Available 24/7 at SENICO ELECTRONICS INTL CO., LIMITED
    SENICO ELECTRONICS INTL CO., LIMITED

    IC Sockets

    Manufacturer Series Packaging Product Status Type Number of Positions or Pins (Grid) Pitch - Mating Contact Finish - Mating Contact Finish Thickness - Mating Contact Material - Mating Mounting Type Features Termination Pitch - Post Contact Finish - Post Contact Finish Thickness - Post Contact Material - Post Housing Material Operating Temperature















































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































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    Photo Mfr. Part # Availability Price Quantity Datasheet RoHs Series Packaging Product Status Type Number of Positions or Pins (Grid) Pitch - Mating Contact Finish - Mating Contact Finish Thickness - Mating Contact Material - Mating Mounting Type Features Termination Pitch - Post Contact Finish - Post Contact Finish Thickness - Post Contact Material - Post Housing Material Operating Temperature
    11-0503-31

    11-0503-31

    CONN SOCKET SIP 11POS GOLD

    Aries Electronics

    4,640
    RFQ
    11-0503-31

    Datasheet

    11-0503-31 0503 Bulk Active SIP 11 (1 x 11) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole - Wire Wrap 0.100" (2.54mm) Gold 10.0µin (0.25µm) Brass Polyamide (PA), Nylon, Glass Filled -
    39-0518-00

    39-0518-00

    CONN SOCKET SIP 39POS GOLD

    Aries Electronics

    2,300
    RFQ
    39-0518-00

    Datasheet

    39-0518-00 518 Bulk Active SIP 39 (1 x 39) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Surface Mount Open Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled -
    14-820-90

    14-820-90

    CONN IC DIP SOCKET 14POS GOLD

    Aries Electronics

    4,577
    RFQ
    14-820-90

    Datasheet

    14-820-90 Vertisockets™ 800 Bulk Active DIP, 0.3" (7.62mm) Row Spacing 14 (2 x 7) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Phosphor Bronze Through Hole, Right Angle, Horizontal Closed Frame Solder 0.100" (2.54mm) Gold 10.0µin (0.25µm) Phosphor Bronze Polyamide (PA46), Nylon 4/6 -
    22-3513-11H

    22-3513-11H

    CONN IC DIP SOCKET 22POS GOLD

    Aries Electronics

    3,128
    RFQ
    22-3513-11H

    Datasheet

    22-3513-11H Lo-PRO®file, 513 Bulk Active DIP, 0.3" (7.62mm) Row Spacing 22 (2 x 11) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Closed Frame Solder 0.100" (2.54mm) Gold 10.0µin (0.25µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled -55°C ~ 105°C
    17-0503-20

    17-0503-20

    CONN SOCKET SIP 17POS GOLD

    Aries Electronics

    3,813
    RFQ
    17-0503-20

    Datasheet

    17-0503-20 0503 Bulk Active SIP 17 (1 x 17) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole - Wire Wrap 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Polyamide (PA), Nylon, Glass Filled -
    17-0503-30

    17-0503-30

    CONN SOCKET SIP 17POS GOLD

    Aries Electronics

    2,772
    RFQ
    17-0503-30

    Datasheet

    17-0503-30 0503 Bulk Active SIP 17 (1 x 17) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole - Wire Wrap 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Polyamide (PA), Nylon, Glass Filled -
    38-0511-10

    38-0511-10

    CONN SOCKET SIP 38POS TIN

    Aries Electronics

    3,553
    RFQ
    38-0511-10

    Datasheet

    38-0511-10 511 Bulk Active SIP 38 (1 x 38) 0.100" (2.54mm) Tin 50.0µin (1.27µm) Phosphor Bronze Through Hole - Solder 0.100" (2.54mm) Tin 50.0µin (1.27µm) Phosphor Bronze Polyamide (PA46), Nylon 4/6, Glass Filled -55°C ~ 105°C
    21-0508-20

    21-0508-20

    CONN SOCKET SIP 21POS GOLD

    Aries Electronics

    3,550
    RFQ
    21-0508-20

    Datasheet

    21-0508-20 508 Bulk Active SIP 21 (1 x 21) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole - Wire Wrap - Tin 200.0µin (5.08µm) Brass Polyamide (PA46), Nylon 4/6 -55°C ~ 105°C
    16-C280-11H

    16-C280-11H

    CONN IC DIP SOCKET 16POS GOLD

    Aries Electronics

    3,533
    RFQ
    16-C280-11H

    Datasheet

    16-C280-11H EJECT-A-DIP™ Bulk Active DIP, 0.3" (7.62mm) Row Spacing 16 (2 x 8) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Closed Frame Solder 0.100" (2.54mm) Gold 10.0µin (0.25µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled -55°C ~ 125°C
    28-3513-11

    28-3513-11

    CONN IC DIP SOCKET 28POS GOLD

    Aries Electronics

    2,858
    RFQ
    28-3513-11

    Datasheet

    28-3513-11 Lo-PRO®file, 513 Bulk Active DIP, 0.3" (7.62mm) Row Spacing 28 (2 x 14) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Closed Frame Solder 0.100" (2.54mm) Gold 10.0µin (0.25µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled -55°C ~ 105°C
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