Available 24/7 at SENICO ELECTRONICS INTL CO., LIMITED
    SENICO ELECTRONICS INTL CO., LIMITED

    IC Sockets

    Manufacturer Series Packaging Product Status Type Number of Positions or Pins (Grid) Pitch - Mating Contact Finish - Mating Contact Finish Thickness - Mating Contact Material - Mating Mounting Type Features Termination Pitch - Post Contact Finish - Post Contact Finish Thickness - Post Contact Material - Post Housing Material Operating Temperature















































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































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    Photo Mfr. Part # Availability Price Quantity Datasheet RoHs Series Packaging Product Status Type Number of Positions or Pins (Grid) Pitch - Mating Contact Finish - Mating Contact Finish Thickness - Mating Contact Material - Mating Mounting Type Features Termination Pitch - Post Contact Finish - Post Contact Finish Thickness - Post Contact Material - Post Housing Material Operating Temperature
    116-83-628-41-008101

    116-83-628-41-008101

    CONN IC DIP SOCKET 28POS GOLD

    Preci-Dip

    3,406
    RFQ
    116-83-628-41-008101

    Datasheet

    116-83-628-41-008101 116 Bulk Active DIP, 0.6" (15.24mm) Row Spacing 28 (2 x 14) 0.100" (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Elevated, Open Frame Solder 0.100" (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
    121-83-632-41-001101

    121-83-632-41-001101

    CONN IC DIP SOCKET 32POS GOLD

    Preci-Dip

    2,430
    RFQ
    121-83-632-41-001101

    Datasheet

    121-83-632-41-001101 121 Bulk Active DIP, 0.6" (15.24mm) Row Spacing 32 (2 x 16) 0.100" (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Open Frame Wire Wrap 0.100" (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
    4-1571551-9

    4-1571551-9

    CONN IC DIP SOCKET 28POS GOLD

    TE Connectivity AMP Connectors

    2,932
    RFQ
    4-1571551-9

    Datasheet

    4-1571551-9 500 Tube Obsolete DIP, 0.6" (15.24mm) Row Spacing 28 (2 x 14) 0.100" (2.54mm) Gold 25.0µin (0.63µm) Beryllium Copper Through Hole Closed Frame Solder 0.100" (2.54mm) Gold 25.0µin (0.63µm) Nickel Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
    14-8770-10WR

    14-8770-10WR

    CONN IC DIP SOCKET 14POS TIN

    Aries Electronics

    2,369
    RFQ
    14-8770-10WR

    Datasheet

    14-8770-10WR 8 Bulk Active DIP, 0.3" (7.62mm) Row Spacing 14 (2 x 7) 0.100" (2.54mm) Tin 200.0µin (5.08µm) Phosphor Bronze Through Hole Closed Frame, Elevated Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Phosphor Bronze Polyamide (PA46), Nylon 4/6, Glass Filled -55°C ~ 105°C
    14-8870-10WR

    14-8870-10WR

    CONN IC DIP SOCKET 14POS TIN

    Aries Electronics

    4,049
    RFQ
    14-8870-10WR

    Datasheet

    14-8870-10WR 8 Bulk Active DIP, 0.3" (7.62mm) Row Spacing 14 (2 x 7) 0.100" (2.54mm) Tin 200.0µin (5.08µm) Phosphor Bronze Through Hole Closed Frame, Elevated Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Phosphor Bronze Polyamide (PA46), Nylon 4/6, Glass Filled -55°C ~ 105°C
    25-0518-11

    25-0518-11

    CONN SOCKET SIP 25POS GOLD

    Aries Electronics

    2,141
    RFQ
    25-0518-11

    Datasheet

    25-0518-11 518 Bulk Active SIP 25 (1 x 25) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Gold 10.0µin (0.25µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled -
    110-83-642-41-105101

    110-83-642-41-105101

    CONN IC DIP SOCKET 42POS GOLD

    Preci-Dip

    2,553
    RFQ
    110-83-642-41-105101

    Datasheet

    110-83-642-41-105101 110 Bulk Active DIP, 0.6" (15.24mm) Row Spacing 42 (2 x 21) 0.100" (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Surface Mount Open Frame Solder 0.100" (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
    116-87-652-41-018101

    116-87-652-41-018101

    CONN IC DIP SOCKET 52POS GOLD

    Preci-Dip

    4,343
    RFQ
    116-87-652-41-018101

    Datasheet

    116-87-652-41-018101 116 Bulk Active DIP, 0.6" (15.24mm) Row Spacing 52 (2 x 26) 0.100" (2.54mm) Gold Flash Beryllium Copper Through Hole Elevated, Open Frame Solder 0.100" (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
    117-87-648-41-105101

    117-87-648-41-105101

    CONN IC DIP SOCKET 48POS GOLD

    Preci-Dip

    3,059
    RFQ
    117-87-648-41-105101

    Datasheet

    117-87-648-41-105101 117 Bulk Active DIP, 0.6" (15.24mm) Row Spacing 48 (2 x 24) 0.070" (1.78mm) Gold Flash Beryllium Copper Through Hole Open Frame Solder 0.070" (1.78mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
    510-87-120-13-001101

