Available 24/7 at SENICO ELECTRONICS INTL CO., LIMITED
    SENICO ELECTRONICS INTL CO., LIMITED

    IC Sockets

    Manufacturer Series Packaging Product Status Type Number of Positions or Pins (Grid) Pitch - Mating Contact Finish - Mating Contact Finish Thickness - Mating Contact Material - Mating Mounting Type Features Termination Pitch - Post Contact Finish - Post Contact Finish Thickness - Post Contact Material - Post Housing Material Operating Temperature















































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































    Reset All
    Apply All
    Result:
    Photo Mfr. Part # Availability Price Quantity Datasheet RoHs Series Packaging Product Status Type Number of Positions or Pins (Grid) Pitch - Mating Contact Finish - Mating Contact Finish Thickness - Mating Contact Material - Mating Mounting Type Features Termination Pitch - Post Contact Finish - Post Contact Finish Thickness - Post Contact Material - Post Housing Material Operating Temperature
    32-3513-10

    32-3513-10

    CONN IC DIP SOCKET 32POS GOLD

    Aries Electronics

    3,212
    RFQ
    32-3513-10

    Datasheet

    32-3513-10 Lo-PRO®file, 513 Bulk Active DIP, 0.3" (7.62mm) Row Spacing 32 (2 x 16) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Closed Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled -55°C ~ 105°C
    510-83-084-10-001101

    510-83-084-10-001101

    CONN SOCKET PGA 84POS GOLD

    Preci-Dip

    3,529
    RFQ
    510-83-084-10-001101

    Datasheet

    510-83-084-10-001101 510 Bulk Active PGA 84 (10 x 10) 0.100" (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
    510-83-084-10-031101

    510-83-084-10-031101

    CONN SOCKET PGA 84POS GOLD

    Preci-Dip

    3,010
    RFQ
    510-83-084-10-031101

    Datasheet

    510-83-084-10-031101 510 Bulk Active PGA 84 (10 x 10) 0.100" (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
    510-83-084-11-002101

    510-83-084-11-002101

    CONN SOCKET PGA 84POS GOLD

    Preci-Dip

    2,463
    RFQ
    510-83-084-11-002101

    Datasheet

    510-83-084-11-002101 510 Bulk Active PGA 84 (11 x 11) 0.100" (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
    510-83-084-11-041101

    510-83-084-11-041101

    CONN SOCKET PGA 84POS GOLD

    Preci-Dip

    4,282
    RFQ
    510-83-084-11-041101

    Datasheet

    510-83-084-11-041101 510 Bulk Active PGA 84 (11 x 11) 0.100" (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
    510-83-084-11-042101

    510-83-084-11-042101

    CONN SOCKET PGA 84POS GOLD

    Preci-Dip

    3,026
    RFQ
    510-83-084-11-042101

    Datasheet

    510-83-084-11-042101 510 Bulk Active PGA 84 (11 x 11) 0.100" (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
    510-83-084-12-051101

    510-83-084-12-051101

    CONN SOCKET PGA 84POS GOLD

    Preci-Dip

    3,281
    RFQ
    510-83-084-12-051101

    Datasheet

    510-83-084-12-051101 510 Bulk Active PGA 84 (12 x 12) 0.100" (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
    10-6503-30

    10-6503-30

    CONN IC DIP SOCKET 10POS GOLD

    Aries Electronics

    2,325
    RFQ
    10-6503-30

    Datasheet

    10-6503-30 503 Bulk Active DIP, 0.6" (15.24mm) Row Spacing 10 (2 x 5) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Closed Frame Wire Wrap 0.100" (2.54mm) Tin 200.0µin (5.08µm) Phosphor Bronze Polyamide (PA46), Nylon 4/6, Glass Filled -55°C ~ 105°C
    124-83-628-41-002101

    124-83-628-41-002101

    CONN IC DIP SOCKET 28POS GOLD

    Preci-Dip

    2,784
    RFQ

    -

    124-83-628-41-002101 124 Bulk Active DIP, 0.6" (15.24mm) Row Spacing 28 (2 x 14) 0.100" (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Open Frame Wire Wrap 0.100" (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
    816-AG10D

