Available 24/7 at SENICO ELECTRONICS INTL CO., LIMITED
    SENICO ELECTRONICS INTL CO., LIMITED

    IC Sockets

    Manufacturer Series Packaging Product Status Type Number of Positions or Pins (Grid) Pitch - Mating Contact Finish - Mating Contact Finish Thickness - Mating Contact Material - Mating Mounting Type Features Termination Pitch - Post Contact Finish - Post Contact Finish Thickness - Post Contact Material - Post Housing Material Operating Temperature















































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































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    Photo Mfr. Part # Availability Price Quantity Datasheet RoHs Series Packaging Product Status Type Number of Positions or Pins (Grid) Pitch - Mating Contact Finish - Mating Contact Finish Thickness - Mating Contact Material - Mating Mounting Type Features Termination Pitch - Post Contact Finish - Post Contact Finish Thickness - Post Contact Material - Post Housing Material Operating Temperature
    180-PGM18007-41

    180-PGM18007-41

    CONN SOCKET PGA GOLD

    Aries Electronics

    4,194
    RFQ
    180-PGM18007-41

    Datasheet

    180-PGM18007-41 PGM Bulk Active PGA - 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole - Solder 0.100" (2.54mm) Gold 10.0µin (0.25µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled -55°C ~ 125°C
    132-PGM13079-10H

    132-PGM13079-10H

    CONN SOCKET PGA GOLD

    Aries Electronics

    4,686
    RFQ
    132-PGM13079-10H

    Datasheet

    132-PGM13079-10H PGM Bulk Active PGA - 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole - Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled -55°C ~ 105°C
    132-PGM14015-10H

    132-PGM14015-10H

    CONN SOCKET PGA GOLD

    Aries Electronics

    3,781
    RFQ
    132-PGM14015-10H

    Datasheet

    132-PGM14015-10H PGM Bulk Active PGA - 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole - Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled -55°C ~ 105°C
    36-6556-41

    36-6556-41

    CONN IC DIP SOCKET 36POS GOLD

    Aries Electronics

    3,881
    RFQ
    36-6556-41

    Datasheet

    36-6556-41 6556 Bulk Active DIP, 0.6" (15.24mm) Row Spacing 36 (2 x 18) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame Solder Cup 0.100" (2.54mm) Gold 10.0µin (0.25µm) Brass Polyphenylene Sulfide (PPS), Glass Filled -
    133-PGM13052-10H

    133-PGM13052-10H

    CONN SOCKET PGA GOLD

    Aries Electronics

    4,981
    RFQ
    133-PGM13052-10H

    Datasheet

    133-PGM13052-10H PGM Bulk Active PGA - 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole - Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled -55°C ~ 105°C
    133-PGM13067-10H

    133-PGM13067-10H

    CONN SOCKET PGA GOLD

    Aries Electronics

    2,749
    RFQ
    133-PGM13067-10H

    Datasheet

    133-PGM13067-10H PGM Bulk Active PGA - 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole - Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled -55°C ~ 105°C
    133-PGM14013-10H

    133-PGM14013-10H

    CONN SOCKET PGA GOLD

    Aries Electronics

    2,800
    RFQ
    133-PGM14013-10H

    Datasheet

    133-PGM14013-10H PGM Bulk Active PGA - 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole - Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled -55°C ~ 105°C
    100-PRS10001-12

    100-PRS10001-12

    CONN SOCKET PGA ZIF GOLD

    Aries Electronics

    4,564
    RFQ
    100-PRS10001-12

    Datasheet

    100-PRS10001-12 PRS Bulk Active PGA, ZIF (ZIP) - 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Closed Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Beryllium Copper Polyphenylene Sulfide (PPS) -65°C ~ 125°C
    40-6556-40

    40-6556-40

    CONN IC DIP SOCKET 40POS GOLD

    Aries Electronics

    4,729
    RFQ
    40-6556-40

    Datasheet

    40-6556-40 6556 Bulk Active DIP, 0.6" (15.24mm) Row Spacing 40 (2 x 20) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame Solder Cup 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Polyphenylene Sulfide (PPS), Glass Filled -
    132-PGM13038-50

    132-PGM13038-50

    CONN SOCKET PGA GOLD

    Aries Electronics

    3,232
    RFQ

    -

    132-PGM13038-50 PGM - Active PGA - 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole - Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled -
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