Available 24/7 at SENICO ELECTRONICS INTL CO., LIMITED
    SENICO ELECTRONICS INTL CO., LIMITED

    IC Sockets

    Manufacturer Series Packaging Product Status Type Number of Positions or Pins (Grid) Pitch - Mating Contact Finish - Mating Contact Finish Thickness - Mating Contact Material - Mating Mounting Type Features Termination Pitch - Post Contact Finish - Post Contact Finish Thickness - Post Contact Material - Post Housing Material Operating Temperature















































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































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    Photo Mfr. Part # Availability Price Quantity Datasheet RoHs Series Packaging Product Status Type Number of Positions or Pins (Grid) Pitch - Mating Contact Finish - Mating Contact Finish Thickness - Mating Contact Material - Mating Mounting Type Features Termination Pitch - Post Contact Finish - Post Contact Finish Thickness - Post Contact Material - Post Housing Material Operating Temperature
    18-0518-00

    18-0518-00

    CONN SOCKET SIP 18POS GOLD

    Aries Electronics

    3,107
    RFQ
    18-0518-00

    Datasheet

    18-0518-00 518 Bulk Active SIP 18 (1 x 18) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Surface Mount Open Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled -
    18-1518-00

    18-1518-00

    CONN IC DIP SOCKET 18POS GOLD

    Aries Electronics

    3,544
    RFQ
    18-1518-00

    Datasheet

    18-1518-00 518 Bulk Active DIP, 0.2" (5.08mm) Row Spacing 18 (2 x 9) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Surface Mount Open Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled -
    HLS-0107-G-11

    HLS-0107-G-11

    .100" SCREW MACHINE SOCKET ARRAY

    Samtec Inc.

    3,400
    RFQ
    HLS-0107-G-11

    Datasheet

    HLS-0107-G-11 HLS Tube Active SIP 7 (1 x 7) 0.100" (2.54mm) Gold 30.0µin (0.76µm) - Through Hole Closed Frame Solder 0.100" (2.54mm) Gold 10.0µin (0.25µm) - Thermoplastic -55°C ~ 140°C
    HLS-0310-TT-2

    HLS-0310-TT-2

    .100" SCREW MACHINE SOCKET ARRAY

    Samtec Inc.

    4,369
    RFQ
    HLS-0310-TT-2

    Datasheet

    HLS-0310-TT-2 HLS Tube Active SIP 30 (3 x 10) 0.100" (2.54mm) Tin - - Through Hole Closed Frame Solder 0.100" (2.54mm) Tin - - Thermoplastic -55°C ~ 140°C
    121-83-432-41-001101

    121-83-432-41-001101

    CONN IC DIP SOCKET 32POS GOLD

    Preci-Dip

    3,647
    RFQ
    121-83-432-41-001101

    Datasheet

    121-83-432-41-001101 121 Bulk Active DIP, 0.4" (10.16mm) Row Spacing 32 (2 x 16) 0.100" (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Open Frame Wire Wrap 0.100" (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
    116-87-632-41-001101

    116-87-632-41-001101

    CONN IC DIP SOCKET 32POS GOLD

    Preci-Dip

    3,126
    RFQ
    116-87-632-41-001101

    Datasheet

    116-87-632-41-001101 116 Bulk Active DIP, 0.6" (15.24mm) Row Spacing 32 (2 x 16) 0.100" (2.54mm) Gold Flash Beryllium Copper Through Hole Elevated, Open Frame Solder 0.100" (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
    ICF-632-STL-I-TR

    ICF-632-STL-I-TR

    .100" SURFACE MOUNT SCREW MACHIN

    Samtec Inc.

    2,691
    RFQ
    ICF-632-STL-I-TR

    Datasheet

    ICF-632-STL-I-TR ICF Tape & Reel (TR) Active DIP, 0.6" (15.24mm) Row Spacing 32 (2 x 16) 0.100" (2.54mm) Tin - Beryllium Copper Surface Mount Open Frame Solder 0.100" (2.54mm) Tin - Beryllium Copper Liquid Crystal Polymer (LCP) -55°C ~ 125°C
    ICF-632-STL-O-TR

    ICF-632-STL-O-TR

    .100" SURFACE MOUNT SCREW MACHIN

    Samtec Inc.

    2,075
    RFQ
    ICF-632-STL-O-TR

    Datasheet

    ICF-632-STL-O-TR ICF Tape & Reel (TR) Active DIP, 0.6" (15.24mm) Row Spacing 32 (2 x 16) 0.100" (2.54mm) Tin - Beryllium Copper Surface Mount Open Frame Solder 0.100" (2.54mm) Tin - Beryllium Copper Liquid Crystal Polymer (LCP) -55°C ~ 125°C
    116-83-324-41-011101

    116-83-324-41-011101

    CONN IC DIP SOCKET 24POS GOLD

    Preci-Dip

    3,299
    RFQ
    116-83-324-41-011101

    Datasheet

    116-83-324-41-011101 116 Bulk Active DIP, 0.3" (7.62mm) Row Spacing 24 (2 x 12) 0.100" (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Elevated, Open Frame Solder 0.100" (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
    32-6513-10

    32-6513-10

    CONN IC DIP SOCKET 32POS GOLD

    Aries Electronics

    2,272
    RFQ
    32-6513-10

    Datasheet

    32-6513-10 Lo-PRO®file, 513 Bulk Active DIP, 0.6" (15.24mm) Row Spacing 32 (2 x 16) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Closed Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled -55°C ~ 105°C
    ICO-314-KGT

    ICO-314-KGT

    .100" LOW PROFILE SCREW MACHINE

    Samtec Inc.

