Available 24/7 at SENICO ELECTRONICS INTL CO., LIMITED
    SENICO ELECTRONICS INTL CO., LIMITED

    IC Sockets

    Manufacturer Series Packaging Product Status Type Number of Positions or Pins (Grid) Pitch - Mating Contact Finish - Mating Contact Finish Thickness - Mating Contact Material - Mating Mounting Type Features Termination Pitch - Post Contact Finish - Post Contact Finish Thickness - Post Contact Material - Post Housing Material Operating Temperature















































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































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    Photo Mfr. Part # Availability Price Quantity Datasheet RoHs Series Packaging Product Status Type Number of Positions or Pins (Grid) Pitch - Mating Contact Finish - Mating Contact Finish Thickness - Mating Contact Material - Mating Mounting Type Features Termination Pitch - Post Contact Finish - Post Contact Finish Thickness - Post Contact Material - Post Housing Material Operating Temperature
    05-0518-11H

    05-0518-11H

    CONN SOCKET SIP 5POS GOLD

    Aries Electronics

    3,989
    RFQ
    05-0518-11H

    Datasheet

    05-0518-11H 518 Bulk Active SIP 5 (1 x 5) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Gold 10.0µin (0.25µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled -
    13-0518-10

    13-0518-10

    CONN SOCKET SIP 13POS GOLD

    Aries Electronics

    4,505
    RFQ
    13-0518-10

    Datasheet

    13-0518-10 518 Bulk Active SIP 13 (1 x 13) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled -
    03-0508-30

    03-0508-30

    CONN SOCKET SIP 3POS GOLD

    Aries Electronics

    2,558
    RFQ
    03-0508-30

    Datasheet

    03-0508-30 508 Bulk Active SIP 3 (1 x 3) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole - Wire Wrap - Tin 200.0µin (5.08µm) Brass Polyamide (PA46), Nylon 4/6 -55°C ~ 105°C
    10-2513-10T

    10-2513-10T

    CONN IC DIP SOCKET 10POS GOLD

    Aries Electronics

    4,853
    RFQ
    10-2513-10T

    Datasheet

    10-2513-10T Lo-PRO®file, 513 Bulk Active DIP, 0.2" (5.08mm) Row Spacing 10 (2 x 5) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Closed Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled -55°C ~ 105°C
    09-0518-11

    09-0518-11

    CONN SOCKET SIP 9POS GOLD

    Aries Electronics

    3,219
    RFQ
    09-0518-11

    Datasheet

    09-0518-11 518 Bulk Active SIP 9 (1 x 9) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Gold 10.0µin (0.25µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled -
    11-0518-10H

    11-0518-10H

    CONN SOCKET SIP 11POS GOLD

    Aries Electronics

    2,533
    RFQ
    11-0518-10H

    Datasheet

    11-0518-10H 518 Bulk Active SIP 11 (1 x 11) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled -
    12-0518-10T

    12-0518-10T

    CONN SOCKET SIP 12POS GOLD

    Aries Electronics

    4,008
    RFQ
    12-0518-10T

    Datasheet

    12-0518-10T 518 Bulk Active SIP 12 (1 x 12) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled -
    12-1518-10T

    12-1518-10T

    CONN IC DIP SOCKET 12POS GOLD

    Aries Electronics

    4,443
    RFQ
    12-1518-10T

    Datasheet

    12-1518-10T 518 Bulk Active DIP, 0.2" (5.08mm) Row Spacing 12 (2 x 6) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled -
    04-0513-11H

    04-0513-11H

    CONN SOCKET SIP 4POS GOLD

    Aries Electronics

    3,189
    RFQ
    04-0513-11H

    Datasheet

    04-0513-11H 0513 Bulk Active SIP 4 (1 x 4) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole - Solder 0.100" (2.54mm) Gold 10.0µin (0.25µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled -
    08-0513-10

    08-0513-10

    CONN SOCKET SIP 8POS GOLD

    Aries Electronics

    2,375
    RFQ
    08-0513-10

    Datasheet

    08-0513-10 0513 Bulk Active SIP 8 (1 x 8) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole - Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled -
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