Available 24/7 at SENICO ELECTRONICS INTL CO., LIMITED
    SENICO ELECTRONICS INTL CO., LIMITED

    IC Sockets

    Manufacturer Series Packaging Product Status Type Number of Positions or Pins (Grid) Pitch - Mating Contact Finish - Mating Contact Finish Thickness - Mating Contact Material - Mating Mounting Type Features Termination Pitch - Post Contact Finish - Post Contact Finish Thickness - Post Contact Material - Post Housing Material Operating Temperature















































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































    Reset All
    Apply All
    Result:
    Photo Mfr. Part # Availability Price Quantity Datasheet RoHs Series Packaging Product Status Type Number of Positions or Pins (Grid) Pitch - Mating Contact Finish - Mating Contact Finish Thickness - Mating Contact Material - Mating Mounting Type Features Termination Pitch - Post Contact Finish - Post Contact Finish Thickness - Post Contact Material - Post Housing Material Operating Temperature
    10-0503-30

    10-0503-30

    CONN SOCKET SIP 10POS GOLD

    Aries Electronics

    3,402
    RFQ
    10-0503-30

    Datasheet

    10-0503-30 0503 Bulk Active SIP 10 (1 x 10) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole - Wire Wrap 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Polyamide (PA), Nylon, Glass Filled -
    20-0518-11H

    20-0518-11H

    CONN SOCKET SIP 20POS GOLD

    Aries Electronics

    3,712
    RFQ
    20-0518-11H

    Datasheet

    20-0518-11H 518 Bulk Active SIP 20 (1 x 20) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Gold 10.0µin (0.25µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled -
    34-0518-11

    34-0518-11

    CONN SOCKET SIP 34POS GOLD

    Aries Electronics

    3,351
    RFQ
    34-0518-11

    Datasheet

    34-0518-11 518 Bulk Active SIP 34 (1 x 34) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Gold 10.0µin (0.25µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled -
    110-83-648-41-105101

    110-83-648-41-105101

    CONN IC DIP SOCKET 48POS GOLD

    Preci-Dip

    3,622
    RFQ
    110-83-648-41-105101

    Datasheet

    110-83-648-41-105101 110 Bulk Active DIP, 0.6" (15.24mm) Row Spacing 48 (2 x 24) 0.100" (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Surface Mount Open Frame Solder 0.100" (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
    550-80-037-10-061101

    550-80-037-10-061101

    PGA SOLDER TAIL

    Preci-Dip

    3,056
    RFQ
    550-80-037-10-061101

    Datasheet

    550-80-037-10-061101 550 Bulk Active PGA 37 (10 x 10) 0.100" (2.54mm) Tin - Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
    HLS-0205-G-11

    HLS-0205-G-11

    .100" SCREW MACHINE SOCKET ARRAY

    Samtec Inc.

    2,415
    RFQ
    HLS-0205-G-11

    Datasheet

    HLS-0205-G-11 HLS Tube Active SIP 10 (2 x 5) 0.100" (2.54mm) Gold 30.0µin (0.76µm) - Through Hole Closed Frame Solder 0.100" (2.54mm) Gold 10.0µin (0.25µm) - Thermoplastic -55°C ~ 140°C
    116-83-632-41-008101

    116-83-632-41-008101

    CONN IC DIP SOCKET 32POS GOLD

    Preci-Dip

    3,903
    RFQ
    116-83-632-41-008101

    Datasheet

    116-83-632-41-008101 116 Bulk Active DIP, 0.6" (15.24mm) Row Spacing 32 (2 x 16) 0.100" (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Elevated, Open Frame Solder 0.100" (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
    510-83-072-11-001101

    510-83-072-11-001101

    CONN SOCKET PGA 72POS GOLD

    Preci-Dip

    4,273
    RFQ
    510-83-072-11-001101

    Datasheet

    510-83-072-11-001101 510 Bulk Active PGA 72 (11 x 11) 0.100" (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
    510-83-072-11-041101

    510-83-072-11-041101

    CONN SOCKET PGA 72POS GOLD

    Preci-Dip

    4,656
    RFQ
    510-83-072-11-041101

    Datasheet

    510-83-072-11-041101 510 Bulk Active PGA 72 (11 x 11) 0.100" (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
    C9124-00

    C9124-00

    CONN IC DIP SOCKET 24POS GOLD

    Aries Electronics

    2,463
    RFQ
    C9124-00

    Datasheet

    C9124-00 Edge-Grip™, C91 Bulk Obsolete DIP, 0.6" (15.24mm) Row Spacing 24 (2 x 12) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Phosphor Bronze Through Hole Closed Frame Wire Wrap 0.100" (2.54mm) Gold 10.0µin (0.25µm) Phosphor Bronze Polyamide (PA46), Nylon 4/6, Glass Filled -55°C ~ 125°C
    22-4513-11

