Available 24/7 at SENICO ELECTRONICS INTL CO., LIMITED
    SENICO ELECTRONICS INTL CO., LIMITED

    IC Sockets

    Manufacturer Series Packaging Product Status Type Number of Positions or Pins (Grid) Pitch - Mating Contact Finish - Mating Contact Finish Thickness - Mating Contact Material - Mating Mounting Type Features Termination Pitch - Post Contact Finish - Post Contact Finish Thickness - Post Contact Material - Post Housing Material Operating Temperature















































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































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    Photo Mfr. Part # Availability Price Quantity Datasheet RoHs Series Packaging Product Status Type Number of Positions or Pins (Grid) Pitch - Mating Contact Finish - Mating Contact Finish Thickness - Mating Contact Material - Mating Mounting Type Features Termination Pitch - Post Contact Finish - Post Contact Finish Thickness - Post Contact Material - Post Housing Material Operating Temperature
    13-0513-10T

    13-0513-10T

    CONN SOCKET SIP 13POS GOLD

    Aries Electronics

    2,778
    RFQ
    13-0513-10T

    Datasheet

    13-0513-10T 0513 Bulk Active SIP 13 (1 x 13) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole - Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled -
    14-0518-10H

    14-0518-10H

    CONN SOCKET SIP 14POS GOLD

    Aries Electronics

    2,684
    RFQ
    14-0518-10H

    Datasheet

    14-0518-10H 518 Bulk Active SIP 14 (1 x 14) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled -
    14-1518-10H

    14-1518-10H

    CONN IC DIP SOCKET 14POS GOLD

    Aries Electronics

    3,083
    RFQ
    14-1518-10H

    Datasheet

    14-1518-10H 518 Bulk Active DIP, 0.2" (5.08mm) Row Spacing 14 (2 x 7) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled -
    15-0518-10T

    15-0518-10T

    CONN SOCKET SIP 15POS GOLD

    Aries Electronics

    2,362
    RFQ
    15-0518-10T

    Datasheet

    15-0518-10T 518 Bulk Active SIP 15 (1 x 15) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled -
    04-0508-20

    04-0508-20

    CONN SOCKET SIP 4POS GOLD

    Aries Electronics

    3,561
    RFQ
    04-0508-20

    Datasheet

    04-0508-20 508 Bulk Active SIP 4 (1 x 4) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole - Wire Wrap - Tin 200.0µin (5.08µm) Brass Polyamide (PA46), Nylon 4/6 -55°C ~ 105°C
    04-1508-20

    04-1508-20

    CONN IC DIP SOCKET 4POS GOLD

    Aries Electronics

    2,721
    RFQ
    04-1508-20

    Datasheet

    04-1508-20 508 Bulk Active DIP, 0.2" (5.08mm) Row Spacing 4 (2 x 2) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Closed Frame Wire Wrap 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Polyamide (PA46), Nylon 4/6 -55°C ~ 105°C
    20-3518-10T

    20-3518-10T

    CONN IC DIP SOCKET 20POS GOLD

    Aries Electronics

    4,852
    RFQ
    20-3518-10T

    Datasheet

    20-3518-10T 518 Bulk Active DIP, 0.3" (7.62mm) Row Spacing 20 (2 x 10) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled -
    14-3513-10

    14-3513-10

    CONN IC DIP SOCKET 14POS GOLD

    Aries Electronics

    4,761
    RFQ
    14-3513-10

    Datasheet

    14-3513-10 Lo-PRO®file, 513 Bulk Active DIP, 0.3" (7.62mm) Row Spacing 14 (2 x 7) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Closed Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled -55°C ~ 105°C
    03-0508-20

    03-0508-20

    CONN SOCKET SIP 3POS GOLD

    Aries Electronics

    3,526
    RFQ
    03-0508-20

    Datasheet

    03-0508-20 508 Bulk Active SIP 3 (1 x 3) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole - Wire Wrap - Tin 200.0µin (5.08µm) Brass Polyamide (PA46), Nylon 4/6 -55°C ~ 105°C
    17-0518-10

    17-0518-10

    CONN SOCKET SIP 17POS GOLD

    Aries Electronics

    2,649
    RFQ
    17-0518-10

    Datasheet

    17-0518-10 518 Bulk Active SIP 17 (1 x 17) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled -
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