Available 24/7 at SENICO ELECTRONICS INTL CO., LIMITED
    SENICO ELECTRONICS INTL CO., LIMITED

    IC Sockets

    Manufacturer Series Packaging Product Status Type Number of Positions or Pins (Grid) Pitch - Mating Contact Finish - Mating Contact Finish Thickness - Mating Contact Material - Mating Mounting Type Features Termination Pitch - Post Contact Finish - Post Contact Finish Thickness - Post Contact Material - Post Housing Material Operating Temperature















































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































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    Photo Mfr. Part # Availability Price Quantity Datasheet RoHs Series Packaging Product Status Type Number of Positions or Pins (Grid) Pitch - Mating Contact Finish - Mating Contact Finish Thickness - Mating Contact Material - Mating Mounting Type Features Termination Pitch - Post Contact Finish - Post Contact Finish Thickness - Post Contact Material - Post Housing Material Operating Temperature
    24-1518-10

    24-1518-10

    CONN IC DIP SOCKET 24POS GOLD

    Aries Electronics

    4,255
    RFQ
    24-1518-10

    Datasheet

    24-1518-10 518 Bulk Active DIP, 0.2" (5.08mm) Row Spacing 24 (2 x 12) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled -
    16-3511-10WR

    16-3511-10WR

    CONN IC DIP SOCKET 16POS TIN

    Aries Electronics

    4,217
    RFQ
    16-3511-10WR

    Datasheet

    16-3511-10WR 511 Bulk Active DIP, 0.3" (7.62mm) Row Spacing 16 (2 x 8) 0.100" (2.54mm) Tin 200.0µin (5.08µm) Phosphor Bronze Through Hole Closed Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Phosphor Bronze Polyamide (PA46), Nylon 4/6, Glass Filled -55°C ~ 105°C
    C8114-04

    C8114-04

    CONN IC DIP SOCKET 14POS TIN

    Aries Electronics

    4,845
    RFQ
    C8114-04

    Datasheet

    C8114-04 Edge-Grip™, C81 Bulk Obsolete DIP, 0.3" (7.62mm) Row Spacing 14 (2 x 7) 0.100" (2.54mm) Tin 200.0µin (5.08µm) Phosphor Bronze Through Hole Closed Frame Wire Wrap 0.100" (2.54mm) Tin 200.0µin (5.08µm) Phosphor Bronze Polyamide (PA46), Nylon 4/6, Glass Filled -55°C ~ 105°C
    08-4513-10H

    08-4513-10H

    CONN IC DIP SOCKET 8POS GOLD

    Aries Electronics

    4,864
    RFQ
    08-4513-10H

    Datasheet

    08-4513-10H Lo-PRO®file, 513 Bulk Active DIP, 0.4" (10.16mm) Row Spacing 8 (2 x 4) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Closed Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled -55°C ~ 105°C
    10-2513-11

    10-2513-11

    CONN IC DIP SOCKET 10POS GOLD

    Aries Electronics

    4,785
    RFQ
    10-2513-11

    Datasheet

    10-2513-11 Lo-PRO®file, 513 Bulk Active DIP, 0.2" (5.08mm) Row Spacing 10 (2 x 5) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Closed Frame Solder 0.100" (2.54mm) Gold 10.0µin (0.25µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled -55°C ~ 105°C
    17-0513-10

    17-0513-10

    CONN SOCKET SIP 17POS GOLD

    Aries Electronics

    4,336
    RFQ
    17-0513-10

    Datasheet

    17-0513-10 0513 Bulk Active SIP 17 (1 x 17) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole - Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled -
    22-0518-10T

    22-0518-10T

    CONN SOCKET SIP 22POS GOLD

    Aries Electronics

    2,325
    RFQ
    22-0518-10T

    Datasheet

    22-0518-10T 518 Bulk Active SIP 22 (1 x 22) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled -
    24-0518-10

    24-0518-10

    CONN SOCKET SIP 24POS GOLD

    Aries Electronics

    2,614
    RFQ
    24-0518-10

    Datasheet

    24-0518-10 518 Bulk Active SIP 24 (1 x 24) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled -
    08-0513-11

    08-0513-11

    CONN SOCKET SIP 8POS GOLD

    Aries Electronics

    3,396
    RFQ
    08-0513-11

    Datasheet

    08-0513-11 0513 Bulk Active SIP 8 (1 x 8) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole - Solder 0.100" (2.54mm) Gold 10.0µin (0.25µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled -
    20-3513-10T

    20-3513-10T

    CONN IC DIP SOCKET 20POS GOLD

    Aries Electronics

    2,544
    RFQ
    20-3513-10T

    Datasheet

    20-3513-10T Lo-PRO®file, 513 Bulk Active DIP, 0.3" (7.62mm) Row Spacing 20 (2 x 10) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Closed Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled -55°C ~ 105°C
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