Available 24/7 at SENICO ELECTRONICS INTL CO., LIMITED
    SENICO ELECTRONICS INTL CO., LIMITED

    IC Sockets

    Manufacturer Series Packaging Product Status Type Number of Positions or Pins (Grid) Pitch - Mating Contact Finish - Mating Contact Finish Thickness - Mating Contact Material - Mating Mounting Type Features Termination Pitch - Post Contact Finish - Post Contact Finish Thickness - Post Contact Material - Post Housing Material Operating Temperature















































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































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    Photo Mfr. Part # Availability Price Quantity Datasheet RoHs Series Packaging Product Status Type Number of Positions or Pins (Grid) Pitch - Mating Contact Finish - Mating Contact Finish Thickness - Mating Contact Material - Mating Mounting Type Features Termination Pitch - Post Contact Finish - Post Contact Finish Thickness - Post Contact Material - Post Housing Material Operating Temperature
    HLS-0210-T-30

    HLS-0210-T-30

    .100" SCREW MACHINE SOCKET ARRAY

    Samtec Inc.

    3,999
    RFQ
    HLS-0210-T-30

    Datasheet

    HLS-0210-T-30 HLS Tube Active SIP 20 (2 x 10) 0.100" (2.54mm) Tin - - Through Hole Closed Frame Solder 0.100" (2.54mm) - - - Thermoplastic -55°C ~ 140°C
    HLS-0118-G-2

    HLS-0118-G-2

    .100" SCREW MACHINE SOCKET ARRAY

    Samtec Inc.

    3,182
    RFQ
    HLS-0118-G-2

    Datasheet

    HLS-0118-G-2 HLS Tube Active SIP 18 (1 x 18) 0.100" (2.54mm) Gold 30.0µin (0.76µm) - Through Hole Closed Frame Solder 0.100" (2.54mm) Gold 10.0µin (0.25µm) - Thermoplastic -55°C ~ 140°C
    36-3513-10

    36-3513-10

    CONN IC DIP SOCKET 36POS GOLD

    Aries Electronics

    4,911
    RFQ
    36-3513-10

    Datasheet

    36-3513-10 Lo-PRO®file, 513 Bulk Active DIP, 0.3" (7.62mm) Row Spacing 36 (2 x 18) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Closed Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled -55°C ~ 105°C
    HLS-0306-T-11

    HLS-0306-T-11

    .100" SCREW MACHINE SOCKET ARRAY

    Samtec Inc.

    4,011
    RFQ
    HLS-0306-T-11

    Datasheet

    HLS-0306-T-11 HLS Tube Active SIP 18 (3 x 6) 0.100" (2.54mm) Tin - - Through Hole Closed Frame Solder 0.100" (2.54mm) - - - Thermoplastic -55°C ~ 140°C
    30-0511-10

    30-0511-10

    CONN SOCKET SIP 30POS TIN

    Aries Electronics

    3,320
    RFQ
    30-0511-10

    Datasheet

    30-0511-10 511 Bulk Active SIP 30 (1 x 30) 0.100" (2.54mm) Tin 50.0µin (1.27µm) Phosphor Bronze Through Hole - Solder 0.100" (2.54mm) Tin 50.0µin (1.27µm) Phosphor Bronze Polyamide (PA46), Nylon 4/6, Glass Filled -55°C ~ 105°C
    ICA-314-AGT

    ICA-314-AGT

    .100" SCREW MACHINE DIP SOCKET

    Samtec Inc.

    2,569
    RFQ
    ICA-314-AGT

    Datasheet

    ICA-314-AGT ICA Tube Active DIP, 0.3" (7.62mm) Row Spacing 14 (2 x 7) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Tin 10.0µin (0.25µm) Brass Polyester, Glass Filled -55°C ~ 125°C
    06-3508-31

    06-3508-31

    CONN IC DIP SOCKET 6POS GOLD

    Aries Electronics

    3,882
    RFQ
    06-3508-31

    Datasheet

    06-3508-31 508 Bulk Active DIP, 0.3" (7.62mm) Row Spacing 6 (2 x 3) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame Wire Wrap 0.100" (2.54mm) Gold 10.0µin (0.25µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled -55°C ~ 125°C
    20-6823-90T

    20-6823-90T

    CONN IC DIP SOCKET 20POS TIN

    Aries Electronics

    3,704
    RFQ
    20-6823-90T

    Datasheet

    20-6823-90T Vertisockets™ 800 Bulk Active DIP, 0.6" (15.24mm) Row Spacing 20 (2 x 10) 0.100" (2.54mm) Tin 200.0µin (5.08µm) Phosphor Bronze Through Hole, Right Angle, Horizontal Closed Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Phosphor Bronze Polyamide (PA46), Nylon 4/6 -55°C ~ 105°C
    510-87-184-15-001101

    510-87-184-15-001101

    CONN SOCKET PGA 184POS GOLD

    Preci-Dip

    4,875
    RFQ
    510-87-184-15-001101

    Datasheet

    510-87-184-15-001101 510 Bulk Active PGA 184 (15 x 15) 0.100" (2.54mm) Gold Flash Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
    06-3503-21

