Available 24/7 at SENICO ELECTRONICS INTL CO., LIMITED
    SENICO ELECTRONICS INTL CO., LIMITED

    IC Sockets

    Manufacturer Series Packaging Product Status Type Number of Positions or Pins (Grid) Pitch - Mating Contact Finish - Mating Contact Finish Thickness - Mating Contact Material - Mating Mounting Type Features Termination Pitch - Post Contact Finish - Post Contact Finish Thickness - Post Contact Material - Post Housing Material Operating Temperature















































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































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    Photo Mfr. Part # Availability Price Quantity Datasheet RoHs Series Packaging Product Status Type Number of Positions or Pins (Grid) Pitch - Mating Contact Finish - Mating Contact Finish Thickness - Mating Contact Material - Mating Mounting Type Features Termination Pitch - Post Contact Finish - Post Contact Finish Thickness - Post Contact Material - Post Housing Material Operating Temperature
    06-3503-31

    06-3503-31

    CONN IC DIP SOCKET 6POS GOLD

    Aries Electronics

    2,499
    RFQ
    06-3503-31

    Datasheet

    06-3503-31 503 Bulk Active DIP, 0.3" (7.62mm) Row Spacing 6 (2 x 3) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Closed Frame Wire Wrap 0.100" (2.54mm) Gold 10.0µin (0.25µm) Phosphor Bronze Polyamide (PA46), Nylon 4/6, Glass Filled -55°C ~ 125°C
    08-6823-90T

    08-6823-90T

    CONN IC DIP SOCKET 8POS TIN

    Aries Electronics

    4,463
    RFQ
    08-6823-90T

    Datasheet

    08-6823-90T Vertisockets™ 800 Bulk Active DIP, 0.6" (15.24mm) Row Spacing 8 (2 x 4) 0.100" (2.54mm) Tin 200.0µin (5.08µm) Phosphor Bronze Through Hole, Right Angle, Horizontal Closed Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Phosphor Bronze Polyamide (PA46), Nylon 4/6 -
    1-1437540-4

    1-1437540-4

    CONN IC DIP SOCKET 40POS GOLD

    TE Connectivity AMP Connectors

    3,821
    RFQ
    1-1437540-4

    Datasheet

    1-1437540-4 800 Tube Obsolete DIP, 0.3" (7.62mm) Row Spacing 40 (2 x 20) 0.100" (2.54mm) Gold 25.0µin (0.63µm) Copper Alloy Through Hole Open Frame Solder 0.100" (2.54mm) - - - Polyester -55°C ~ 105°C
    28-6518-10H

    28-6518-10H

    CONN IC DIP SOCKET 28POS GOLD

    Aries Electronics

    3,716
    RFQ
    28-6518-10H

    Datasheet

    28-6518-10H 518 Bulk Active DIP, 0.6" (15.24mm) Row Spacing 28 (2 x 14) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled -
    ICA-318-ATT

    ICA-318-ATT

    .100" SCREW MACHINE DIP SOCKET

    Samtec Inc.

    2,119
    RFQ
    ICA-318-ATT

    Datasheet

    ICA-318-ATT ICA Tube Active DIP, 0.3" (7.62mm) Row Spacing 18 (2 x 9) 0.100" (2.54mm) Tin - Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Tin - Brass Polyester, Glass Filled -55°C ~ 105°C
    28-3518-10H

    28-3518-10H

    CONN IC DIP SOCKET 28POS GOLD

    Aries Electronics

    3,441
    RFQ
    28-3518-10H

    Datasheet

    28-3518-10H 518 Bulk Active DIP, 0.3" (7.62mm) Row Spacing 28 (2 x 14) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled -
    510-87-156-16-001101

    510-87-156-16-001101

    CONN SOCKET PGA 156POS GOLD

    Preci-Dip

    2,852
    RFQ
    510-87-156-16-001101

    Datasheet

    510-87-156-16-001101 510 Bulk Active PGA 156 (16 x 16) 0.100" (2.54mm) Gold Flash Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
    510-87-156-16-091101

    510-87-156-16-091101

    CONN SOCKET PGA 156POS GOLD

    Preci-Dip

    4,935
    RFQ
    510-87-156-16-091101

    Datasheet

    510-87-156-16-091101 510 Bulk Active PGA 156 (16 x 16) 0.100" (2.54mm) Gold Flash Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
    510-87-160-14-001101

    510-87-160-14-001101

    CONN SOCKET PGA 160POS GOLD

    Preci-Dip

    2,122
    RFQ
    510-87-160-14-001101

    Datasheet

    510-87-160-14-001101 510 Bulk Active PGA 160 (14 x 14) 0.100" (2.54mm) Gold Flash Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
    C9128-00

