Available 24/7 at SENICO ELECTRONICS INTL CO., LIMITED
    SENICO ELECTRONICS INTL CO., LIMITED

    IC Sockets

    Manufacturer Series Packaging Product Status Type Number of Positions or Pins (Grid) Pitch - Mating Contact Finish - Mating Contact Finish Thickness - Mating Contact Material - Mating Mounting Type Features Termination Pitch - Post Contact Finish - Post Contact Finish Thickness - Post Contact Material - Post Housing Material Operating Temperature















































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































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    Photo Mfr. Part # Availability Price Quantity Datasheet RoHs Series Packaging Product Status Type Number of Positions or Pins (Grid) Pitch - Mating Contact Finish - Mating Contact Finish Thickness - Mating Contact Material - Mating Mounting Type Features Termination Pitch - Post Contact Finish - Post Contact Finish Thickness - Post Contact Material - Post Housing Material Operating Temperature
    22-4518-10T

    22-4518-10T

    CONN IC DIP SOCKET 22POS GOLD

    Aries Electronics

    4,061
    RFQ
    22-4518-10T

    Datasheet

    22-4518-10T 518 Bulk Active DIP, 0.4" (10.16mm) Row Spacing 22 (2 x 11) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled -
    06-6513-11

    06-6513-11

    CONN IC DIP SOCKET 6POS GOLD

    Aries Electronics

    3,241
    RFQ
    06-6513-11

    Datasheet

    06-6513-11 Lo-PRO®file, 513 Bulk Active DIP, 0.6" (15.24mm) Row Spacing 6 (2 x 3) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Closed Frame Solder 0.100" (2.54mm) Gold 10.0µin (0.25µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled -55°C ~ 105°C
    12-0518-11

    12-0518-11

    CONN SOCKET SIP 12POS GOLD

    Aries Electronics

    3,643
    RFQ
    12-0518-11

    Datasheet

    12-0518-11 518 Bulk Active SIP 12 (1 x 12) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Gold 10.0µin (0.25µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled -
    12-1518-11

    12-1518-11

    CONN IC DIP SOCKET 12POS GOLD

    Aries Electronics

    3,493
    RFQ
    12-1518-11

    Datasheet

    12-1518-11 518 Bulk Active DIP, 0.2" (5.08mm) Row Spacing 12 (2 x 6) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Gold 10.0µin (0.25µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled -
    16-0518-11

    16-0518-11

    CONN SOCKET SIP 16POS GOLD

    Aries Electronics

    3,032
    RFQ
    16-0518-11

    Datasheet

    16-0518-11 518 Bulk Active SIP 16 (1 x 16) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Gold 10.0µin (0.25µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled -
    16-1518-11

    16-1518-11

    CONN IC DIP SOCKET 16POS GOLD

    Aries Electronics

    4,244
    RFQ
    16-1518-11

    Datasheet

    16-1518-11 518 Bulk Active DIP, 0.2" (5.08mm) Row Spacing 16 (2 x 8) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Gold 10.0µin (0.25µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled -
    06-9513-10T

    06-9513-10T

    CONN IC DIP SOCKET 6POS GOLD

    Aries Electronics

    4,621
    RFQ
    06-9513-10T

    Datasheet

    06-9513-10T Lo-PRO®file, 513 Bulk Active DIP, 0.9" (22.86mm) Row Spacing 6 (2 x 3) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Closed Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled -55°C ~ 105°C
    12-0513-10H

    12-0513-10H

    CONN SOCKET SIP 12POS GOLD

    Aries Electronics

    3,845
    RFQ
    12-0513-10H

    Datasheet

    12-0513-10H 0513 Bulk Active SIP 12 (1 x 12) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole - Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled -
    20-1518-10H

    20-1518-10H

    CONN IC DIP SOCKET 20POS GOLD

    Aries Electronics

    3,361
    RFQ
    20-1518-10H

    Datasheet

    20-1518-10H 518 Bulk Active DIP, 0.2" (5.08mm) Row Spacing 20 (2 x 10) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled -
    22-1518-10T

    22-1518-10T

    CONN IC DIP SOCKET 22POS GOLD

    Aries Electronics

    3,267
    RFQ
    22-1518-10T

    Datasheet

    22-1518-10T 518 Bulk Active DIP, 0.2" (5.08mm) Row Spacing 22 (2 x 11) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled -
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