Available 24/7 at SENICO ELECTRONICS INTL CO., LIMITED
    SENICO ELECTRONICS INTL CO., LIMITED

    IC Sockets

    Manufacturer Series Packaging Product Status Type Number of Positions or Pins (Grid) Pitch - Mating Contact Finish - Mating Contact Finish Thickness - Mating Contact Material - Mating Mounting Type Features Termination Pitch - Post Contact Finish - Post Contact Finish Thickness - Post Contact Material - Post Housing Material Operating Temperature















































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































    Reset All
    Apply All
    Result:
    Photo Mfr. Part # Availability Price Quantity Datasheet RoHs Series Packaging Product Status Type Number of Positions or Pins (Grid) Pitch - Mating Contact Finish - Mating Contact Finish Thickness - Mating Contact Material - Mating Mounting Type Features Termination Pitch - Post Contact Finish - Post Contact Finish Thickness - Post Contact Material - Post Housing Material Operating Temperature
    30-3503-20

    30-3503-20

    CONN IC DIP SOCKET 30POS GOLD

    Aries Electronics

    2,374
    RFQ
    30-3503-20

    Datasheet

    30-3503-20 503 Bulk Active DIP, 0.3" (7.62mm) Row Spacing 30 (2 x 15) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Closed Frame Wire Wrap 0.100" (2.54mm) Tin 200.0µin (5.08µm) Phosphor Bronze Polyamide (PA46), Nylon 4/6, Glass Filled -55°C ~ 105°C
    30-3503-30

    30-3503-30

    CONN IC DIP SOCKET 30POS GOLD

    Aries Electronics

    3,077
    RFQ
    30-3503-30

    Datasheet

    30-3503-30 503 Bulk Active DIP, 0.3" (7.62mm) Row Spacing 30 (2 x 15) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Closed Frame Wire Wrap 0.100" (2.54mm) Tin 200.0µin (5.08µm) Phosphor Bronze Polyamide (PA46), Nylon 4/6, Glass Filled -55°C ~ 105°C
    20-810-90TWR

    20-810-90TWR

    CONN IC DIP SOCKET 20POS TIN

    Aries Electronics

    4,771
    RFQ
    20-810-90TWR

    Datasheet

    20-810-90TWR Vertisockets™ 800 Bulk Active DIP, 0.3" (7.62mm) Row Spacing 20 (2 x 10) 0.100" (2.54mm) Tin 200.0µin (5.08µm) Phosphor Bronze Through Hole, Right Angle, Vertical Closed Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Phosphor Bronze Polyamide (PA46), Nylon 4/6 -
    30-9513-10H

    30-9513-10H

    CONN IC DIP SOCKET 30POS GOLD

    Aries Electronics

    4,011
    RFQ
    30-9513-10H

    Datasheet

    30-9513-10H Lo-PRO®file, 513 Bulk Active DIP, 0.9" (22.86mm) Row Spacing 30 (2 x 15) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Closed Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled -55°C ~ 105°C
    20-3508-30

    20-3508-30

    CONN IC DIP SOCKET 20POS GOLD

    Aries Electronics

    4,905
    RFQ
    20-3508-30

    Datasheet

    20-3508-30 508 Bulk Active DIP, 0.3" (7.62mm) Row Spacing 20 (2 x 10) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame Wire Wrap 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled -55°C ~ 105°C
    16-8450-610C

    16-8450-610C

    CONN IC DIP SOCKET 16POS GOLD

    Aries Electronics

    2,123
    RFQ
    16-8450-610C

    Datasheet

    16-8450-610C 8 Bulk Active DIP, 0.6" (15.24mm) Row Spacing 16 (2 x 8) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Closed Frame, Elevated Solder 0.100" (2.54mm) Gold 10.0µin (0.25µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled -55°C ~ 105°C
    16-8500-610C

    16-8500-610C

    CONN IC DIP SOCKET 16POS GOLD

    Aries Electronics

    2,900
    RFQ
    16-8500-610C

    Datasheet

    16-8500-610C 8 Bulk Active DIP, 0.6" (15.24mm) Row Spacing 16 (2 x 8) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Closed Frame, Elevated Solder 0.100" (2.54mm) Gold 10.0µin (0.25µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled -55°C ~ 105°C
    65-PGM10008-10

    65-PGM10008-10

    CONN SOCKET PGA GOLD

    Aries Electronics

    3,485
    RFQ
    65-PGM10008-10

    Datasheet

    65-PGM10008-10 PGM Bulk Active PGA - 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole - Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled -55°C ~ 105°C
    30-820-90C

    30-820-90C

    CONN IC DIP SOCKET 30POS GOLD

    Aries Electronics

    2,270
    RFQ
    30-820-90C

    Datasheet

    30-820-90C Vertisockets™ 800 Bulk Active DIP, 0.3" (7.62mm) Row Spacing 30 (2 x 15) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole, Right Angle, Horizontal Closed Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled -55°C ~ 105°C
    30-822-90C

    30-822-90C

    CONN IC DIP SOCKET 30POS GOLD

    Aries Electronics

    3,151
    RFQ
    30-822-90C

    Datasheet

    30-822-90C Vertisockets™ 800 Bulk Active DIP, 0.3" (7.62mm) Row Spacing 30 (2 x 15) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole, Right Angle, Horizontal Closed Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled -55°C ~ 105°C
    Total 4131 Record«Prev1... 223224225226227228229230...414Next»
    HOME

    HOME

    PRODUCT

    PRODUCT

    PHONE

    PHONE

    USER

    USER