    C9128-00

    CONN IC DIP SOCKET 28POS GOLD

    Aries Electronics

    2,803
    RFQ
    C9128-00

    Datasheet

    C9128-00 Edge-Grip™, C91 Bulk Obsolete DIP, 0.6" (15.24mm) Row Spacing 28 (2 x 14) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Phosphor Bronze Through Hole Closed Frame Wire Wrap 0.100" (2.54mm) Gold 10.0µin (0.25µm) Phosphor Bronze Polyamide (PA46), Nylon 4/6, Glass Filled -55°C ~ 125°C
    26-6513-11

    26-6513-11

    CONN IC DIP SOCKET 26POS GOLD

    Aries Electronics

    2,648
    RFQ
    26-6513-11

    Datasheet

    26-6513-11 Lo-PRO®file, 513 Bulk Active DIP, 0.6" (15.24mm) Row Spacing 26 (2 x 13) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Closed Frame Solder 0.100" (2.54mm) Gold 10.0µin (0.25µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled -55°C ~ 105°C
    08-820-90WR

    08-820-90WR

    CONN IC DIP SOCKET 8POS GOLD

    Aries Electronics

    2,833
    RFQ
    08-820-90WR

    Datasheet

    08-820-90WR Vertisockets™ 800 Bulk Active DIP, 0.3" (7.62mm) Row Spacing 8 (2 x 4) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Phosphor Bronze Through Hole, Right Angle, Horizontal Closed Frame Solder 0.100" (2.54mm) Gold 10.0µin (0.25µm) Phosphor Bronze Polyamide (PA46), Nylon 4/6 -
    APO-316-G-J

    APO-316-G-J

    .100" LOW PROFILE SCREW MACHINE

    Samtec Inc.

    4,219
    RFQ
    APO-316-G-J

    Datasheet

    APO-316-G-J APO Tube Active DIP, 0.3" (7.62mm) Row Spacing 16 (2 x 8) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Phosphor Bronze Through Hole Open Frame Solder 0.100" (2.54mm) Gold 10.0µin (0.25µm) Phosphor Bronze Polybutylene Terephthalate (PBT), Glass Filled -
    8058-1G23

    8058-1G23

    CONN TRANSIST TO-5 3POS GOLD

    TE Connectivity AMP Connectors

    4,596
    RFQ
    8058-1G23

    Datasheet

    8058-1G23 8058 Bulk Obsolete Transistor, TO-5 3 (Round) - Gold - Beryllium Copper Through Hole Closed Frame Solder - Gold - Brass Polytetrafluoroethylene (PTFE) -55°C ~ 125°C
    BU400Z-178-HT

    BU400Z-178-HT

    CONN IC DIP SOCKET 40POS GOLD

    On Shore Technology Inc.

    2,325
    RFQ
    BU400Z-178-HT

    Datasheet

    BU400Z-178-HT BU-178HT Tube Obsolete DIP, 0.6" (15.24mm) Row Spacing 40 (2 x 20) 0.100" (2.54mm) Gold 78.7µin (2.00µm) Beryllium Copper Surface Mount Open Frame Solder 0.100" (2.54mm) Copper Flash Brass Polybutylene Terephthalate (PBT), Glass Filled -55°C ~ 125°C
    116-83-636-41-009101

    116-83-636-41-009101

    CONN IC DIP SOCKET 36POS GOLD

    Preci-Dip

    4,835
    RFQ
    116-83-636-41-009101

    Datasheet

    116-83-636-41-009101 116 Bulk Active DIP, 0.6" (15.24mm) Row Spacing 36 (2 x 18) 0.100" (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Elevated, Open Frame Solder 0.100" (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
    22-0513-11H

    22-0513-11H

    CONN SOCKET SIP 22POS GOLD

    Aries Electronics

    3,204
    RFQ
    22-0513-11H

    Datasheet

    22-0513-11H 0513 Bulk Active SIP 22 (1 x 22) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole - Solder 0.100" (2.54mm) Gold 10.0µin (0.25µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled -
    28-C212-10

    28-C212-10

    CONN IC DIP SOCKET 28POS GOLD

    Aries Electronics

    2,513
    RFQ
    28-C212-10

    Datasheet

    28-C212-10 EJECT-A-DIP™ Bulk Active DIP, 0.6" (15.24mm) Row Spacing 28 (2 x 14) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Closed Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled -55°C ~ 105°C
    28-C300-10

    28-C300-10

    CONN IC DIP SOCKET 28POS GOLD

    Aries Electronics

    3,953
    RFQ
    28-C300-10

    Datasheet

    28-C300-10 EJECT-A-DIP™ Bulk Active DIP, 0.6" (15.24mm) Row Spacing 28 (2 x 14) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Closed Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled -55°C ~ 105°C
    ICA-316-ZWGT-3

    ICA-316-ZWGT-3

    .100" SCREW MACHINE DIP SOCKET

    Samtec Inc.

    4,225
    RFQ
    ICA-316-ZWGT-3

    Datasheet

    ICA-316-ZWGT-3 ICA Tube Active DIP, 0.3" (7.62mm) Row Spacing 16 (2 x 8) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Tin 10.0µin (0.25µm) Brass Polyester, Glass Filled -55°C ~ 125°C
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