Available 24/7 at SENICO ELECTRONICS INTL CO., LIMITED
    SENICO ELECTRONICS INTL CO., LIMITED

    IC Sockets

    Manufacturer Series Packaging Product Status Type Number of Positions or Pins (Grid) Pitch - Mating Contact Finish - Mating Contact Finish Thickness - Mating Contact Material - Mating Mounting Type Features Termination Pitch - Post Contact Finish - Post Contact Finish Thickness - Post Contact Material - Post Housing Material Operating Temperature















































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































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    Photo Mfr. Part # Availability Price Quantity Datasheet RoHs Series Packaging Product Status Type Number of Positions or Pins (Grid) Pitch - Mating Contact Finish - Mating Contact Finish Thickness - Mating Contact Material - Mating Mounting Type Features Termination Pitch - Post Contact Finish - Post Contact Finish Thickness - Post Contact Material - Post Housing Material Operating Temperature
    32-6575-18

    32-6575-18

    CONN IC DIP SOCKET ZIF 32POS TIN

    Aries Electronics

    3,631
    RFQ
    32-6575-18

    Datasheet

    32-6575-18 57 Bulk Active DIP, ZIF (ZIP), 0.6" (15.24mm) Row Spacing 32 (2 x 16) 0.100" (2.54mm) Tin 200.0µin (5.08µm) Beryllium Copper Through Hole Closed Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Beryllium Copper Polyphenylene Sulfide (PPS), Glass Filled -
    180-PLS18007-12

    180-PLS18007-12

    CONN SOCKET PGA ZIF GOLD

    Aries Electronics

    4,789
    RFQ
    180-PLS18007-12

    Datasheet

    180-PLS18007-12 PLS Bulk Active PGA, ZIF (ZIP) - 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Closed Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Beryllium Copper Polyphenylene Sulfide (PPS) -65°C ~ 125°C
    181-PLS18041-12

    181-PLS18041-12

    CONN SOCKET PGA ZIF GOLD

    Aries Electronics

    2,057
    RFQ
    181-PLS18041-12

    Datasheet

    181-PLS18041-12 PLS Bulk Active PGA, ZIF (ZIP) - 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Closed Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Beryllium Copper Polyphenylene Sulfide (PPS) -65°C ~ 125°C
    181-PRS18040-12

    181-PRS18040-12

    CONN SOCKET PGA ZIF GOLD

    Aries Electronics

    2,911
    RFQ
    181-PRS18040-12

    Datasheet

    181-PRS18040-12 PRS Bulk Active PGA, ZIF (ZIP) - 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Closed Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Beryllium Copper Polyphenylene Sulfide (PPS) -65°C ~ 125°C
    181-PRS18041-12

    181-PRS18041-12

    CONN SOCKET PGA ZIF GOLD

    Aries Electronics

    3,387
    RFQ
    181-PRS18041-12

    Datasheet

    181-PRS18041-12 PRS Bulk Active PGA, ZIF (ZIP) - 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Closed Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Beryllium Copper Polyphenylene Sulfide (PPS) -65°C ~ 125°C
    40-6554-18

    40-6554-18

    CONN IC DIP SOCKET ZIF 40POS

    Aries Electronics

    3,201
    RFQ
    40-6554-18

    Datasheet

    40-6554-18 55 Bulk Active DIP, ZIF (ZIP), 0.6" (15.24mm) Row Spacing 40 (2 x 20) 0.100" (2.54mm) Nickel Boron 50.0µin (1.27µm) Beryllium Nickel Through Hole Closed Frame Solder 0.100" (2.54mm) Nickel Boron 50.0µin (1.27µm) Beryllium Nickel Polyetheretherketone (PEEK), Glass Filled -55°C ~ 250°C
    40-3554-18

    40-3554-18

    CONN IC DIP SOCKET ZIF 40POS

    Aries Electronics

    3,845
    RFQ

    -

    40-3554-18 55 Bulk Active DIP, ZIF (ZIP), 0.3" (7.62mm) Row Spacing 40 (2 x 20) 0.100" (2.54mm) Nickel Boron 50.0µin (1.27µm) Beryllium Nickel Through Hole Closed Frame Solder 0.100" (2.54mm) Nickel Boron 50.0µin (1.27µm) Beryllium Nickel Polyetheretherketone (PEEK), Glass Filled -55°C ~ 250°C
    196-PRS14001-16

    196-PRS14001-16

    CONN SOCKET PGA ZIF GOLD

    Aries Electronics

    4,624
    RFQ
    196-PRS14001-16

    Datasheet

    196-PRS14001-16 PRS Bulk Obsolete PGA, ZIF (ZIP) - 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Closed Frame Solder 0.100" (2.54mm) Nickel Bronze 50.0µin (1.27µm) Beryllium Copper Polyphenylene Sulfide (PPS) -65°C ~ 200°C
    281-PRS19010-12

    281-PRS19010-12

    CONN SOCKET PGA ZIF GOLD

    Aries Electronics

    3,584
    RFQ
    281-PRS19010-12

    Datasheet

    281-PRS19010-12 PRS Bulk Active PGA, ZIF (ZIP) - 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Closed Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Beryllium Copper Polyphenylene Sulfide (PPS) -65°C ~ 125°C
    281-PLS19029-12

    281-PLS19029-12

    CONN SOCKET PGA ZIF GOLD

    Aries Electronics

    2,048
    RFQ
    281-PLS19029-12

    Datasheet

    281-PLS19029-12 PLS Bulk Active PGA, ZIF (ZIP) - 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Closed Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Beryllium Copper Polyphenylene Sulfide (PPS) -65°C ~ 125°C
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