Available 24/7 at SENICO ELECTRONICS INTL CO., LIMITED
    SENICO ELECTRONICS INTL CO., LIMITED

    IC Sockets

    Manufacturer Series Packaging Product Status Type Number of Positions or Pins (Grid) Pitch - Mating Contact Finish - Mating Contact Finish Thickness - Mating Contact Material - Mating Mounting Type Features Termination Pitch - Post Contact Finish - Post Contact Finish Thickness - Post Contact Material - Post Housing Material Operating Temperature















































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































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    Photo Mfr. Part # Availability Price Quantity Datasheet RoHs Series Packaging Product Status Type Number of Positions or Pins (Grid) Pitch - Mating Contact Finish - Mating Contact Finish Thickness - Mating Contact Material - Mating Mounting Type Features Termination Pitch - Post Contact Finish - Post Contact Finish Thickness - Post Contact Material - Post Housing Material Operating Temperature
    14-3508-201

    14-3508-201

    CONN IC DIP SOCKET 14POS GOLD

    Aries Electronics

    4,739
    RFQ
    14-3508-201

    Datasheet

    14-3508-201 508 Bulk Active DIP, 0.3" (7.62mm) Row Spacing 14 (2 x 7) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame Wire Wrap 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled -55°C ~ 105°C
    14-3508-301

    14-3508-301

    CONN IC DIP SOCKET 14POS GOLD

    Aries Electronics

    3,651
    RFQ
    14-3508-301

    Datasheet

    14-3508-301 508 Bulk Active DIP, 0.3" (7.62mm) Row Spacing 14 (2 x 7) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame Wire Wrap 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled -55°C ~ 105°C
    16-6810-90C

    16-6810-90C

    CONN IC DIP SOCKET 16POS GOLD

    Aries Electronics

    3,245
    RFQ
    16-6810-90C

    Datasheet

    16-6810-90C Vertisockets™ 800 Bulk Active DIP, 0.6" (15.24mm) Row Spacing 16 (2 x 8) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole, Right Angle, Vertical Closed Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled -
    14-0503-21

    14-0503-21

    CONN SOCKET SIP 14POS GOLD

    Aries Electronics

    3,189
    RFQ
    14-0503-21

    Datasheet

    14-0503-21 0503 Bulk Active SIP 14 (1 x 14) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole - Wire Wrap 0.100" (2.54mm) Gold 10.0µin (0.25µm) Brass Polyamide (PA), Nylon, Glass Filled -
    14-0503-31

    14-0503-31

    CONN SOCKET SIP 14POS GOLD

    Aries Electronics

    2,110
    RFQ
    14-0503-31

    Datasheet

    14-0503-31 0503 Bulk Active SIP 14 (1 x 14) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole - Wire Wrap 0.100" (2.54mm) Gold 10.0µin (0.25µm) Brass Polyamide (PA), Nylon, Glass Filled -
    20-823-90TWR

    20-823-90TWR

    CONN IC DIP SOCKET 20POS TIN

    Aries Electronics

    4,243
    RFQ
    20-823-90TWR

    Datasheet

    20-823-90TWR Vertisockets™ 800 Bulk Active DIP, 0.3" (7.62mm) Row Spacing 20 (2 x 10) 0.100" (2.54mm) Tin 200.0µin (5.08µm) Phosphor Bronze Through Hole, Right Angle, Horizontal Closed Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Phosphor Bronze Polyamide (PA46), Nylon 4/6 -
    22-6823-90T

    22-6823-90T

    CONN IC DIP SOCKET 22POS TIN

    Aries Electronics

    3,755
    RFQ
    22-6823-90T

    Datasheet

    22-6823-90T Vertisockets™ 800 Bulk Active DIP, 0.6" (15.24mm) Row Spacing 22 (2 x 11) 0.100" (2.54mm) Tin 200.0µin (5.08µm) Phosphor Bronze Through Hole, Right Angle, Horizontal Closed Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Phosphor Bronze Polyamide (PA46), Nylon 4/6 -
    08-6810-90

    08-6810-90

    CONN IC DIP SOCKET 8POS GOLD

    Aries Electronics

    2,690
    RFQ
    08-6810-90

    Datasheet

    08-6810-90 Vertisockets™ 800 Bulk Active DIP, 0.6" (15.24mm) Row Spacing 8 (2 x 4) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Phosphor Bronze Through Hole, Right Angle, Vertical Closed Frame Solder 0.100" (2.54mm) Gold 10.0µin (0.25µm) Phosphor Bronze Polyamide (PA46), Nylon 4/6 -
    1107659-01

    1107659-01

    700 ELEVATOR STRIP-LINE SOCKET

    Aries Electronics

    2,379
    RFQ
    1107659-01

    Datasheet

    1107659-01 - - Active - - - - - - - - - - - - - - -
    32-9513-11

    32-9513-11

    CONN IC DIP SOCKET 32POS GOLD

    Aries Electronics

    2,430
    RFQ
    32-9513-11

    Datasheet

    32-9513-11 Lo-PRO®file, 513 Bulk Active DIP, 0.9" (22.86mm) Row Spacing 32 (2 x 16) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Closed Frame Solder 0.100" (2.54mm) Gold 10.0µin (0.25µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled -55°C ~ 105°C
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