Available 24/7 at SENICO ELECTRONICS INTL CO., LIMITED
    SENICO ELECTRONICS INTL CO., LIMITED

    IC Sockets

    Manufacturer Series Packaging Product Status Type Number of Positions or Pins (Grid) Pitch - Mating Contact Finish - Mating Contact Finish Thickness - Mating Contact Material - Mating Mounting Type Features Termination Pitch - Post Contact Finish - Post Contact Finish Thickness - Post Contact Material - Post Housing Material Operating Temperature















































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































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    Photo Mfr. Part # Availability Price Quantity Datasheet RoHs Series Packaging Product Status Type Number of Positions or Pins (Grid) Pitch - Mating Contact Finish - Mating Contact Finish Thickness - Mating Contact Material - Mating Mounting Type Features Termination Pitch - Post Contact Finish - Post Contact Finish Thickness - Post Contact Material - Post Housing Material Operating Temperature
    32-6552-16

    32-6552-16

    CONN IC DIP SOCKET ZIF 32POS

    Aries Electronics

    2,910
    RFQ
    32-6552-16

    Datasheet

    32-6552-16 55 Bulk Active DIP, ZIF (ZIP), 0.6" (15.24mm) Row Spacing 32 (2 x 16) 0.100" (2.54mm) Nickel Boron 50.0µin (1.27µm) Beryllium Copper Through Hole Closed Frame Solder 0.100" (2.54mm) Nickel Boron 50.0µin (1.27µm) Beryllium Copper Polyphenylene Sulfide (PPS), Glass Filled -
    32-6553-16

    32-6553-16

    CONN IC DIP SOCKET ZIF 32POS

    Aries Electronics

    4,844
    RFQ
    32-6553-16

    Datasheet

    32-6553-16 55 Bulk Active DIP, ZIF (ZIP), 0.6" (15.24mm) Row Spacing 32 (2 x 16) 0.100" (2.54mm) Nickel Boron 50.0µin (1.27µm) Beryllium Nickel Through Hole Closed Frame Solder 0.100" (2.54mm) Nickel Boron 50.0µin (1.27µm) Beryllium Nickel Polyetheretherketone (PEEK), Glass Filled -55°C ~ 250°C
    32-3554-16

    32-3554-16

    CONN IC DIP SOCKET ZIF 32POS

    Aries Electronics

    4,492
    RFQ
    32-3554-16

    Datasheet

    32-3554-16 55 Bulk Active DIP, ZIF (ZIP), 0.3" (7.62mm) Row Spacing 32 (2 x 16) 0.100" (2.54mm) Nickel Boron 50.0µin (1.27µm) Beryllium Copper Through Hole Closed Frame Solder 0.100" (2.54mm) Nickel Boron 50.0µin (1.27µm) Beryllium Copper Polyphenylene Sulfide (PPS), Glass Filled -
    42-6556-40

    42-6556-40

    CONN IC DIP SOCKET 42POS GOLD

    Aries Electronics

    4,124
    RFQ
    42-6556-40

    Datasheet

    42-6556-40 6556 Bulk Active DIP, 0.6" (15.24mm) Row Spacing 42 (2 x 21) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame Solder Cup 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Polyphenylene Sulfide (PPS), Glass Filled -
    144-PGM12001-41

    144-PGM12001-41

    CONN SOCKET PGA GOLD

    Aries Electronics

    4,592
    RFQ
    144-PGM12001-41

    Datasheet

    144-PGM12001-41 PGM Bulk Active PGA - 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole - Solder 0.100" (2.54mm) Gold 10.0µin (0.25µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled -55°C ~ 125°C
    28-536-11

    28-536-11

    CONN SOCKET PLCC ZIF 28POS GOLD

    Aries Electronics

    4,191
    RFQ

    -

    28-536-11 536 - Obsolete PLCC, ZIF (ZIP) 28 (4 x 7) 0.050" (1.27mm) Gold 12.0µin (0.30µm) - Through Hole Open Frame - - - - - - -
    144-PGM12001-51

    144-PGM12001-51

    CONN SOCKET PGA GOLD

    Aries Electronics

    2,376
    RFQ
    144-PGM12001-51

    Datasheet

    144-PGM12001-51 PGM Bulk Active PGA - 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole - Solder 0.100" (2.54mm) Gold 10.0µin (0.25µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled -55°C ~ 125°C
    32-6574-16

    32-6574-16

    CONN IC DIP SOCKET ZIF 32POS TIN

    Aries Electronics

    2,768
    RFQ
    32-6574-16

    Datasheet

    32-6574-16 57 Bulk Active DIP, ZIF (ZIP), 0.6" (15.24mm) Row Spacing 32 (2 x 16) 0.100" (2.54mm) Tin 200.0µin (5.08µm) Beryllium Copper Through Hole Closed Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Beryllium Copper Polyphenylene Sulfide (PPS), Glass Filled -
    28-3551-16

    28-3551-16

    CONN IC DIP SOCKET ZIF 28POS

    Aries Electronics

    4,718
    RFQ
    28-3551-16

    Datasheet

    28-3551-16 55 Bulk Active DIP, ZIF (ZIP), 0.3" (7.62mm) Row Spacing 28 (2 x 14) 0.100" (2.54mm) Nickel Boron 50.0µin (1.27µm) Beryllium Copper Through Hole Closed Frame Solder 0.100" (2.54mm) Nickel Boron 50.0µin (1.27µm) Beryllium Copper Polyphenylene Sulfide (PPS), Glass Filled -
    28-3553-16

    28-3553-16

    CONN IC DIP SOCKET ZIF 28POS

    Aries Electronics

    4,288
    RFQ
    28-3553-16

    Datasheet

    28-3553-16 55 Bulk Active DIP, ZIF (ZIP), 0.3" (7.62mm) Row Spacing 28 (2 x 14) 0.100" (2.54mm) Nickel Boron 50.0µin (1.27µm) Beryllium Copper Through Hole Closed Frame Solder 0.100" (2.54mm) Nickel Boron 50.0µin (1.27µm) Beryllium Copper Polyphenylene Sulfide (PPS), Glass Filled -
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