| Photo | Mfr. Part # | Availability | Quantity | Datasheet | RoHs | Series | Packaging | Product Status | Type | Number of Positions or Pins (Grid) | Pitch - Mating | Contact Finish - Mating | Contact Finish Thickness - Mating | Contact Material - Mating | Mounting Type | Features | Termination | Pitch - Post | Contact Finish - Post | Contact Finish Thickness - Post | Contact Material - Post | Housing Material | Operating Temperature | 
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
                 
                 
                
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                    48-6574-18CONN IC DIP SOCKET ZIF 48POS GLD Aries Electronics  |  
                3,216 | 
                
                     | 
                 
                  
                    
                       Datasheet  | 
                   57 | Bulk | Active | DIP, ZIF (ZIP), 0.6" (15.24mm) Row Spacing | 48 (2 x 24) | 0.100" (2.54mm) | Gold | 10.0µin (0.25µm) | Beryllium Copper | Through Hole | Closed Frame | Solder | 0.100" (2.54mm) | Gold | 10.0µin (0.25µm) | Beryllium Copper | Polyphenylene Sulfide (PPS), Glass Filled | - | |
                 
                 
                
                 | 
				
                    44-3575-18CONN IC DIP SOCKET ZIF 44POS TIN Aries Electronics  |  
                4,996 | 
                
                     | 
                 
                  
                    
                       Datasheet  | 
                   57 | Bulk | Active | DIP, ZIF (ZIP), 0.3" (7.62mm) Row Spacing | 44 (2 x 22) | 0.100" (2.54mm) | Tin | 200.0µin (5.08µm) | Beryllium Copper | Through Hole | Closed Frame | Solder | 0.100" (2.54mm) | Tin | 200.0µin (5.08µm) | Beryllium Copper | Polyphenylene Sulfide (PPS), Glass Filled | - | |
                 
                 
                
                 | 
				
                    48-3575-18CONN IC DIP SOCKET ZIF 48POS TIN Aries Electronics  |  
                4,336 | 
                
                     | 
                 
                  
                    
                       Datasheet  | 
                   57 | Bulk | Active | DIP, ZIF (ZIP), 0.3" (7.62mm) Row Spacing | 48 (2 x 24) | 0.100" (2.54mm) | Tin | 200.0µin (5.08µm) | Beryllium Copper | Through Hole | Closed Frame | Solder | 0.100" (2.54mm) | Tin | 200.0µin (5.08µm) | Beryllium Copper | Polyphenylene Sulfide (PPS), Glass Filled | - | |
                 
                 
                
                 | 
				
                    48-6575-18CONN IC DIP SOCKET ZIF 48POS GLD Aries Electronics  |  
                4,690 | 
                
                     | 
                 
                  
                    
                       Datasheet  | 
                   57 | Bulk | Active | DIP, ZIF (ZIP), 0.6" (15.24mm) Row Spacing | 48 (2 x 24) | 0.100" (2.54mm) | Gold | 10.0µin (0.25µm) | Beryllium Copper | Through Hole | Closed Frame | Solder | 0.100" (2.54mm) | Gold | 10.0µin (0.25µm) | Beryllium Copper | Polyphenylene Sulfide (PPS), Glass Filled | - | |
                 
                 
                
                 | 
				
                    40-3575-18CONN IC DIP SOCKET ZIF 40POS GLD Aries Electronics  |  
                2,156 | 
                
                     | 
                 
                  
                    
                       Datasheet  | 
                   57 | Bulk | Active | DIP, ZIF (ZIP), 0.3" (7.62mm) Row Spacing | 40 (2 x 20) | 0.100" (2.54mm) | Gold | 10.0µin (0.25µm) | Beryllium Copper | Through Hole | Closed Frame | Solder | 0.100" (2.54mm) | Gold | 10.0µin (0.25µm) | Beryllium Copper | Polyphenylene Sulfide (PPS), Glass Filled | - | |
                 
                 
                
                 | 
				
                    40-6575-18CONN IC DIP SOCKET ZIF 40POS TIN Aries Electronics  |  
                4,442 | 
                
                     | 
                 
                  
                    
                       Datasheet  | 
                   57 | Bulk | Active | DIP, ZIF (ZIP), 0.6" (15.24mm) Row Spacing | 40 (2 x 20) | 0.100" (2.54mm) | Tin | 200.0µin (5.08µm) | Beryllium Copper | Through Hole | Closed Frame | Solder | 0.100" (2.54mm) | Tin | 200.0µin (5.08µm) | Beryllium Copper | Polyphenylene Sulfide (PPS), Glass Filled | - | |
                 
                 
                
                 | 
				
                    48-3553-18CONN IC DIP SOCKET ZIF 48POS Aries Electronics  |  
                4,743 | 
                
                     | 
                 
                  
                     -  | 
                   55 | Bulk | Active | DIP, ZIF (ZIP), 0.3" (7.62mm) Row Spacing | 48 (2 x 24) | 0.100" (2.54mm) | Nickel Boron | 50.0µin (1.27µm) | Beryllium Nickel | Through Hole | Closed Frame | Solder | 0.100" (2.54mm) | Nickel Boron | 50.0µin (1.27µm) | Beryllium Nickel | Polyetheretherketone (PEEK), Glass Filled | -55°C ~ 250°C | |
                 
                 
                
                 | 
				
                    48-3574-18CONN IC DIP SOCKET ZIF 48POS TIN Aries Electronics  |  
                2,153 | 
                
                     | 
                 
                  
                    
                       Datasheet  | 
                   57 | Bulk | Active | DIP, ZIF (ZIP), 0.3" (7.62mm) Row Spacing | 48 (2 x 24) | 0.100" (2.54mm) | Tin | 200.0µin (5.08µm) | Beryllium Copper | Through Hole | Closed Frame | Solder | 0.100" (2.54mm) | Tin | 200.0µin (5.08µm) | Beryllium Copper | Polyphenylene Sulfide (PPS), Glass Filled | - | |
                 
                 
                
                 | 
				
                    400-PLS20001-16CONN SOCKET PGA ZIF GOLD Aries Electronics  |  
                3,539 | 
                
                     | 
                 
                  
                    
                       Datasheet  | 
                   PLS | Bulk | Obsolete | PGA, ZIF (ZIP) | - | 0.100" (2.54mm) | Gold | 30.0µin (0.76µm) | Beryllium Copper | Through Hole | Closed Frame | Solder | 0.100" (2.54mm) | Nickel Bronze | 50.0µin (1.27µm) | Beryllium Copper | Polyphenylene Sulfide (PPS) | -65°C ~ 200°C | |
                 
                 
                
                 | 
				
                    441-PRS21001-16CONN SOCKET PGA ZIF GOLD Aries Electronics  |  
                4,958 | 
                
                     | 
                 
                  
                    
                       Datasheet  | 
                   PRS | Bulk | Obsolete | PGA, ZIF (ZIP) | - | 0.100" (2.54mm) | Gold | 30.0µin (0.76µm) | Beryllium Copper | Through Hole | Closed Frame | Solder | 0.100" (2.54mm) | Nickel Bronze | 50.0µin (1.27µm) | Beryllium Copper | Polyphenylene Sulfide (PPS) | -65°C ~ 200°C |