    816-AG10D

    CONN IC DIP SOCKET 16POS GOLD

    TE Connectivity AMP Connectors

    4,945
    RFQ
    816-AG10D

    Datasheet

    816-AG10D 800 Tube Obsolete DIP, 0.3" (7.62mm) Row Spacing 16 (2 x 8) 0.100" (2.54mm) Gold 25.0µin (0.63µm) Copper Alloy Through Hole Open Frame Solder 0.100" (2.54mm) - - - Polyester -55°C ~ 105°C
    510-83-084-13-081101

    510-83-084-13-081101

    CONN SOCKET PGA 84POS GOLD

    Preci-Dip

    2,376
    RFQ
    510-83-084-13-081101

    Datasheet

    510-83-084-13-081101 510 Bulk Active PGA 84 (13 x 13) 0.100" (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
    510-83-084-13-082101

    510-83-084-13-082101

    CONN SOCKET PGA 84POS GOLD

    Preci-Dip

    4,043
    RFQ
    510-83-084-13-082101

    Datasheet

    510-83-084-13-082101 510 Bulk Active PGA 84 (13 x 13) 0.100" (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
    614-83-950-41-001101

    614-83-950-41-001101

    CONN IC DIP SOCKET 50POS GOLD

    Preci-Dip

    2,088
    RFQ
    614-83-950-41-001101

    Datasheet

    614-83-950-41-001101 614 Bulk Active DIP, 0.9" (22.86mm) Row Spacing 50 (2 x 25) 0.100" (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Carrier, Open Frame Solder 0.100" (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
    36-1518-11

    36-1518-11

    CONN IC DIP SOCKET 36POS GOLD

    Aries Electronics

    2,307
    RFQ
    36-1518-11

    Datasheet

    36-1518-11 518 Bulk Active DIP, 0.2" (5.08mm) Row Spacing 36 (2 x 18) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Gold 10.0µin (0.25µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled -
    ICF-322-TL-I-TR

    ICF-322-TL-I-TR

    .100" SURFACE MOUNT SCREW MACHIN

    Samtec Inc.

    3,273
    RFQ
    ICF-322-TL-I-TR

    Datasheet

    ICF-322-TL-I-TR ICF Tape & Reel (TR) Active DIP, 0.3" (7.62mm) Row Spacing 22 (2 x 11) 0.100" (2.54mm) Tin - Beryllium Copper Surface Mount Open Frame Solder 0.100" (2.54mm) Tin - Beryllium Copper Liquid Crystal Polymer (LCP) -55°C ~ 125°C
    ICF-322-STL-I-TR

    ICF-322-STL-I-TR

    .100" SURFACE MOUNT SCREW MACHIN

    Samtec Inc.

    4,445
    RFQ
    ICF-322-STL-I-TR

    Datasheet

    ICF-322-STL-I-TR ICF Tape & Reel (TR) Active DIP, 0.3" (7.62mm) Row Spacing 22 (2 x 11) 0.100" (2.54mm) Tin - Beryllium Copper Surface Mount Open Frame Solder 0.100" (2.54mm) Tin - Beryllium Copper Liquid Crystal Polymer (LCP) -55°C ~ 125°C
    ICF-322-STL-O-TR

    ICF-322-STL-O-TR

    .100" SURFACE MOUNT SCREW MACHIN

    Samtec Inc.

    4,406
    RFQ
    ICF-322-STL-O-TR

    Datasheet

    ICF-322-STL-O-TR ICF Tape & Reel (TR) Active DIP, 0.3" (7.62mm) Row Spacing 22 (2 x 11) 0.100" (2.54mm) Tin - Beryllium Copper Surface Mount Open Frame Solder 0.100" (2.54mm) Tin - Beryllium Copper Liquid Crystal Polymer (LCP) -55°C ~ 125°C
    APH-0504-T-R

    APH-0504-T-R

    APH-0504-T-R

    Samtec Inc.

    3,694
    RFQ

    -

    APH-0504-T-R * - Active - - - - - - - - - - - - - - -
    APH-1404-T-R

    APH-1404-T-R

    APH-1404-T-R

    Samtec Inc.

    3,251
    RFQ

    -

    APH-1404-T-R * - Active - - - - - - - - - - - - - - -
    APH-1004-T-R

    APH-1004-T-R

    APH-1004-T-R

    Samtec Inc.

    3,175
    RFQ

    -

    APH-1004-T-R * - Active - - - - - - - - - - - - - - -
    Total 19086 Record«Prev1... 278279280281282283284285...955Next»
    HOME

    HOME

    PRODUCT

    PRODUCT

    PHONE

    PHONE

    USER

    USER