Available 24/7 at SENICO ELECTRONICS INTL CO., LIMITED
    SENICO ELECTRONICS INTL CO., LIMITED

    IC Sockets

    Manufacturer Series Packaging Product Status Type Number of Positions or Pins (Grid) Pitch - Mating Contact Finish - Mating Contact Finish Thickness - Mating Contact Material - Mating Mounting Type Features Termination Pitch - Post Contact Finish - Post Contact Finish Thickness - Post Contact Material - Post Housing Material Operating Temperature















































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































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    Photo Mfr. Part # Availability Price Quantity Datasheet RoHs Series Packaging Product Status Type Number of Positions or Pins (Grid) Pitch - Mating Contact Finish - Mating Contact Finish Thickness - Mating Contact Material - Mating Mounting Type Features Termination Pitch - Post Contact Finish - Post Contact Finish Thickness - Post Contact Material - Post Housing Material Operating Temperature
    14-6501-30

    14-6501-30

    .6 WW SOCKET

    Aries Electronics

    2,095
    RFQ

    -

    14-6501-30 501 - Active DIP, 0.6" (15.24mm) Row Spacing 14 (2 x 7) 0.100" (2.54mm) Tin 200.0µin (5.08µm) Phosphor Bronze Through Hole Closed Frame Wire Wrap 0.100" (2.54mm) Tin 200.0µin (5.08µm) Phosphor Bronze Polyamide (PA46), Nylon 4/6, Glass Filled -55°C ~ 105°C
    14-6501-20

    14-6501-20

    CONN IC DIP SOCKET 14POS TIN

    Aries Electronics

    3,611
    RFQ
    14-6501-20

    Datasheet

    14-6501-20 501 Bulk Active DIP, 0.6" (15.24mm) Row Spacing 14 (2 x 7) 0.100" (2.54mm) Tin 200.0µin (5.08µm) Phosphor Bronze Through Hole Closed Frame Wire Wrap 0.100" (2.54mm) Tin 200.0µin (5.08µm) Phosphor Bronze Polyamide (PA46), Nylon 4/6, Glass Filled -55°C ~ 125°C
    24-3518-10H

    24-3518-10H

    CONN IC DIP SOCKET 24POS GOLD

    Aries Electronics

    3,771
    RFQ
    24-3518-10H

    Datasheet

    24-3518-10H 518 Bulk Active DIP, 0.3" (7.62mm) Row Spacing 24 (2 x 12) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled -
    ICA-320-ZSGT

    ICA-320-ZSGT

    .100" SCREW MACHINE DIP SOCKET

    Samtec Inc.

    3,022
    RFQ
    ICA-320-ZSGT

    Datasheet

    ICA-320-ZSGT ICA Tube Active DIP, 0.3" (7.62mm) Row Spacing 20 (2 x 10) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Tin 10.0µin (0.25µm) Brass Polyester, Glass Filled -55°C ~ 125°C
    612-83-642-41-001101

    612-83-642-41-001101

    CONN IC DIP SOCKET 42POS GOLD

    Preci-Dip

    4,795
    RFQ
    612-83-642-41-001101

    Datasheet

    612-83-642-41-001101 612 Bulk Active DIP, 0.6" (15.24mm) Row Spacing 42 (2 x 21) 0.100" (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Carrier, Open Frame Solder 0.100" (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
    16-3501-20

    16-3501-20

    CONN IC DIP SOCKET 16POS TIN

    Aries Electronics

    3,912
    RFQ
    16-3501-20

    Datasheet

    16-3501-20 501 Bulk Active DIP, 0.3" (7.62mm) Row Spacing 16 (2 x 8) 0.100" (2.54mm) Tin 200.0µin (5.08µm) Phosphor Bronze Through Hole Closed Frame Wire Wrap 0.100" (2.54mm) Tin 200.0µin (5.08µm) Phosphor Bronze Polyamide (PA46), Nylon 4/6, Glass Filled -55°C ~ 105°C
    16-3501-30

    16-3501-30

    CONN IC DIP SOCKET 16POS TIN

    Aries Electronics

    3,173
    RFQ
    16-3501-30

    Datasheet

    16-3501-30 501 Bulk Active DIP, 0.3" (7.62mm) Row Spacing 16 (2 x 8) 0.100" (2.54mm) Tin 200.0µin (5.08µm) Phosphor Bronze Through Hole Closed Frame Wire Wrap 0.100" (2.54mm) Tin 200.0µin (5.08µm) Phosphor Bronze Polyamide (PA46), Nylon 4/6, Glass Filled -55°C ~ 125°C
    116-87-640-41-009101

    116-87-640-41-009101

    CONN IC DIP SOCKET 40POS GOLD

    Preci-Dip

    2,128
    RFQ
    116-87-640-41-009101

    Datasheet

    116-87-640-41-009101 116 Bulk Active DIP, 0.6" (15.24mm) Row Spacing 40 (2 x 20) 0.100" (2.54mm) Gold Flash Beryllium Copper Through Hole Elevated, Open Frame Solder 0.100" (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
    116-83-324-41-004101

