Available 24/7 at SENICO ELECTRONICS INTL CO., LIMITED
    SENICO ELECTRONICS INTL CO., LIMITED

    IC Sockets

    Manufacturer Series Packaging Product Status Type Number of Positions or Pins (Grid) Pitch - Mating Contact Finish - Mating Contact Finish Thickness - Mating Contact Material - Mating Mounting Type Features Termination Pitch - Post Contact Finish - Post Contact Finish Thickness - Post Contact Material - Post Housing Material Operating Temperature















































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































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    Photo Mfr. Part # Availability Price Quantity Datasheet RoHs Series Packaging Product Status Type Number of Positions or Pins (Grid) Pitch - Mating Contact Finish - Mating Contact Finish Thickness - Mating Contact Material - Mating Mounting Type Features Termination Pitch - Post Contact Finish - Post Contact Finish Thickness - Post Contact Material - Post Housing Material Operating Temperature
    C9122-00

    C9122-00

    CONN IC DIP SOCKET 22POS GOLD

    Aries Electronics

    2,405
    RFQ
    C9122-00

    Datasheet

    C9122-00 Edge-Grip™, C91 Bulk Obsolete DIP, 0.4" (10.16mm) Row Spacing 22 (2 x 11) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Phosphor Bronze Through Hole Closed Frame Wire Wrap 0.100" (2.54mm) Gold 10.0µin (0.25µm) Phosphor Bronze Polyamide (PA46), Nylon 4/6, Glass Filled -55°C ~ 125°C
    HLS-0116-T-2

    HLS-0116-T-2

    .100" SCREW MACHINE SOCKET ARRAY

    Samtec Inc.

    3,232
    RFQ
    HLS-0116-T-2

    Datasheet

    HLS-0116-T-2 HLS Tube Active SIP 16 (1 x 16) 0.100" (2.54mm) Tin - - Through Hole Closed Frame Solder 0.100" (2.54mm) - - - Thermoplastic -55°C ~ 140°C
    299-87-320-11-001101

    299-87-320-11-001101

    CONN IC DIP SOCKET 20POS GOLD

    Preci-Dip

    3,942
    RFQ
    299-87-320-11-001101

    Datasheet

    299-87-320-11-001101 299 Bulk Active DIP, 0.3" (7.62mm) Row Spacing 20 (2 x 10) 0.100" (2.54mm) Gold Flash Beryllium Copper Through Hole, Right Angle, Horizontal Closed Frame Solder 0.100" (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
    IC-628-SGT

    IC-628-SGT

    CONN IC DIP SOCKET 28POS GOLD

    Samtec Inc.

    2,017
    RFQ
    IC-628-SGT

    Datasheet

    IC-628-SGT IC Bulk Obsolete DIP, 0.6" (15.24mm) Row Spacing 28 (2 x 14) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Gold 10.0µin (0.25µm) Phosphor Bronze Polyester, Glass Filled -55°C ~ 125°C
    510-83-073-11-061101

    510-83-073-11-061101

    CONN SOCKET PGA 73POS GOLD

    Preci-Dip

    2,256
    RFQ
    510-83-073-11-061101

    Datasheet

    510-83-073-11-061101 510 Bulk Active PGA 73 (11 x 11) 0.100" (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
    116-83-628-41-009101

    116-83-628-41-009101

    CONN IC DIP SOCKET 28POS GOLD

    Preci-Dip

    3,229
    RFQ
    116-83-628-41-009101

    Datasheet

    116-83-628-41-009101 116 Bulk Active DIP, 0.6" (15.24mm) Row Spacing 28 (2 x 14) 0.100" (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Elevated, Open Frame Solder 0.100" (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
    08-2501-20

    08-2501-20

    CONN IC DIP SOCKET 8POS TIN

    Aries Electronics

    4,379
    RFQ
    08-2501-20

    Datasheet

    08-2501-20 501 Bulk Active DIP, 0.2" (5.08mm) Row Spacing 8 (2 x 4) 0.100" (2.54mm) Tin 200.0µin (5.08µm) Phosphor Bronze Through Hole Closed Frame Wire Wrap 0.100" (2.54mm) Tin 200.0µin (5.08µm) Phosphor Bronze Polyamide (PA46), Nylon 4/6, Glass Filled -55°C ~ 105°C
    116-83-424-41-011101

    116-83-424-41-011101

    CONN IC DIP SOCKET 24POS GOLD

    Preci-Dip

    4,207
    RFQ
    116-83-424-41-011101

    Datasheet

    116-83-424-41-011101 116 Bulk Active DIP, 0.4" (10.16mm) Row Spacing 24 (2 x 12) 0.100" (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Elevated, Open Frame Solder 0.100" (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
    ICA-318-ZSGT

    ICA-318-ZSGT

    CONN IC DIP SOCKET 18POS GOLD

    Samtec Inc.

    2,898
    RFQ
    ICA-318-ZSGT

    Datasheet

    ICA-318-ZSGT ICA Tube Active DIP, 0.3" (7.62mm) Row Spacing 18 (2 x 9) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Tin 10.0µin (0.25µm) Brass Polyester, Glass Filled -55°C ~ 125°C
    ICO-318-ZSGT

    ICO-318-ZSGT

    .100" LOW PROFILE SCREW MACHINE

    Samtec Inc.

