Available 24/7 at SENICO ELECTRONICS INTL CO., LIMITED
    SENICO ELECTRONICS INTL CO., LIMITED

    IC Sockets

    Manufacturer Series Packaging Product Status Type Number of Positions or Pins (Grid) Pitch - Mating Contact Finish - Mating Contact Finish Thickness - Mating Contact Material - Mating Mounting Type Features Termination Pitch - Post Contact Finish - Post Contact Finish Thickness - Post Contact Material - Post Housing Material Operating Temperature















































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































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    Photo Mfr. Part # Availability Price Quantity Datasheet RoHs Series Packaging Product Status Type Number of Positions or Pins (Grid) Pitch - Mating Contact Finish - Mating Contact Finish Thickness - Mating Contact Material - Mating Mounting Type Features Termination Pitch - Post Contact Finish - Post Contact Finish Thickness - Post Contact Material - Post Housing Material Operating Temperature
    20-0513-11H

    20-0513-11H

    CONN SOCKET SIP 20POS GOLD

    Aries Electronics

    3,933
    RFQ
    20-0513-11H

    Datasheet

    20-0513-11H 0513 Bulk Active SIP 20 (1 x 20) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole - Solder 0.100" (2.54mm) Gold 10.0µin (0.25µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled -
    24-0513-11

    24-0513-11

    CONN SOCKET SIP 24POS GOLD

    Aries Electronics

    4,666
    RFQ
    24-0513-11

    Datasheet

    24-0513-11 0513 Bulk Active SIP 24 (1 x 24) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole - Solder 0.100" (2.54mm) Gold 10.0µin (0.25µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled -
    25-0513-11

    25-0513-11

    CONN SOCKET SIP 25POS GOLD

    Aries Electronics

    3,532
    RFQ
    25-0513-11

    Datasheet

    25-0513-11 0513 Bulk Active SIP 25 (1 x 25) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole - Solder 0.100" (2.54mm) Gold 10.0µin (0.25µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled -
    37-0518-11

    37-0518-11

    CONN SOCKET SIP 37POS GOLD

    Aries Electronics

    4,662
    RFQ
    37-0518-11

    Datasheet

    37-0518-11 518 Bulk Active SIP 37 (1 x 37) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Gold 10.0µin (0.25µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled -
    12-3503-20

    12-3503-20

    CONN IC DIP SOCKET 12POS GOLD

    Aries Electronics

    3,238
    RFQ
    12-3503-20

    Datasheet

    12-3503-20 503 Bulk Active DIP, 0.3" (7.62mm) Row Spacing 12 (2 x 6) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Closed Frame Wire Wrap 0.100" (2.54mm) Tin 200.0µin (5.08µm) Phosphor Bronze Polyamide (PA46), Nylon 4/6, Glass Filled -55°C ~ 105°C
    12-3503-30

    12-3503-30

    CONN IC DIP SOCKET 12POS GOLD

    Aries Electronics

    4,267
    RFQ
    12-3503-30

    Datasheet

    12-3503-30 503 Bulk Active DIP, 0.3" (7.62mm) Row Spacing 12 (2 x 6) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Closed Frame Wire Wrap 0.100" (2.54mm) Tin 200.0µin (5.08µm) Phosphor Bronze Polyamide (PA46), Nylon 4/6, Glass Filled -55°C ~ 105°C
    20-3518-101

    20-3518-101

    CONN IC DIP SOCKET 20POS GOLD

    Aries Electronics

    3,622
    RFQ
    20-3518-101

    Datasheet

    20-3518-101 518 Bulk Active DIP, 0.3" (7.62mm) Row Spacing 20 (2 x 10) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled -
    40-6513-10T

    40-6513-10T

    CONN IC DIP SOCKET 40POS GOLD

    Aries Electronics

    3,310
    RFQ
    40-6513-10T

    Datasheet

    40-6513-10T Lo-PRO®file, 513 Bulk Active DIP, 0.6" (15.24mm) Row Spacing 40 (2 x 20) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Closed Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled -55°C ~ 105°C
    14-3513-11H

    14-3513-11H

    CONN IC DIP SOCKET 14POS GOLD

    Aries Electronics

    3,683
    RFQ
    14-3513-11H

    Datasheet

    14-3513-11H Lo-PRO®file, 513 Bulk Active DIP, 0.3" (7.62mm) Row Spacing 14 (2 x 7) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Closed Frame Solder 0.100" (2.54mm) Gold 10.0µin (0.25µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled -55°C ~ 105°C
    24-3518-10M

    24-3518-10M

    CONN IC DIP SOCKET 24POS GOLD

    Aries Electronics

    4,509
    RFQ
    24-3518-10M

    Datasheet

    24-3518-10M 518 Bulk Active DIP, 0.3" (7.62mm) Row Spacing 24 (2 x 12) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled -
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