    116-83-324-41-004101

    CONN IC DIP SOCKET 24POS GOLD

    Preci-Dip

    2,120
    RFQ
    116-83-324-41-004101

    Datasheet

    116-83-324-41-004101 116 Bulk Active DIP, 0.3" (7.62mm) Row Spacing 24 (2 x 12) 0.100" (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Elevated, Open Frame Solder 0.100" (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
    116-83-424-41-004101

    116-83-424-41-004101

    CONN IC DIP SOCKET 24POS GOLD

    Preci-Dip

    2,215
    RFQ
    116-83-424-41-004101

    Datasheet

    116-83-424-41-004101 116 Bulk Active DIP, 0.4" (10.16mm) Row Spacing 24 (2 x 12) 0.100" (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Elevated, Open Frame Solder 0.100" (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
    APO-624-T-A1

    APO-624-T-A1

    .100" LOW PROFILE SCREW MACHINE

    Samtec Inc.

    2,716
    RFQ
    APO-624-T-A1

    Datasheet

    APO-624-T-A1 APO Bulk Active DIP, 0.6" (15.24mm) Row Spacing 24 (2 x 12) 0.100" (2.54mm) Tin - Phosphor Bronze Through Hole Open Frame Solder 0.100" (2.54mm) Tin - Phosphor Bronze Polybutylene Terephthalate (PBT), Glass Filled -
    ICF-324-TL-O

    ICF-324-TL-O

    .100" SURFACE MOUNT SCREW MACHIN

    Samtec Inc.

    4,934
    RFQ
    ICF-324-TL-O

    Datasheet

    ICF-324-TL-O ICF Tube Active DIP, 0.3" (7.62mm) Row Spacing 24 (2 x 12) 0.100" (2.54mm) Tin - Beryllium Copper Surface Mount Open Frame Solder 0.100" (2.54mm) Tin - Beryllium Copper Liquid Crystal Polymer (LCP) -55°C ~ 125°C
    35-0518-11

    35-0518-11

    CONN SOCKET SIP 35POS GOLD

    Aries Electronics

    2,526
    RFQ
    35-0518-11

    Datasheet

    35-0518-11 518 Bulk Active SIP 35 (1 x 35) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Gold 10.0µin (0.25µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled -
    18-3518-102

    18-3518-102

    CONN IC DIP SOCKET 18POS GOLD

    Aries Electronics

    4,825
    RFQ
    18-3518-102

    Datasheet

    18-3518-102 518 Bulk Active DIP, 0.3" (7.62mm) Row Spacing 18 (2 x 9) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled -
    18-3518-101

    18-3518-101

    CONN IC DIP SOCKET 18POS GOLD

    Aries Electronics

    2,551
    RFQ
    18-3518-101

    Datasheet

    18-3518-101 518 Bulk Active DIP, 0.3" (7.62mm) Row Spacing 18 (2 x 9) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled -
    HLS-0110-G-10

    HLS-0110-G-10

    .100" SCREW MACHINE SOCKET ARRAY

    Samtec Inc.

    2,276
    RFQ
    HLS-0110-G-10

    Datasheet

    HLS-0110-G-10 HLS Tube Active SIP 10 (1 x 10) 0.100" (2.54mm) Gold 30.0µin (0.76µm) - Through Hole Closed Frame Solder 0.100" (2.54mm) Gold 10.0µin (0.25µm) - Thermoplastic -55°C ~ 140°C
    117-87-656-41-105101

    117-87-656-41-105101

    CONN IC DIP SOCKET 56POS GOLD

    Preci-Dip

    4,725
    RFQ
    117-87-656-41-105101

    Datasheet

    117-87-656-41-105101 117 Bulk Active DIP, 0.6" (15.24mm) Row Spacing 56 (2 x 28) 0.070" (1.78mm) Gold Flash Beryllium Copper Through Hole Open Frame Solder 0.070" (1.78mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
    299-83-614-10-002101

    299-83-614-10-002101

    CONN IC DIP SOCKET 14POS GOLD

    Preci-Dip

    2,800
    RFQ
    299-83-614-10-002101

    Datasheet

    299-83-614-10-002101 299 Bulk Active DIP, 0.6" (15.24mm) Row Spacing 14 (2 x 7) 0.100" (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole, Right Angle, Horizontal Closed Frame Solder 0.100" (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
    ICO-316-ZLGT

    ICO-316-ZLGT

    .100" LOW PROFILE SCREW MACHINE

    Samtec Inc.

    3,823
    RFQ
    ICO-316-ZLGT

    Datasheet

    ICO-316-ZLGT ICO Tube Active DIP, 0.3" (7.62mm) Row Spacing 16 (2 x 8) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Tin 10.0µin (0.25µm) Brass Polyester, Glass Filled -55°C ~ 125°C
    146-87-640-41-035101

    146-87-640-41-035101

    CONN IC DIP SOCKET 40POS GOLD

    Preci-Dip

    2,718
    RFQ
    146-87-640-41-035101

    Datasheet

    146-87-640-41-035101 146 Bulk Active DIP, 0.6" (15.24mm) Row Spacing 40 (2 x 20) 0.100" (2.54mm) Gold Flash Beryllium Copper Through Hole Open Frame Press-Fit 0.100" (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
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