    06-3503-21

    CONN IC DIP SOCKET 6POS GOLD

    Aries Electronics

    2,267
    RFQ
    06-3503-21

    Datasheet

    06-3503-21 503 Bulk Active DIP, 0.3" (7.62mm) Row Spacing 6 (2 x 3) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Closed Frame Wire Wrap 0.100" (2.54mm) Gold 10.0µin (0.25µm) Phosphor Bronze Polyamide (PA46), Nylon 4/6, Glass Filled -55°C ~ 125°C
    124-83-640-41-002101

    124-83-640-41-002101

    CONN IC DIP SOCKET 40POS GOLD

    Preci-Dip

    3,703
    RFQ

    -

    124-83-640-41-002101 124 Bulk Active DIP, 0.6" (15.24mm) Row Spacing 40 (2 x 20) 0.100" (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Open Frame Wire Wrap 0.100" (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
    ICO-314-ZMGG

    ICO-314-ZMGG

    .100" LOW PROFILE SCREW MACHINE

    Samtec Inc.

    3,719
    RFQ
    ICO-314-ZMGG

    Datasheet

    ICO-314-ZMGG ICO Tube Active DIP, 0.3" (7.62mm) Row Spacing 14 (2 x 7) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Gold 30.0µin (0.76µm) Brass Polyester, Glass Filled -55°C ~ 125°C
    550-80-056-09-041101

    550-80-056-09-041101

    PGA SOLDER TAIL

    Preci-Dip

    2,483
    RFQ
    550-80-056-09-041101

    Datasheet

    550-80-056-09-041101 550 Bulk Active PGA 56 (9 x 9) 0.100" (2.54mm) Tin - Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
    115-93-304-41-001000

    115-93-304-41-001000

    CONN IC DIP SOCKET 4POS GOLD

    Mill-Max Manufacturing Corp.

    2,259
    RFQ
    115-93-304-41-001000

    Datasheet

    115-93-304-41-001000 115 Tube Active DIP, 0.3" (7.62mm) Row Spacing 4 (2 x 2) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Tin-Lead 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
    115-43-304-41-001000

    115-43-304-41-001000

    CONN IC SKT DBL

    Mill-Max Manufacturing Corp.

    4,843
    RFQ
    115-43-304-41-001000

    Datasheet

    115-43-304-41-001000 115 Tube Active DIP, 0.3" (7.62mm) Row Spacing 4 (2 x 2) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
    08-6823-90

    08-6823-90

    CONN IC DIP SOCKET 8POS GOLD

    Aries Electronics

    3,440
    RFQ
    08-6823-90

    Datasheet

    08-6823-90 Vertisockets™ 800 Bulk Active DIP, 0.6" (15.24mm) Row Spacing 8 (2 x 4) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Phosphor Bronze Through Hole, Right Angle, Horizontal Closed Frame Solder 0.100" (2.54mm) Gold 10.0µin (0.25µm) Phosphor Bronze Polyamide (PA46), Nylon 4/6 -
    10-81250-610C

    10-81250-610C

    CONN IC DIP SOCKET 10POS GOLD

    Aries Electronics

    3,673
    RFQ
    10-81250-610C

    Datasheet

    10-81250-610C 8 Bulk Active DIP, 0.6" (15.24mm) Row Spacing 10 (2 x 5) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Closed Frame, Elevated Solder 0.100" (2.54mm) Gold 10.0µin (0.25µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled -55°C ~ 105°C
    10-8335-610C

    10-8335-610C

    CONN IC DIP SOCKET 10POS GOLD

    Aries Electronics

    3,044
    RFQ
    10-8335-610C

    Datasheet

    10-8335-610C 8 Bulk Active DIP, 0.6" (15.24mm) Row Spacing 10 (2 x 5) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Closed Frame, Elevated Solder 0.100" (2.54mm) Gold 10.0µin (0.25µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled -55°C ~ 105°C
    10-8340-610C

    10-8340-610C

    CONN IC DIP SOCKET 10POS GOLD

    Aries Electronics

    2,200
    RFQ
    10-8340-610C

    Datasheet

    10-8340-610C 8 Bulk Active DIP, 0.6" (15.24mm) Row Spacing 10 (2 x 5) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Closed Frame, Elevated Solder 0.100" (2.54mm) Gold 10.0µin (0.25µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled -55°C ~ 105°C
    10-8433-610C

    10-8433-610C

    CONN IC DIP SOCKET 10POS GOLD

    Aries Electronics

    2,868
    RFQ
    10-8433-610C

    Datasheet

    10-8433-610C 8 Bulk Active DIP, 0.6" (15.24mm) Row Spacing 10 (2 x 5) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Closed Frame, Elevated Solder 0.100" (2.54mm) Gold 10.0µin (0.25µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled -55°C ~ 105°C
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