    22-4513-11

    CONN IC DIP SOCKET 22POS GOLD

    Aries Electronics

    2,346
    RFQ
    22-4513-11

    Datasheet

    22-4513-11 Lo-PRO®file, 513 Bulk Active DIP, 0.4" (10.16mm) Row Spacing 22 (2 x 11) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Closed Frame Solder 0.100" (2.54mm) Gold 10.0µin (0.25µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled -55°C ~ 105°C
    299-83-318-11-001101

    299-83-318-11-001101

    CONN IC DIP SOCKET 18POS GOLD

    Preci-Dip

    2,340
    RFQ
    299-83-318-11-001101

    Datasheet

    299-83-318-11-001101 299 Bulk Active DIP, 0.3" (7.62mm) Row Spacing 18 (2 x 9) 0.100" (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole, Right Angle, Horizontal Closed Frame Solder 0.100" (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
    ICO-322-SGT

    ICO-322-SGT

    .100" LOW PROFILE SCREW MACHINE

    Samtec Inc.

    2,661
    RFQ
    ICO-322-SGT

    Datasheet

    ICO-322-SGT ICO Tube Active DIP, 0.3" (7.62mm) Row Spacing 22 (2 x 11) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Tin 10.0µin (0.25µm) Brass Polyester, Glass Filled -55°C ~ 125°C
    ICA-422-WTT

    ICA-422-WTT

    .100" SCREW MACHINE DIP SOCKET

    Samtec Inc.

    4,284
    RFQ
    ICA-422-WTT

    Datasheet

    ICA-422-WTT ICA Tube Active DIP, 0.4" (10.16mm) Row Spacing 22 (2 x 11) 0.100" (2.54mm) Tin - Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Tin - Brass Polyester, Glass Filled -55°C ~ 105°C
    ICA-322-SGT

    ICA-322-SGT

    .100" SCREW MACHINE DIP SOCKET

    Samtec Inc.

    2,439
    RFQ
    ICA-322-SGT

    Datasheet

    ICA-322-SGT ICA Tube Active DIP, 0.3" (7.62mm) Row Spacing 22 (2 x 11) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Tin 10.0µin (0.25µm) Brass Polyester, Glass Filled -55°C ~ 125°C
    ICA-322-WTT

    ICA-322-WTT

    .100" SCREW MACHINE DIP SOCKET

    Samtec Inc.

    3,340
    RFQ
    ICA-322-WTT

    Datasheet

    ICA-322-WTT ICA Tube Active DIP, 0.3" (7.62mm) Row Spacing 22 (2 x 11) 0.100" (2.54mm) Tin - Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Tin - Brass Polyester, Glass Filled -55°C ~ 105°C
    29-0518-11

    29-0518-11

    CONN SOCKET SIP 29POS GOLD

    Aries Electronics

    4,384
    RFQ
    29-0518-11

    Datasheet

    29-0518-11 518 Bulk Active SIP 29 (1 x 29) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Gold 10.0µin (0.25µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled -
    614-87-652-31-012101

    614-87-652-31-012101

    CONN IC DIP SOCKET 52POS GOLD

    Preci-Dip

    3,902
    RFQ
    614-87-652-31-012101

    Datasheet

    614-87-652-31-012101 614 Bulk Active DIP, 0.6" (15.24mm) Row Spacing 52 (2 x 26) 0.100" (2.54mm) Gold Flash Beryllium Copper Through Hole Carrier, Open Frame Solder 0.100" (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
    612-87-950-41-001101

    612-87-950-41-001101

    CONN IC DIP SOCKET 50POS GOLD

    Preci-Dip

    4,355
    RFQ
    612-87-950-41-001101

    Datasheet

    612-87-950-41-001101 612 Bulk Active DIP, 0.9" (22.86mm) Row Spacing 50 (2 x 25) 0.100" (2.54mm) Gold Flash Beryllium Copper Through Hole Carrier, Open Frame Solder 0.100" (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
    32-6518-00

    32-6518-00

    CONN IC DIP SOCKET 32POS GOLD

    Aries Electronics

    2,074
    RFQ
    32-6518-00

    Datasheet

    32-6518-00 518 Bulk Active DIP, 0.6" (15.24mm) Row Spacing 32 (2 x 16) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Surface Mount Open Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled -
    Total 19086 Record«Prev1... 270271272273274275276277...955Next»
    HOME

    HOME

    PRODUCT

    PRODUCT

    PHONE

    PHONE

    USER

    USER