Available 24/7 at SENICO ELECTRONICS INTL CO., LIMITED
    SENICO ELECTRONICS INTL CO., LIMITED

    IC Sockets

    Manufacturer Series Packaging Product Status Type Number of Positions or Pins (Grid) Pitch - Mating Contact Finish - Mating Contact Finish Thickness - Mating Contact Material - Mating Mounting Type Features Termination Pitch - Post Contact Finish - Post Contact Finish Thickness - Post Contact Material - Post Housing Material Operating Temperature















































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































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    Photo Mfr. Part # Availability Price Quantity Datasheet RoHs Series Packaging Product Status Type Number of Positions or Pins (Grid) Pitch - Mating Contact Finish - Mating Contact Finish Thickness - Mating Contact Material - Mating Mounting Type Features Termination Pitch - Post Contact Finish - Post Contact Finish Thickness - Post Contact Material - Post Housing Material Operating Temperature
    38-1518-11

    38-1518-11

    CONN IC DIP SOCKET 38POS GOLD

    Aries Electronics

    4,710
    RFQ
    38-1518-11

    Datasheet

    38-1518-11 518 Bulk Active DIP, 0.2" (5.08mm) Row Spacing 38 (2 x 19) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Gold 10.0µin (0.25µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled -
    38-6511-10

    38-6511-10

    CONN IC DIP SOCKET 38POS TIN

    Aries Electronics

    3,842
    RFQ
    38-6511-10

    Datasheet

    38-6511-10 511 Bulk Active DIP, 0.6" (15.24mm) Row Spacing 38 (2 x 19) 0.100" (2.54mm) Tin 200.0µin (5.08µm) Phosphor Bronze Through Hole Closed Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Phosphor Bronze Polyamide (PA46), Nylon 4/6, Glass Filled -55°C ~ 105°C
    14-3518-11H

    14-3518-11H

    CONN IC DIP SOCKET 14POS GOLD

    Aries Electronics

    2,123
    RFQ
    14-3518-11H

    Datasheet

    14-3518-11H 518 Bulk Active DIP, 0.3" (7.62mm) Row Spacing 14 (2 x 7) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Gold 10.0µin (0.25µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled -
    32-1518-11

    32-1518-11

    CONN IC DIP SOCKET 32POS GOLD

    Aries Electronics

    3,228
    RFQ
    32-1518-11

    Datasheet

    32-1518-11 518 Bulk Active DIP, 0.2" (5.08mm) Row Spacing 32 (2 x 16) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Gold 10.0µin (0.25µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled -
    38-3513-10T

    38-3513-10T

    CONN IC DIP SOCKET 38POS GOLD

    Aries Electronics

    4,770
    RFQ
    38-3513-10T

    Datasheet

    38-3513-10T Lo-PRO®file, 513 Bulk Active DIP, 0.3" (7.62mm) Row Spacing 38 (2 x 19) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Closed Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled -55°C ~ 105°C
    16-C195-11

    16-C195-11

    CONN IC DIP SOCKET 16POS GOLD

    Aries Electronics

    3,171
    RFQ
    16-C195-11

    Datasheet

    16-C195-11 EJECT-A-DIP™ Bulk Active DIP, 0.3" (7.62mm) Row Spacing 16 (2 x 8) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Closed Frame Solder 0.100" (2.54mm) Gold 10.0µin (0.25µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled -55°C ~ 125°C
    16-C280-11

    16-C280-11

    CONN IC DIP SOCKET 16POS GOLD

    Aries Electronics

    2,542
    RFQ
    16-C280-11

    Datasheet

    16-C280-11 EJECT-A-DIP™ Bulk Active DIP, 0.3" (7.62mm) Row Spacing 16 (2 x 8) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Closed Frame Solder 0.100" (2.54mm) Gold 10.0µin (0.25µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled -55°C ~ 125°C
    24-C212-10

    24-C212-10

    CONN IC DIP SOCKET 24POS GOLD

    Aries Electronics

    4,198
    RFQ
    24-C212-10

    Datasheet

    24-C212-10 EJECT-A-DIP™ Bulk Active DIP, 0.6" (15.24mm) Row Spacing 24 (2 x 12) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Closed Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled -55°C ~ 105°C
    24-C300-10

    24-C300-10

    CONN IC DIP SOCKET 24POS GOLD

    Aries Electronics

    2,363
    RFQ
    24-C300-10

    Datasheet

    24-C300-10 EJECT-A-DIP™ Bulk Active DIP, 0.6" (15.24mm) Row Spacing 24 (2 x 12) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Closed Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled -55°C ~ 105°C
    16-C195-10H

    16-C195-10H

    CONN IC DIP SOCKET 16POS GOLD

    Aries Electronics

    3,585
    RFQ
    16-C195-10H

    Datasheet

    16-C195-10H EJECT-A-DIP™ Bulk Active DIP, 0.3" (7.62mm) Row Spacing 16 (2 x 8) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Closed Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled -55°C ~ 105°C
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