Available 24/7 at SENICO ELECTRONICS INTL CO., LIMITED
    SENICO ELECTRONICS INTL CO., LIMITED

    IC Sockets

    Manufacturer Series Packaging Product Status Type Number of Positions or Pins (Grid) Pitch - Mating Contact Finish - Mating Contact Finish Thickness - Mating Contact Material - Mating Mounting Type Features Termination Pitch - Post Contact Finish - Post Contact Finish Thickness - Post Contact Material - Post Housing Material Operating Temperature















































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































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    Photo Mfr. Part # Availability Price Quantity Datasheet RoHs Series Packaging Product Status Type Number of Positions or Pins (Grid) Pitch - Mating Contact Finish - Mating Contact Finish Thickness - Mating Contact Material - Mating Mounting Type Features Termination Pitch - Post Contact Finish - Post Contact Finish Thickness - Post Contact Material - Post Housing Material Operating Temperature
    24-6518-11H

    24-6518-11H

    CONN IC DIP SOCKET 24POS GOLD

    Aries Electronics

    4,814
    RFQ
    24-6518-11H

    Datasheet

    24-6518-11H 518 Bulk Active DIP, 0.6" (15.24mm) Row Spacing 24 (2 x 12) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Gold 10.0µin (0.25µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled -
    28-6518-102

    28-6518-102

    CONN IC DIP SOCKET 28POS GOLD

    Aries Electronics

    3,290
    RFQ
    28-6518-102

    Datasheet

    28-6518-102 518 Bulk Active DIP, 0.6" (15.24mm) Row Spacing 28 (2 x 14) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled -
    28-6501-20

    28-6501-20

    CONN IC DIP SOCKET 28POS TIN

    Aries Electronics

    4,579
    RFQ
    28-6501-20

    Datasheet

    28-6501-20 501 Bulk Active DIP, 0.6" (15.24mm) Row Spacing 28 (2 x 14) 0.100" (2.54mm) Tin 200.0µin (5.08µm) Phosphor Bronze Through Hole Closed Frame Wire Wrap 0.100" (2.54mm) Tin 200.0µin (5.08µm) Phosphor Bronze Polyamide (PA46), Nylon 4/6, Glass Filled -55°C ~ 105°C
    06-71187-10

    06-71187-10

    CONN SOCKET SIP 6POS TIN

    Aries Electronics

    4,598
    RFQ
    06-71187-10

    Datasheet

    06-71187-10 700 Elevator Strip-Line™ Bulk Active SIP 6 (1 x 6) 0.100" (2.54mm) Tin 200.0µin (5.08µm) Phosphor Bronze Through Hole Elevated Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Phosphor Bronze Polyamide (PA46), Nylon 4/6, Glass Filled -55°C ~ 105°C
    06-7360-10

    06-7360-10

    CONN SOCKET SIP 6POS TIN

    Aries Electronics

    4,254
    RFQ
    06-7360-10

    Datasheet

    06-7360-10 700 Elevator Strip-Line™ Bulk Active SIP 6 (1 x 6) 0.100" (2.54mm) Tin 200.0µin (5.08µm) Phosphor Bronze Through Hole Elevated Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Phosphor Bronze Polyamide (PA46), Nylon 4/6, Glass Filled -55°C ~ 105°C
    06-7425-10

    06-7425-10

    CONN SOCKET SIP 6POS TIN

    Aries Electronics

    2,476
    RFQ
    06-7425-10

    Datasheet

    06-7425-10 700 Elevator Strip-Line™ Bulk Active SIP 6 (1 x 6) 0.100" (2.54mm) Tin 200.0µin (5.08µm) Phosphor Bronze Through Hole Elevated Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Phosphor Bronze Polyamide (PA46), Nylon 4/6, Glass Filled -55°C ~ 105°C
    06-7755-10

    06-7755-10

    CONN SOCKET SIP 6POS TIN

    Aries Electronics

    3,616
    RFQ
    06-7755-10

    Datasheet

    06-7755-10 700 Elevator Strip-Line™ Bulk Active SIP 6 (1 x 6) 0.100" (2.54mm) Tin 200.0µin (5.08µm) Phosphor Bronze Through Hole Elevated Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Phosphor Bronze Polyamide (PA46), Nylon 4/6, Glass Filled -55°C ~ 105°C
    64-9513-10T

    64-9513-10T

    CONN IC DIP SOCKET 64POS GOLD

    Aries Electronics

    2,653
    RFQ
    64-9513-10T

    Datasheet

    64-9513-10T Lo-PRO®file, 513 Bulk Active DIP, 0.9" (22.86mm) Row Spacing 64 (2 x 32) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Closed Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled -55°C ~ 105°C
    14-6511-11

    14-6511-11

    CONN IC DIP SOCKET 14POS GOLD

    Aries Electronics

    2,334
    RFQ
    14-6511-11

    Datasheet

    14-6511-11 511 Bulk Active DIP, 0.6" (15.24mm) Row Spacing 14 (2 x 7) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Phosphor Bronze Through Hole Closed Frame Solder 0.100" (2.54mm) Gold 10.0µin (0.25µm) Phosphor Bronze Polyamide (PA46), Nylon 4/6, Glass Filled -55°C ~ 125°C
    18-3518-11H

    18-3518-11H

    CONN IC DIP SOCKET 18POS GOLD

    Aries Electronics

    2,573
    RFQ
    18-3518-11H

    Datasheet

    18-3518-11H 518 Bulk Active DIP, 0.3" (7.62mm) Row Spacing 18 (2 x 9) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Gold 10.0µin (0.25µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled -
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