Available 24/7 at SENICO ELECTRONICS INTL CO., LIMITED
    SENICO ELECTRONICS INTL CO., LIMITED

    IC Sockets

    Manufacturer Series Packaging Product Status Type Number of Positions or Pins (Grid) Pitch - Mating Contact Finish - Mating Contact Finish Thickness - Mating Contact Material - Mating Mounting Type Features Termination Pitch - Post Contact Finish - Post Contact Finish Thickness - Post Contact Material - Post Housing Material Operating Temperature















































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































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    Photo Mfr. Part # Availability Price Quantity Datasheet RoHs Series Packaging Product Status Type Number of Positions or Pins (Grid) Pitch - Mating Contact Finish - Mating Contact Finish Thickness - Mating Contact Material - Mating Mounting Type Features Termination Pitch - Post Contact Finish - Post Contact Finish Thickness - Post Contact Material - Post Housing Material Operating Temperature
    30-PRS16018-12

    30-PRS16018-12

    CONN SOCKET PGA ZIF GOLD

    Aries Electronics

    2,908
    RFQ
    30-PRS16018-12

    Datasheet

    30-PRS16018-12 PRS Bulk Active PGA, ZIF (ZIP) - 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Closed Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Beryllium Copper Polyphenylene Sulfide (PPS) -65°C ~ 125°C
    30-PRS16020-12

    30-PRS16020-12

    CONN SOCKET PGA ZIF GOLD

    Aries Electronics

    2,567
    RFQ
    30-PRS16020-12

    Datasheet

    30-PRS16020-12 PRS Bulk Active PGA, ZIF (ZIP) - 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Closed Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Beryllium Copper Polyphenylene Sulfide (PPS) -65°C ~ 125°C
    30-PRS16022-12

    30-PRS16022-12

    CONN SOCKET PGA ZIF GOLD

    Aries Electronics

    2,111
    RFQ
    30-PRS16022-12

    Datasheet

    30-PRS16022-12 PRS Bulk Active PGA, ZIF (ZIP) - 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Closed Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Beryllium Copper Polyphenylene Sulfide (PPS) -65°C ~ 125°C
    108-PLS12005-12

    108-PLS12005-12

    CONN SOCKET PGA ZIF GOLD

    Aries Electronics

    3,854
    RFQ
    108-PLS12005-12

    Datasheet

    108-PLS12005-12 PLS Bulk Active PGA, ZIF (ZIP) - 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Closed Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Beryllium Copper Polyphenylene Sulfide (PPS) -65°C ~ 125°C
    48-3554-16

    48-3554-16

    CONN IC DIP SOCKET ZIF 48POS

    Aries Electronics

    2,128
    RFQ
    48-3554-16

    Datasheet

    48-3554-16 55 Bulk Active DIP, ZIF (ZIP), 0.3" (7.62mm) Row Spacing 48 (2 x 24) 0.100" (2.54mm) Nickel Boron 50.0µin (1.27µm) Beryllium Copper Through Hole Closed Frame Solder 0.100" (2.54mm) Nickel Boron 50.0µin (1.27µm) Beryllium Copper Polyphenylene Sulfide (PPS), Glass Filled -
    48-6554-16

    48-6554-16

    CONN IC DIP SOCKET ZIF 48POS

    Aries Electronics

    2,822
    RFQ
    48-6554-16

    Datasheet

    48-6554-16 55 Bulk Active DIP, ZIF (ZIP), 0.6" (15.24mm) Row Spacing 48 (2 x 24) 0.100" (2.54mm) Nickel Boron 50.0µin (1.27µm) Beryllium Copper Through Hole Closed Frame Solder 0.100" (2.54mm) Nickel Boron 50.0µin (1.27µm) Beryllium Copper Polyphenylene Sulfide (PPS), Glass Filled -
    209-PGM17020-10H

    209-PGM17020-10H

    CONN SOCKET PGA GOLD

    Aries Electronics

    2,728
    RFQ
    209-PGM17020-10H

    Datasheet

    209-PGM17020-10H PGM Bulk Active PGA - 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole - Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled -55°C ~ 105°C
    15-PRS15068-12

    15-PRS15068-12

    CONN SOCKET PGA ZIF GOLD

    Aries Electronics

    2,679
    RFQ
    15-PRS15068-12

    Datasheet

    15-PRS15068-12 PRS Bulk Active PGA, ZIF (ZIP) - 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Closed Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Beryllium Copper Polyphenylene Sulfide (PPS) -65°C ~ 125°C
    80-PRS15072-12

    80-PRS15072-12

    CONN SOCKET PGA ZIF GOLD

    Aries Electronics

    2,344
    RFQ
    80-PRS15072-12

    Datasheet

    80-PRS15072-12 PRS Bulk Active PGA, ZIF (ZIP) - 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Closed Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Beryllium Copper Polyphenylene Sulfide (PPS) -65°C ~ 125°C
    18-PLS15071-12

    18-PLS15071-12

    CONN SOCKET PGA ZIF GOLD

    Aries Electronics

    2,425
    RFQ
    18-PLS15071-12

    Datasheet

    18-PLS15071-12 PLS Bulk Active PGA, ZIF (ZIP) - 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Closed Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Beryllium Copper Polyphenylene Sulfide (PPS) -65°C ~ 125°C
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