Available 24/7 at SENICO ELECTRONICS INTL CO., LIMITED
    SENICO ELECTRONICS INTL CO., LIMITED

    IC Sockets

    Manufacturer Series Packaging Product Status Type Number of Positions or Pins (Grid) Pitch - Mating Contact Finish - Mating Contact Finish Thickness - Mating Contact Material - Mating Mounting Type Features Termination Pitch - Post Contact Finish - Post Contact Finish Thickness - Post Contact Material - Post Housing Material Operating Temperature















































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































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    Photo Mfr. Part # Availability Price Quantity Datasheet RoHs Series Packaging Product Status Type Number of Positions or Pins (Grid) Pitch - Mating Contact Finish - Mating Contact Finish Thickness - Mating Contact Material - Mating Mounting Type Features Termination Pitch - Post Contact Finish - Post Contact Finish Thickness - Post Contact Material - Post Housing Material Operating Temperature
    AR 52-HZL/07-TT

    AR 52-HZL/07-TT

    SOCKET

    Assmann WSW Components

    2,761
    RFQ

    -

    AR 52-HZL/07-TT AR Bulk Active DIP, 0.9" (22.86mm) Row Spacing 52 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Polybutylene Terephthalate (PBT), Glass Filled -40°C ~ 105°C
    214-44-314-01-670799

    214-44-314-01-670799

    STANDRD SOLDER TAIL DIP SOCKET

    Mill-Max Manufacturing Corp.

    2,594
    RFQ

    -

    214-44-314-01-670799 214 Tape & Reel (TR) Active DIP, 0.3" (7.62mm) Row Spacing 14 (2 x 7) 0.100" (2.54mm) Tin 100.0µin (2.54µm) Beryllium Copper Surface Mount Closed Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Alloy Polyamide (PA46), Nylon 4/6 -55°C ~ 125°C
    214-99-314-01-670799

    214-99-314-01-670799

    STANDRD SOLDER TAIL DIP SOCKET

    Mill-Max Manufacturing Corp.

    2,688
    RFQ

    -

    214-99-314-01-670799 214 Tape & Reel (TR) Active DIP, 0.3" (7.62mm) Row Spacing 14 (2 x 7) 0.100" (2.54mm) Tin-Lead 100.0µin (2.54µm) Beryllium Copper Surface Mount Closed Frame Solder 0.100" (2.54mm) Tin-Lead 200.0µin (5.08µm) Brass Alloy Polyamide (PA46), Nylon 4/6 -55°C ~ 125°C
    20-3518-10M

    20-3518-10M

    CONN IC DIP SOCKET 20POS GOLD

    Aries Electronics

    3,655
    RFQ
    20-3518-10M

    Datasheet

    20-3518-10M 518 Bulk Active DIP, 0.3" (7.62mm) Row Spacing 20 (2 x 10) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled -
    612-83-432-41-001101

    612-83-432-41-001101

    CONN IC DIP SOCKET 32POS GOLD

    Preci-Dip

    2,214
    RFQ
    612-83-432-41-001101

    Datasheet

    612-83-432-41-001101 612 Bulk Active DIP, 0.4" (10.16mm) Row Spacing 32 (2 x 16) 0.100" (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Carrier, Open Frame Solder 0.100" (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
    510-87-107-12-051101

    510-87-107-12-051101

    CONN SOCKET PGA 107POS GOLD

    Preci-Dip

    4,102
    RFQ
    510-87-107-12-051101

    Datasheet

    510-87-107-12-051101 510 Bulk Active PGA 107 (12 x 12) 0.100" (2.54mm) Gold Flash Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
    117-83-648-41-005101

    117-83-648-41-005101

    CONN IC DIP SOCKET 48POS GOLD

    Preci-Dip

    2,873
    RFQ
    117-83-648-41-005101

    Datasheet

    117-83-648-41-005101 117 Bulk Active DIP, 0.6" (15.24mm) Row Spacing 48 (2 x 24) 0.070" (1.78mm) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Open Frame Solder 0.070" (1.78mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
    2134146-3

    2134146-3

    CONN SOCKET PGA 989POS GOLD

    TE Connectivity AMP Connectors

    3,055
    RFQ
    2134146-3

    Datasheet

    2134146-3 - Tape & Reel (TR) Obsolete PGA 989 (35 x 36) 0.157" (4.00mm) Gold Flash Copper Alloy Surface Mount Open Frame Solder 0.157" (4.00mm) Tin-Lead Flash Copper Alloy Thermoplastic -
    A-ICS-254-28-TT50