    2,868
    RFQ
    ICO-318-ZSGT

    Datasheet

    ICO-318-ZSGT ICO Tube Active DIP, 0.3" (7.62mm) Row Spacing 18 (2 x 9) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Tin 10.0µin (0.25µm) Brass Polyester, Glass Filled -55°C ~ 125°C
    08-0501-20

    08-0501-20

    CONN SOCKET SIP 8POS TIN

    Aries Electronics

    3,645
    RFQ
    08-0501-20

    Datasheet

    08-0501-20 501 Bulk Active SIP 8 (1 x 8) 0.100" (2.54mm) Tin 200.0µin (5.08µm) Phosphor Bronze Through Hole - Wire Wrap 0.100" (2.54mm) Tin 200.0µin (5.08µm) Phosphor Bronze Polyamide (PA46), Nylon 4/6, Glass Filled -55°C ~ 105°C
    08-0501-30

    08-0501-30

    CONN SOCKET SIP 8POS TIN

    Aries Electronics

    4,621
    RFQ
    08-0501-30

    Datasheet

    08-0501-30 501 Bulk Active SIP 8 (1 x 8) 0.100" (2.54mm) Tin 200.0µin (5.08µm) Phosphor Bronze Through Hole - Wire Wrap 0.100" (2.54mm) Tin 200.0µin (5.08µm) Phosphor Bronze Polyamide (PA46), Nylon 4/6, Glass Filled -55°C ~ 105°C
    116-87-318-41-013101

    116-87-318-41-013101

    CONN IC DIP SOCKET 18POS GOLD

    Preci-Dip

    4,172
    RFQ
    116-87-318-41-013101

    Datasheet

    116-87-318-41-013101 116 Bulk Active DIP, 0.3" (7.62mm) Row Spacing 18 (2 x 9) 0.100" (2.54mm) Gold Flash Beryllium Copper Through Hole Elevated, Open Frame Solder 0.100" (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
    ICF-320-F-O

    ICF-320-F-O

    .100" SURFACE MOUNT SCREW MACHIN

    Samtec Inc.

    4,996
    RFQ
    ICF-320-F-O

    Datasheet

    ICF-320-F-O ICF Tube Active DIP, 0.3" (7.62mm) Row Spacing 20 (2 x 10) 0.100" (2.54mm) Gold 3.00µin (0.076µm) Beryllium Copper Surface Mount Open Frame Solder 0.100" (2.54mm) Tin - Beryllium Copper Liquid Crystal Polymer (LCP) -55°C ~ 125°C
    510-87-121-15-001101

    510-87-121-15-001101

    CONN SOCKET PGA 121POS GOLD

    Preci-Dip

    4,466
    RFQ
    510-87-121-15-001101

    Datasheet

    510-87-121-15-001101 510 Bulk Active PGA 121 (15 x 15) 0.100" (2.54mm) Gold Flash Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
    510-87-121-15-061101

    510-87-121-15-061101

    CONN SOCKET PGA 121POS GOLD

    Preci-Dip

    2,343
    RFQ
    510-87-121-15-061101

    Datasheet

    510-87-121-15-061101 510 Bulk Active PGA 121 (15 x 15) 0.100" (2.54mm) Gold Flash Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
    116-87-328-41-011101

    116-87-328-41-011101

    CONN IC DIP SOCKET 28POS GOLD

    Preci-Dip

    2,313
    RFQ
    116-87-328-41-011101

    Datasheet

    116-87-328-41-011101 116 Bulk Active DIP, 0.3" (7.62mm) Row Spacing 28 (2 x 14) 0.100" (2.54mm) Gold Flash Beryllium Copper Through Hole Elevated, Open Frame Solder 0.100" (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
    05-0503-21

    05-0503-21

    CONN SOCKET SIP 5POS GOLD

    Aries Electronics

    2,534
    RFQ
    05-0503-21

    Datasheet

    05-0503-21 0503 Bulk Active SIP 5 (1 x 5) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole - Wire Wrap 0.100" (2.54mm) Gold 10.0µin (0.25µm) Brass Polyamide (PA), Nylon, Glass Filled -
    20-4518-10H

    20-4518-10H

    CONN IC DIP SOCKET 20POS GOLD

    Aries Electronics

    3,734
    RFQ
    20-4518-10H

    Datasheet

    20-4518-10H 518 Bulk Active DIP, 0.4" (10.16mm) Row Spacing 20 (2 x 10) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled -
    HLS-0109-G-10

    HLS-0109-G-10

    .100" SCREW MACHINE SOCKET ARRAY

    Samtec Inc.

    3,069
    RFQ
    HLS-0109-G-10

    Datasheet

    HLS-0109-G-10 HLS Tube Active SIP 9 (1 x 9) 0.100" (2.54mm) Gold 30.0µin (0.76µm) - Through Hole Closed Frame Solder 0.100" (2.54mm) Gold 10.0µin (0.25µm) - Thermoplastic -55°C ~ 140°C
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