Available 24/7 at SENICO ELECTRONICS INTL CO., LIMITED
    SENICO ELECTRONICS INTL CO., LIMITED

    IC Sockets

    Manufacturer Series Packaging Product Status Type Number of Positions or Pins (Grid) Pitch - Mating Contact Finish - Mating Contact Finish Thickness - Mating Contact Material - Mating Mounting Type Features Termination Pitch - Post Contact Finish - Post Contact Finish Thickness - Post Contact Material - Post Housing Material Operating Temperature















































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































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    Photo Mfr. Part # Availability Price Quantity Datasheet RoHs Series Packaging Product Status Type Number of Positions or Pins (Grid) Pitch - Mating Contact Finish - Mating Contact Finish Thickness - Mating Contact Material - Mating Mounting Type Features Termination Pitch - Post Contact Finish - Post Contact Finish Thickness - Post Contact Material - Post Housing Material Operating Temperature
    06-3518-10H

    06-3518-10H

    CONN IC DIP SOCKET 6POS GOLD

    Aries Electronics

    3,589
    RFQ
    06-3518-10H

    Datasheet

    06-3518-10H 518 Bulk Active DIP, 0.3" (7.62mm) Row Spacing 6 (2 x 3) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled -
    14-0518-10

    14-0518-10

    14 PIN SOCKET

    Aries Electronics

    2,390
    RFQ

    -

    14-0518-10 518 - Active SIP 14 (1 x 14) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled -
    08-6513-10

    08-6513-10

    CONN IC DIP SOCKET 8POS GOLD

    Aries Electronics

    3,771
    RFQ
    08-6513-10

    Datasheet

    08-6513-10 Lo-PRO®file, 513 Bulk Active DIP, 0.6" (15.24mm) Row Spacing 8 (2 x 4) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Closed Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled -55°C ~ 105°C
    11-0513-10T

    11-0513-10T

    CONN SOCKET SIP 11POS GOLD

    Aries Electronics

    3,686
    RFQ
    11-0513-10T

    Datasheet

    11-0513-10T 0513 Bulk Active SIP 11 (1 x 11) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole - Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled -
    14-1518-10

    14-1518-10

    CONN IC DIP SOCKET 14POS GOLD

    Aries Electronics

    2,120
    RFQ
    14-1518-10

    Datasheet

    14-1518-10 518 Bulk Active DIP, 0.2" (5.08mm) Row Spacing 14 (2 x 7) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled -
    08-0518-00

    08-0518-00

    CONN SOCKET SIP 8POS GOLD

    Aries Electronics

    4,493
    RFQ
    08-0518-00

    Datasheet

    08-0518-00 518 Bulk Active SIP 8 (1 x 8) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Surface Mount Open Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled -
    12-0518-10H

    12-0518-10H

    CONN SOCKET SIP 12POS GOLD

    Aries Electronics

    3,888
    RFQ
    12-0518-10H

    Datasheet

    12-0518-10H 518 Bulk Active SIP 12 (1 x 12) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled -
    12-1518-10H

    12-1518-10H

    CONN IC DIP SOCKET 12POS GOLD

    Aries Electronics

    3,960
    RFQ
    12-1518-10H

    Datasheet

    12-1518-10H 518 Bulk Active DIP, 0.2" (5.08mm) Row Spacing 12 (2 x 6) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled -
    13-0518-10T

    13-0518-10T

    CONN SOCKET SIP 13POS GOLD

    Aries Electronics

    3,136
    RFQ
    13-0518-10T

    Datasheet

    13-0518-10T 518 Bulk Active SIP 13 (1 x 13) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled -
    10-0518-11

    10-0518-11

    CONN SOCKET SIP 10POS GOLD

    Aries Electronics

    4,340
    RFQ
    10-0518-11

    Datasheet

    10-0518-11 518 Bulk Active SIP 10 (1 x 10) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Gold 10.0µin (0.25µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled -
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