOLD

    Preci-Dip

    2,984
    RFQ
    117-83-430-41-105101

    Datasheet

    117-83-430-41-105101 117 Bulk Active DIP, 0.4" (10.16mm) Row Spacing 30 (2 x 15) 0.070" (1.78mm) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Open Frame Solder 0.070" (1.78mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
    ICA-628-ZSTT

    ICA-628-ZSTT

    .100" SCREW MACHINE DIP SOCKET

    Samtec Inc.

    4,722
    RFQ
    ICA-628-ZSTT

    Datasheet

    ICA-628-ZSTT ICA Tube Active DIP, 0.6" (15.24mm) Row Spacing 28 (2 x 14) 0.100" (2.54mm) Tin - Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Tin - Brass Polyester, Glass Filled -55°C ~ 105°C
    ICO-308-ZNGT

    ICO-308-ZNGT

    .100" LOW PROFILE SCREW MACHINE

    Samtec Inc.

    3,663
    RFQ
    ICO-308-ZNGT

    Datasheet

    ICO-308-ZNGT ICO Tube Active DIP, 0.3" (7.62mm) Row Spacing 8 (2 x 4) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Tin 10.0µin (0.25µm) Brass Polyester, Glass Filled -55°C ~ 125°C
    20-6513-11

    20-6513-11

    CONN IC DIP SOCKET 20POS GOLD

    Aries Electronics

    2,147
    RFQ
    20-6513-11

    Datasheet

    20-6513-11 Lo-PRO®file, 513 Bulk Active DIP, 0.6" (15.24mm) Row Spacing 20 (2 x 10) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Closed Frame Solder 0.100" (2.54mm) Gold 10.0µin (0.25µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled -55°C ~ 105°C
    20-0513-11

    20-0513-11

    CONN SOCKET SIP 20POS GOLD

    Aries Electronics

    3,746
    RFQ
    20-0513-11

    Datasheet

    20-0513-11 0513 Bulk Active SIP 20 (1 x 20) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole - Solder 0.100" (2.54mm) Gold 10.0µin (0.25µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled -
    23-0513-10H

    23-0513-10H

    CONN SOCKET SIP 23POS GOLD

    Aries Electronics

    4,288
    RFQ
    23-0513-10H

    Datasheet

    23-0513-10H 0513 Bulk Active SIP 23 (1 x 23) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole - Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled -
    20-4518-10M

    20-4518-10M

    CONN IC DIP SOCKET 20POS GOLD

    Aries Electronics

    2,203
    RFQ
    20-4518-10M

    Datasheet

    20-4518-10M 518 Bulk Active DIP, 0.4" (10.16mm) Row Spacing 20 (2 x 10) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled -
    38-0518-10H

    38-0518-10H

    CONN SOCKET SIP 38POS GOLD

    Aries Electronics

    2,151
    RFQ
    38-0518-10H

    Datasheet

    38-0518-10H 518 Bulk Active SIP 38 (1 x 38) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled -
    38-1518-10H

    38-1518-10H

    CONN IC DIP SOCKET 38POS GOLD

    Aries Electronics

    2,142
    RFQ
    38-1518-10H

    Datasheet

    38-1518-10H 518 Bulk Active DIP, 0.2" (5.08mm) Row Spacing 38 (2 x 19) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled -
    510-87-108-12-051101

    510-87-108-12-051101

    CONN SOCKET PGA 108POS GOLD

    Preci-Dip

    2,260
    RFQ
    510-87-108-12-051101

    Datasheet

    510-87-108-12-051101 510 Bulk Active PGA 108 (12 x 12) 0.100" (2.54mm) Gold Flash Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
    HLS-0106-G-32

    HLS-0106-G-32

    .100" SCREW MACHINE SOCKET ARRAY

    Samtec Inc.

    2,870
    RFQ
    HLS-0106-G-32

    Datasheet

    HLS-0106-G-32 HLS Tube Active SIP 6 (1 x 6) 0.100" (2.54mm) Gold 30.0µin (0.76µm) - Through Hole Closed Frame Solder 0.100" (2.54mm) Gold 10.0µin (0.25µm) - Thermoplastic -55°C ~ 140°C
    116-87-632-41-007101

    116-87-632-41-007101

    CONN IC DIP SOCKET 32POS GOLD

    Preci-Dip

    2,573
    RFQ
    116-87-632-41-007101

    Datasheet

    116-87-632-41-007101 116 Bulk Active DIP, 0.6" (15.24mm) Row Spacing 32 (2 x 16) 0.100" (2.54mm) Gold Flash Beryllium Copper Through Hole Elevated, Open Frame Solder 0.100" (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
    PLCC-052-T-N

    PLCC-052-T-N

    CONN SOCKET PLCC 52POS TIN

    Samtec Inc.

    2,256
    RFQ
    PLCC-052-T-N

    Datasheet

    PLCC-052-T-N PLCC Tube Obsolete PLCC 52 (4 x 13) 0.050" (1.27mm) Tin - Beryllium Copper Surface Mount Closed Frame Solder 0.100" (2.54mm) Tin - Beryllium Copper Liquid Crystal Polymer (LCP) -55°C ~ 125°C
    APA-320-T-J

    APA-320-T-J

    ADAPTER PLUG

    Samtec Inc.

    4,557
    RFQ
    APA-320-T-J

    Datasheet

    APA-320-T-J APA Tube Active - 20 (2 x 10) 0.100" (2.54mm) Tin - Phosphor Bronze Through Hole Open Frame Solder 0.100" (2.54mm) Tin - Phosphor Bronze Polybutylene Terephthalate (PBT), Glass Filled -
    Total 19086 Record«Prev1... 238239240241242243244245...955Next»
    HOME

    HOME

    PRODUCT

    PRODUCT

    PHONE

    PHONE

    USER

    USER