    2,463
    RFQ
    ICO-314-KGT

    Datasheet

    ICO-314-KGT ICO Tube Active DIP, 0.3" (7.62mm) Row Spacing 14 (2 x 7) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Tin 10.0µin (0.25µm) Brass Polyester, Glass Filled -55°C ~ 125°C
    116-87-650-41-003101

    116-87-650-41-003101

    CONN IC DIP SOCKET 50POS GOLD

    Preci-Dip

    3,498
    RFQ
    116-87-650-41-003101

    Datasheet

    116-87-650-41-003101 116 Bulk Active DIP, 0.6" (15.24mm) Row Spacing 50 (2 x 25) 0.100" (2.54mm) Gold Flash Beryllium Copper Through Hole Elevated, Open Frame Solder 0.100" (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
    612-87-652-41-001101

    612-87-652-41-001101

    CONN IC DIP SOCKET 52POS GOLD

    Preci-Dip

    2,101
    RFQ
    612-87-652-41-001101

    Datasheet

    612-87-652-41-001101 612 Bulk Active DIP, 0.6" (15.24mm) Row Spacing 52 (2 x 26) 0.100" (2.54mm) Gold Flash Beryllium Copper Through Hole Carrier, Open Frame Solder 0.100" (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
    15-0518-11H

    15-0518-11H

    CONN SOCKET SIP 15POS GOLD

    Aries Electronics

    4,009
    RFQ
    15-0518-11H

    Datasheet

    15-0518-11H 518 Bulk Active SIP 15 (1 x 15) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Gold 10.0µin (0.25µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled -
    299-83-316-11-001101

    299-83-316-11-001101

    CONN IC DIP SOCKET 16POS GOLD

    Preci-Dip

    2,743
    RFQ
    299-83-316-11-001101

    Datasheet

    299-83-316-11-001101 299 Bulk Active DIP, 0.3" (7.62mm) Row Spacing 16 (2 x 8) 0.100" (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole, Right Angle, Horizontal Closed Frame Solder 0.100" (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
    123-83-324-41-001101

    123-83-324-41-001101

    CONN IC DIP SOCKET 24POS GOLD

    Preci-Dip

    2,690
    RFQ
    123-83-324-41-001101

    Datasheet

    123-83-324-41-001101 123 Bulk Active DIP, 0.3" (7.62mm) Row Spacing 24 (2 x 12) 0.100" (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Open Frame Wire Wrap 0.100" (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
    HLS-0108-G-2

    HLS-0108-G-2

    .100" SCREW MACHINE SOCKET ARRAY

    Samtec Inc.

    3,218
    RFQ
    HLS-0108-G-2

    Datasheet

    HLS-0108-G-2 HLS Bulk Active SIP 8 (1 x 8) 0.100" (2.54mm) Gold 30.0µin (0.76µm) - Through Hole Closed Frame Solder 0.100" (2.54mm) Gold 10.0µin (0.25µm) - Thermoplastic -55°C ~ 140°C
    122-83-632-41-001101

    122-83-632-41-001101

    CONN IC DIP SOCKET 32POS GOLD

    Preci-Dip

    3,020
    RFQ
    122-83-632-41-001101

    Datasheet

    122-83-632-41-001101 122 Bulk Active DIP, 0.6" (15.24mm) Row Spacing 32 (2 x 16) 0.100" (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Open Frame Wire Wrap 0.100" (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
    123-83-632-41-001101

    123-83-632-41-001101

    CONN IC DIP SOCKET 32POS GOLD

    Preci-Dip

    3,447
    RFQ
    123-83-632-41-001101

    Datasheet

    123-83-632-41-001101 123 Bulk Active DIP, 0.6" (15.24mm) Row Spacing 32 (2 x 16) 0.100" (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Open Frame Wire Wrap 0.100" (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
    HLS-0120-TT-11

    HLS-0120-TT-11

    .100" SCREW MACHINE SOCKET ARRAY

    Samtec Inc.

    3,175
    RFQ
    HLS-0120-TT-11

    Datasheet

    HLS-0120-TT-11 HLS Tube Active SIP 20 (1 x 20) 0.100" (2.54mm) Tin - - Through Hole Closed Frame Solder 0.100" (2.54mm) Tin - - Thermoplastic -55°C ~ 140°C
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