    A-ICS-254-28-TT50

    IC SOCKET, MACHINED PIN, 7.62MM,

    Assmann WSW Components

    4,656
    RFQ
    A-ICS-254-28-TT50

    Datasheet

    A-ICS-254-28-TT50 - Tube Active DIP, 0.3" (7.62mm) Row Spacing 28 0.100" (2.54mm) Nickel 78.7µin (2.00µm) Beryllium Copper Through Hole, Right Angle Open Frame Solder 0.100" (2.54mm) Tin 78.7µin (2.00µm) Brass Polybutylene Terephthalate (PBT), Glass Filled -40°C ~ 105°C
    116-83-328-41-007101

    116-83-328-41-007101

    CONN IC DIP SOCKET 28POS GOLD

    Preci-Dip

    3,118
    RFQ
    116-83-328-41-007101

    Datasheet

    116-83-328-41-007101 116 Bulk Active DIP, 0.3" (7.62mm) Row Spacing 28 (2 x 14) 0.100" (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Elevated, Open Frame Solder 0.100" (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
    04-0501-21

    04-0501-21

    CONN SOCKET SIP 4POS GOLD

    Aries Electronics

    2,622
    RFQ
    04-0501-21

    Datasheet

    04-0501-21 501 Bulk Active SIP 4 (1 x 4) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Phosphor Bronze Through Hole - Wire Wrap 0.100" (2.54mm) Gold 10.0µin (0.25µm) Phosphor Bronze Polyamide (PA46), Nylon 4/6, Glass Filled -55°C ~ 125°C
    04-0501-31

    04-0501-31

    CONN SOCKET SIP 4POS GOLD

    Aries Electronics

    4,751
    RFQ
    04-0501-31

    Datasheet

    04-0501-31 501 Bulk Active SIP 4 (1 x 4) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Phosphor Bronze Through Hole - Wire Wrap 0.100" (2.54mm) Gold 10.0µin (0.25µm) Phosphor Bronze Polyamide (PA46), Nylon 4/6, Glass Filled -55°C ~ 125°C
    20-3513-00

    20-3513-00

    CONN IC DIP SOCKET 20POS GOLD

    Aries Electronics

    4,895
    RFQ
    20-3513-00

    Datasheet

    20-3513-00 Lo-PRO®file, 513 Bulk Active DIP, 0.3" (7.62mm) Row Spacing 20 (2 x 10) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Closed Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled -55°C ~ 105°C
    09-0503-30

    09-0503-30

    CONN SOCKET SIP 9POS GOLD

    Aries Electronics

    2,221
    RFQ
    09-0503-30

    Datasheet

    09-0503-30 0503 Bulk Active SIP 9 (1 x 9) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole - Wire Wrap 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Polyamide (PA), Nylon, Glass Filled -
    18-0518-11H

    18-0518-11H

    CONN SOCKET SIP 18POS GOLD

    Aries Electronics

    3,419
    RFQ
    18-0518-11H

    Datasheet

    18-0518-11H 518 Bulk Active SIP 18 (1 x 18) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Gold 10.0µin (0.25µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled -
    18-1518-11H

    18-1518-11H

    CONN IC DIP SOCKET 18POS GOLD

    Aries Electronics

    2,431
    RFQ
    18-1518-11H

    Datasheet

    18-1518-11H 518 Bulk Active DIP, 0.2" (5.08mm) Row Spacing 18 (2 x 9) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Gold 10.0µin (0.25µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled -
    11-0508-20

    11-0508-20

    CONN SOCKET SIP 11POS GOLD

    Aries Electronics

    2,896
    RFQ
    11-0508-20

    Datasheet

    11-0508-20 508 Bulk Active SIP 11 (1 x 11) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole - Wire Wrap - Tin 200.0µin (5.08µm) Brass Polyamide (PA46), Nylon 4/6 -55°C ~ 105°C
    11-0508-30

    11-0508-30

    CONN SOCKET SIP 11POS GOLD

    Aries Electronics

    2,187
    RFQ
    11-0508-30

    Datasheet

    11-0508-30 508 Bulk Active SIP 11 (1 x 11) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole - Wire Wrap - Tin 200.0µin (5.08µm) Brass Polyamide (PA46), Nylon 4/6 -55°C ~ 105°C
    16-3518-101H

    16-3518-101H

    CONN IC DIP SOCKET 16POS GOLD

    Aries Electronics

    3,244
    RFQ
    16-3518-101H

    Datasheet

    16-3518-101H 518 Bulk Active DIP, 0.3" (7.62mm) Row Spacing 16 (2 x 8) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled -
    117-93-620-41-005000

    117-93-620-41-005000

    CONN IC DIP SOCKET 20POS GOLD

    Mill-Max Manufacturing Corp.

    4,663
    RFQ
    117-93-620-41-005000

    Datasheet

    117-93-620-41-005000 117 Tube Active DIP, 0.6" (15.24mm) Row Spacing 20 (2 x 10) 0.070" (1.78mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame Solder 0.070" (1.78mm) Tin-Lead 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
    Total 19086 Record«Prev1... 237238239240241242243244...955Next»
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