    510-87-120-13-001101

    CONN SOCKET PGA 120POS GOLD

    Preci-Dip

    3,263
    RFQ
    510-87-120-13-001101

    Datasheet

    510-87-120-13-001101 510 Bulk Active PGA 120 (13 x 13) 0.100" (2.54mm) Gold Flash Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
    510-87-120-13-061101

    510-87-120-13-061101

    CONN SOCKET PGA 120POS GOLD

    Preci-Dip

    2,138
    RFQ
    510-87-120-13-061101

    Datasheet

    510-87-120-13-061101 510 Bulk Active PGA 120 (13 x 13) 0.100" (2.54mm) Gold Flash Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
    ICA-316-ATT

    ICA-316-ATT

    .100" SCREW MACHINE DIP SOCKET

    Samtec Inc.

    4,899
    RFQ
    ICA-316-ATT

    Datasheet

    ICA-316-ATT ICA Tube Active DIP, 0.3" (7.62mm) Row Spacing 16 (2 x 8) 0.100" (2.54mm) Tin - Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Tin - Brass Polyester, Glass Filled -55°C ~ 105°C
    ICO-316-ATT

    ICO-316-ATT

    .100" LOW PROFILE SCREW MACHINE

    Samtec Inc.

    4,086
    RFQ
    ICO-316-ATT

    Datasheet

    ICO-316-ATT ICO Tube Active DIP, 0.3" (7.62mm) Row Spacing 16 (2 x 8) 0.100" (2.54mm) Tin - Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Tin - Brass Polyester, Glass Filled -55°C ~ 105°C
    ICA-308-ZSGG-L

    ICA-308-ZSGG-L

    .100" SCREW MACHINE DIP SOCKET

    Samtec Inc.

    3,731
    RFQ
    ICA-308-ZSGG-L

    Datasheet

    ICA-308-ZSGG-L ICA Tube Active DIP, 0.3" (7.62mm) Row Spacing 8 (2 x 4) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Gold 30.0µin (0.76µm) Brass Polyester, Glass Filled -55°C ~ 125°C
    3-1571586-0

    3-1571586-0

    CONN IC DIP SOCKET 32POS GOLD

    TE Connectivity AMP Connectors

    4,396
    RFQ
    3-1571586-0

    Datasheet

    3-1571586-0 800 Tube Obsolete DIP, 0.6" (15.24mm) Row Spacing 32 (2 x 16) 0.100" (2.54mm) Gold 25.0µin (0.63µm) Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Gold 25.0µin (0.63µm) Copper Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 105°C
    299-83-612-10-002101

    299-83-612-10-002101

    CONN IC DIP SOCKET 12POS GOLD

    Preci-Dip

    2,789
    RFQ
    299-83-612-10-002101

    Datasheet

    299-83-612-10-002101 299 Bulk Active DIP, 0.6" (15.24mm) Row Spacing 12 (2 x 6) 0.100" (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole, Right Angle, Horizontal Closed Frame Solder 0.100" (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
    ICF-314-TL-O

    ICF-314-TL-O

    .100" SURFACE MOUNT SCREW MACHIN

    Samtec Inc.

    4,753
    RFQ
    ICF-314-TL-O

    Datasheet

    ICF-314-TL-O ICF Bulk Active DIP, 0.3" (7.62mm) Row Spacing 14 (2 x 7) 0.100" (2.54mm) Tin - Beryllium Copper Surface Mount Open Frame Solder 0.100" (2.54mm) Tin - Beryllium Copper Liquid Crystal Polymer (LCP) -55°C ~ 125°C
    3-1437536-8

    3-1437536-8

    CONN IC DIP SOCKET 24POS GOLD

    TE Connectivity AMP Connectors

    4,403
    RFQ
    3-1437536-8

    Datasheet

    3-1437536-8 500 Tube Obsolete DIP, 0.6" (15.24mm) Row Spacing 24 (2 x 12) 0.100" (2.54mm) Gold - Beryllium Copper Through Hole Closed Frame Solder 0.100" (2.54mm) - - Brass - -55°C ~ 125°C
    1-1571995-2

    1-1571995-2

    CONN SOCKET SIP 12POS GOLD

    TE Connectivity AMP Connectors

    2,756
    RFQ
    1-1571995-2

    Datasheet

    1-1571995-2 - Bulk Obsolete SIP 12 (1 x 12) 0.100" (2.54mm) Gold 20.0µin (0.51µm) Beryllium Copper Through Hole Closed Frame Solder 0.100" (2.54mm) Tin 20.0µin (0.51µm) Copper Thermoplastic, Polyester -
    31-0518-10H

    31-0518-10H

    CONN SOCKET SIP 31POS GOLD

    Aries Electronics

    4,567
    RFQ
    31-0518-10H

    Datasheet

    31-0518-10H 518 Bulk Active SIP 31 (1 x 31) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled -
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