Available 24/7 at SENICO ELECTRONICS INTL CO., LIMITED
    SENICO ELECTRONICS INTL CO., LIMITED

    IC Sockets

    Manufacturer Series Packaging Product Status Type Number of Positions or Pins (Grid) Pitch - Mating Contact Finish - Mating Contact Finish Thickness - Mating Contact Material - Mating Mounting Type Features Termination Pitch - Post Contact Finish - Post Contact Finish Thickness - Post Contact Material - Post Housing Material Operating Temperature















































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































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    Photo Mfr. Part # Availability Price Quantity Datasheet RoHs Series Packaging Product Status Type Number of Positions or Pins (Grid) Pitch - Mating Contact Finish - Mating Contact Finish Thickness - Mating Contact Material - Mating Mounting Type Features Termination Pitch - Post Contact Finish - Post Contact Finish Thickness - Post Contact Material - Post Housing Material Operating Temperature
    281-PRS19029-12

    281-PRS19029-12

    CONN SOCKET PGA ZIF GOLD

    Aries Electronics

    3,484
    RFQ
    281-PRS19029-12

    Datasheet

    281-PRS19029-12 PRS Bulk Active PGA, ZIF (ZIP) - 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Closed Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Beryllium Copper Polyphenylene Sulfide (PPS) -65°C ~ 125°C
    229-PLS16014-12

    229-PLS16014-12

    CONN SOCKET PGA ZIF GOLD

    Aries Electronics

    3,277
    RFQ
    229-PLS16014-12

    Datasheet

    229-PLS16014-12 PLS Bulk Active PGA, ZIF (ZIP) - 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Closed Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Beryllium Copper Polyphenylene Sulfide (PPS) -65°C ~ 125°C
    229-PRS16014-12

    229-PRS16014-12

    CONN SOCKET PGA ZIF GOLD

    Aries Electronics

    3,933
    RFQ
    229-PRS16014-12

    Datasheet

    229-PRS16014-12 PRS Bulk Active PGA, ZIF (ZIP) - 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Closed Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Beryllium Copper Polyphenylene Sulfide (PPS) -65°C ~ 125°C
    208-PRS17017-12

    208-PRS17017-12

    CONN SOCKET PGA ZIF GOLD

    Aries Electronics

    4,372
    RFQ
    208-PRS17017-12

    Datasheet

    208-PRS17017-12 PRS Bulk Active PGA, ZIF (ZIP) - 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Closed Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Beryllium Copper Polyphenylene Sulfide (PPS) -65°C ~ 125°C
    28-6554-18

    28-6554-18

    CONN IC DIP SOCKET ZIF 28POS

    Aries Electronics

    2,358
    RFQ
    28-6554-18

    Datasheet

    28-6554-18 55 Bulk Active DIP, ZIF (ZIP), 0.6" (15.24mm) Row Spacing 28 (2 x 14) 0.100" (2.54mm) Nickel Boron 50.0µin (1.27µm) Beryllium Nickel Through Hole Closed Frame Solder 0.100" (2.54mm) Nickel Boron 50.0µin (1.27µm) Beryllium Nickel Polyetheretherketone (PEEK), Glass Filled -55°C ~ 250°C
    256-PRS16001-12

    256-PRS16001-12

    CONN SOCKET PGA ZIF GOLD

    Aries Electronics

    2,674
    RFQ
    256-PRS16001-12

    Datasheet

    256-PRS16001-12 PRS Bulk Active PGA, ZIF (ZIP) - 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Closed Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Beryllium Copper Polyphenylene Sulfide (PPS) -65°C ~ 125°C
    257-PRS21011-12

    257-PRS21011-12

    CONN SOCKET PGA ZIF GOLD

    Aries Electronics

    4,296
    RFQ
    257-PRS21011-12

    Datasheet

    257-PRS21011-12 PRS Bulk Active PGA, ZIF (ZIP) - 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Closed Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Beryllium Copper Polyphenylene Sulfide (PPS) -65°C ~ 125°C
    257-PRS21015-12

    257-PRS21015-12

    CONN SOCKET PGA ZIF GOLD

    Aries Electronics

    2,460
    RFQ
    257-PRS21015-12

    Datasheet

    257-PRS21015-12 PRS Bulk Active PGA, ZIF (ZIP) - 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Closed Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Beryllium Copper Polyphenylene Sulfide (PPS) -65°C ~ 125°C
    257-PRS20018-12

    257-PRS20018-12

    CONN SOCKET PGA ZIF GOLD

    Aries Electronics

    3,408
    RFQ
    257-PRS20018-12

    Datasheet

    257-PRS20018-12 PRS Bulk Active PGA, ZIF (ZIP) - 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Closed Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Beryllium Copper Polyphenylene Sulfide (PPS) -65°C ~ 125°C
    262-PLS20003-12

    262-PLS20003-12

    CONN SOCKET PGA ZIF GOLD

    Aries Electronics

    4,661
    RFQ
    262-PLS20003-12

    Datasheet

    262-PLS20003-12 PLS Bulk Active PGA, ZIF (ZIP) - 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Closed Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Beryllium Copper Polyphenylene Sulfide (PPS) -65°C ~ 125°C
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