Available 24/7 at SENICO ELECTRONICS INTL CO., LIMITED
    SENICO ELECTRONICS INTL CO., LIMITED

    IC Sockets

    Manufacturer Series Packaging Product Status Type Number of Positions or Pins (Grid) Pitch - Mating Contact Finish - Mating Contact Finish Thickness - Mating Contact Material - Mating Mounting Type Features Termination Pitch - Post Contact Finish - Post Contact Finish Thickness - Post Contact Material - Post Housing Material Operating Temperature















































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































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    Photo Mfr. Part # Availability Price Quantity Datasheet RoHs Series Packaging Product Status Type Number of Positions or Pins (Grid) Pitch - Mating Contact Finish - Mating Contact Finish Thickness - Mating Contact Material - Mating Mounting Type Features Termination Pitch - Post Contact Finish - Post Contact Finish Thickness - Post Contact Material - Post Housing Material Operating Temperature
    30-823-90C

    30-823-90C

    CONN IC DIP SOCKET 30POS GOLD

    Aries Electronics

    3,946
    RFQ
    30-823-90C

    Datasheet

    30-823-90C Vertisockets™ 800 Bulk Active DIP, 0.3" (7.62mm) Row Spacing 30 (2 x 15) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole, Right Angle, Horizontal Closed Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled -55°C ~ 105°C
    37-PGM10012-10

    37-PGM10012-10

    CONN SOCKET PGA GOLD

    Aries Electronics

    2,281
    RFQ
    37-PGM10012-10

    Datasheet

    37-PGM10012-10 PGM Bulk Active PGA - 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole - Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled -55°C ~ 105°C
    20-81000-610C

    20-81000-610C

    CONN IC DIP SOCKET 20POS GOLD

    Aries Electronics

    2,965
    RFQ
    20-81000-610C

    Datasheet

    20-81000-610C 8 Bulk Active DIP, 0.6" (15.24mm) Row Spacing 20 (2 x 10) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Closed Frame, Elevated Solder 0.100" (2.54mm) Gold 10.0µin (0.25µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled -55°C ~ 105°C
    20-81250-610C

    20-81250-610C

    CONN IC DIP SOCKET 20POS GOLD

    Aries Electronics

    2,143
    RFQ
    20-81250-610C

    Datasheet

    20-81250-610C 8 Bulk Active DIP, 0.6" (15.24mm) Row Spacing 20 (2 x 10) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Closed Frame, Elevated Solder 0.100" (2.54mm) Gold 10.0µin (0.25µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled -55°C ~ 105°C
    20-8400-610C

    20-8400-610C

    CONN IC DIP SOCKET 20POS GOLD

    Aries Electronics

    2,816
    RFQ
    20-8400-610C

    Datasheet

    20-8400-610C 8 Bulk Active DIP, 0.6" (15.24mm) Row Spacing 20 (2 x 10) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Closed Frame, Elevated Solder 0.100" (2.54mm) Gold 10.0µin (0.25µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled -55°C ~ 105°C
    20-8500-610C

    20-8500-610C

    CONN IC DIP SOCKET 20POS GOLD

    Aries Electronics

    2,653
    RFQ
    20-8500-610C

    Datasheet

    20-8500-610C 8 Bulk Active DIP, 0.6" (15.24mm) Row Spacing 20 (2 x 10) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Closed Frame, Elevated Solder 0.100" (2.54mm) Gold 10.0µin (0.25µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled -55°C ~ 105°C
    20-8675-610C

    20-8675-610C

    CONN IC DIP SOCKET 20POS GOLD

    Aries Electronics

    2,818
    RFQ
    20-8675-610C

    Datasheet

    20-8675-610C 8 Bulk Active DIP, 0.6" (15.24mm) Row Spacing 20 (2 x 10) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Closed Frame, Elevated Solder 0.100" (2.54mm) Gold 10.0µin (0.25µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled -55°C ~ 105°C
    20-8724-610C

    20-8724-610C

    CONN IC DIP SOCKET 20POS GOLD

    Aries Electronics

    4,129
    RFQ
    20-8724-610C

    Datasheet

    20-8724-610C 8 Bulk Active DIP, 0.6" (15.24mm) Row Spacing 20 (2 x 10) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Closed Frame, Elevated Solder 0.100" (2.54mm) Gold 10.0µin (0.25µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled -55°C ~ 105°C
    20-8950-610C

    20-8950-610C

    CONN IC DIP SOCKET 20POS GOLD

    Aries Electronics

    4,194
    RFQ
    20-8950-610C

    Datasheet

    20-8950-610C 8 Bulk Active DIP, 0.6" (15.24mm) Row Spacing 20 (2 x 10) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Closed Frame, Elevated Solder 0.100" (2.54mm) Gold 10.0µin (0.25µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled -55°C ~ 105°C
    66-PGM11054-10

    66-PGM11054-10

    CONN SOCKET PGA GOLD

    Aries Electronics

    3,583
    RFQ
    66-PGM11054-10

    Datasheet

    66-PGM11054-10 PGM Bulk Active PGA - 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole - Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled -55°C ~ 105°C
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