Available 24/7 at SENICO ELECTRONICS INTL CO., LIMITED
    SENICO ELECTRONICS INTL CO., LIMITED

    IC Sockets

    Manufacturer Series Packaging Product Status Type Number of Positions or Pins (Grid) Pitch - Mating Contact Finish - Mating Contact Finish Thickness - Mating Contact Material - Mating Mounting Type Features Termination Pitch - Post Contact Finish - Post Contact Finish Thickness - Post Contact Material - Post Housing Material Operating Temperature















































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































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    Photo Mfr. Part # Availability Price Quantity Datasheet RoHs Series Packaging Product Status Type Number of Positions or Pins (Grid) Pitch - Mating Contact Finish - Mating Contact Finish Thickness - Mating Contact Material - Mating Mounting Type Features Termination Pitch - Post Contact Finish - Post Contact Finish Thickness - Post Contact Material - Post Housing Material Operating Temperature
    336-PLS21022-12

    336-PLS21022-12

    CONN SOCKET PGA ZIF GOLD

    Aries Electronics

    4,359
    RFQ
    336-PLS21022-12

    Datasheet

    336-PLS21022-12 PLS Bulk Active PGA, ZIF (ZIP) - 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Closed Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Beryllium Copper Polyphenylene Sulfide (PPS) -65°C ~ 125°C
    42-3574-18

    42-3574-18

    CONN IC DIP SOCKET ZIF 42POS TIN

    Aries Electronics

    3,894
    RFQ
    42-3574-18

    Datasheet

    42-3574-18 57 Bulk Active DIP, ZIF (ZIP), 0.3" (7.62mm) Row Spacing 42 (2 x 21) 0.100" (2.54mm) Tin 200.0µin (5.08µm) Beryllium Copper Through Hole Closed Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Beryllium Copper Polyphenylene Sulfide (PPS), Glass Filled -
    42-3575-18

    42-3575-18

    CONN IC DIP SOCKET ZIF 42POS TIN

    Aries Electronics

    3,877
    RFQ
    42-3575-18

    Datasheet

    42-3575-18 57 Bulk Active DIP, ZIF (ZIP), 0.3" (7.62mm) Row Spacing 42 (2 x 21) 0.100" (2.54mm) Tin 200.0µin (5.08µm) Beryllium Copper Through Hole Closed Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Beryllium Copper Polyphenylene Sulfide (PPS), Glass Filled -
    42-6574-18

    42-6574-18

    CONN IC DIP SOCKET ZIF 42POS TIN

    Aries Electronics

    2,702
    RFQ
    42-6574-18

    Datasheet

    42-6574-18 57 Bulk Active DIP, ZIF (ZIP), 0.6" (15.24mm) Row Spacing 42 (2 x 21) 0.100" (2.54mm) Tin 200.0µin (5.08µm) Beryllium Copper Through Hole Closed Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Beryllium Copper Polyphenylene Sulfide (PPS), Glass Filled -
    42-6575-18

    42-6575-18

    CONN IC DIP SOCKET ZIF 42POS TIN

    Aries Electronics

    2,876
    RFQ
    42-6575-18

    Datasheet

    42-6575-18 57 Bulk Active DIP, ZIF (ZIP), 0.6" (15.24mm) Row Spacing 42 (2 x 21) 0.100" (2.54mm) Tin 200.0µin (5.08µm) Beryllium Copper Through Hole Closed Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Beryllium Copper Polyphenylene Sulfide (PPS), Glass Filled -
    400-PLS20001-12

    400-PLS20001-12

    CONN SOCKET PGA ZIF GOLD

    Aries Electronics

    4,214
    RFQ
    400-PLS20001-12

    Datasheet

    400-PLS20001-12 PLS Bulk Active PGA, ZIF (ZIP) - 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Closed Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Beryllium Copper Polyphenylene Sulfide (PPS) -65°C ~ 125°C
    400-PRS20001-12

    400-PRS20001-12

    CONN SOCKET PGA ZIF GOLD

    Aries Electronics

    4,406
    RFQ
    400-PRS20001-12

    Datasheet

    400-PRS20001-12 PRS Bulk Active PGA, ZIF (ZIP) - 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Closed Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Beryllium Copper Polyphenylene Sulfide (PPS) -65°C ~ 125°C
    44-3574-18

    44-3574-18

    CONN IC DIP SOCKET ZIF 44POS TIN

    Aries Electronics

    3,735
    RFQ
    44-3574-18

    Datasheet

    44-3574-18 57 Bulk Active DIP, ZIF (ZIP), 0.3" (7.62mm) Row Spacing 44 (2 x 22) 0.100" (2.54mm) Tin 200.0µin (5.08µm) Beryllium Copper Through Hole Closed Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Beryllium Copper Polyphenylene Sulfide (PPS), Glass Filled -
    44-6574-18

    44-6574-18

    CONN IC DIP SOCKET ZIF 44POS TIN

    Aries Electronics

    3,502
    RFQ
    44-6574-18

    Datasheet

    44-6574-18 57 Bulk Active DIP, ZIF (ZIP), 0.6" (15.24mm) Row Spacing 44 (2 x 22) 0.100" (2.54mm) Tin 200.0µin (5.08µm) Beryllium Copper Through Hole Closed Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Beryllium Copper Polyphenylene Sulfide (PPS), Glass Filled -
    44-6575-18

    44-6575-18

    CONN IC DIP SOCKET ZIF 44POS TIN

    Aries Electronics

    4,307
    RFQ
    44-6575-18

    Datasheet

    44-6575-18 57 Bulk Active DIP, ZIF (ZIP), 0.6" (15.24mm) Row Spacing 44 (2 x 22) 0.100" (2.54mm) Tin 200.0µin (5.08µm) Beryllium Copper Through Hole Closed Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Beryllium Copper Polyphenylene Sulfide (PPS), Glass Filled -
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