Available 24/7 at SENICO ELECTRONICS INTL CO., LIMITED
    SENICO ELECTRONICS INTL CO., LIMITED

    IC Sockets

    Manufacturer Series Packaging Product Status Type Number of Positions or Pins (Grid) Pitch - Mating Contact Finish - Mating Contact Finish Thickness - Mating Contact Material - Mating Mounting Type Features Termination Pitch - Post Contact Finish - Post Contact Finish Thickness - Post Contact Material - Post Housing Material Operating Temperature















































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































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    Photo Mfr. Part # Availability Price Quantity Datasheet RoHs Series Packaging Product Status Type Number of Positions or Pins (Grid) Pitch - Mating Contact Finish - Mating Contact Finish Thickness - Mating Contact Material - Mating Mounting Type Features Termination Pitch - Post Contact Finish - Post Contact Finish Thickness - Post Contact Material - Post Housing Material Operating Temperature
    10-8440-610C

    10-8440-610C

    CONN IC DIP SOCKET 10POS GOLD

    Aries Electronics

    2,741
    RFQ
    10-8440-610C

    Datasheet

    10-8440-610C 8 Bulk Active DIP, 0.6" (15.24mm) Row Spacing 10 (2 x 5) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Closed Frame, Elevated Solder 0.100" (2.54mm) Gold 10.0µin (0.25µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled -55°C ~ 105°C
    10-8470-610C

    10-8470-610C

    CONN IC DIP SOCKET 10POS GOLD

    Aries Electronics

    3,101
    RFQ
    10-8470-610C

    Datasheet

    10-8470-610C 8 Bulk Active DIP, 0.6" (15.24mm) Row Spacing 10 (2 x 5) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Closed Frame, Elevated Solder 0.100" (2.54mm) Gold 10.0µin (0.25µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled -55°C ~ 105°C
    10-8545-610C

    10-8545-610C

    CONN IC DIP SOCKET 10POS GOLD

    Aries Electronics

    2,282
    RFQ
    10-8545-610C

    Datasheet

    10-8545-610C 8 Bulk Active DIP, 0.6" (15.24mm) Row Spacing 10 (2 x 5) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Closed Frame, Elevated Solder 0.100" (2.54mm) Gold 10.0µin (0.25µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled -55°C ~ 105°C
    10-8550-610C

    10-8550-610C

    CONN IC DIP SOCKET 10POS GOLD

    Aries Electronics

    3,105
    RFQ
    10-8550-610C

    Datasheet

    10-8550-610C 8 Bulk Active DIP, 0.6" (15.24mm) Row Spacing 10 (2 x 5) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Closed Frame, Elevated Solder 0.100" (2.54mm) Gold 10.0µin (0.25µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled -55°C ~ 105°C
    10-8563-610C

    10-8563-610C

    CONN IC DIP SOCKET 10POS GOLD

    Aries Electronics

    3,680
    RFQ
    10-8563-610C

    Datasheet

    10-8563-610C 8 Bulk Active DIP, 0.6" (15.24mm) Row Spacing 10 (2 x 5) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Closed Frame, Elevated Solder 0.100" (2.54mm) Gold 10.0µin (0.25µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled -55°C ~ 105°C
    10-8750-610C

    10-8750-610C

    CONN IC DIP SOCKET 10POS GOLD

    Aries Electronics

    4,084
    RFQ
    10-8750-610C

    Datasheet

    10-8750-610C 8 Bulk Active DIP, 0.6" (15.24mm) Row Spacing 10 (2 x 5) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Closed Frame, Elevated Solder 0.100" (2.54mm) Gold 10.0µin (0.25µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled -55°C ~ 105°C
    10-8937-610C

    10-8937-610C

    CONN IC DIP SOCKET 10POS GOLD

    Aries Electronics

    4,382
    RFQ
    10-8937-610C

    Datasheet

    10-8937-610C 8 Bulk Active DIP, 0.6" (15.24mm) Row Spacing 10 (2 x 5) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Closed Frame, Elevated Solder 0.100" (2.54mm) Gold 10.0µin (0.25µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled -55°C ~ 105°C
    PGA179H009B5-1836R

    PGA179H009B5-1836R

    PGA SOCKET 179 CTS

    Amphenol ICC (FCI)

    4,660
    RFQ
    PGA179H009B5-1836R

    Datasheet

    PGA179H009B5-1836R - - Active PGA 179 (18 x 18) 0.100" (2.54mm) Gold 30.0µin (0.76µm) - Through Hole Open Frame - - - - - - -
    214-44-628-01-670799

    214-44-628-01-670799

    STANDRD SOLDER TAIL DIP SOCKET

    Mill-Max Manufacturing Corp.

    2,153
    RFQ

    -

    214-44-628-01-670799 214 Tape & Reel (TR) Active DIP, 0.6" (15.24mm) Row Spacing 28 (2 x 14) 0.100" (2.54mm) Tin 100.0µin (2.54µm) Beryllium Copper Surface Mount Closed Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Alloy Polyamide (PA46), Nylon 4/6 -55°C ~ 125°C
    214-99-628-01-670799

    214-99-628-01-670799

    STANDRD SOLDER TAIL DIP SOCKET

    Mill-Max Manufacturing Corp.

    3,783
    RFQ

    -

    214-99-628-01-670799 214 Tape & Reel (TR) Active DIP, 0.6" (15.24mm) Row Spacing 28 (2 x 14) 0.100" (2.54mm) Tin-Lead 100.0µin (2.54µm) Beryllium Copper Surface Mount Closed Frame Solder 0.100" (2.54mm) Tin-Lead 200.0µin (5.08µm) Brass Alloy Polyamide (PA46), Nylon 4/6 -55°C ~ 125°C
    510-83-121-13-061101

    510-83-121-13-061101

    CONN SOCKET PGA 121POS GOLD

    Preci-Dip

    4,459
    RFQ
    510-83-121-13-061101

    Datasheet

    510-83-121-13-061101 510 Bulk Active PGA 121 (13 x 13) 0.100" (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
    HLS-0114-T-18

    HLS-0114-T-18

    .100" SCREW MACHINE SOCKET ARRAY

    Samtec Inc.

    2,946
    RFQ
    HLS-0114-T-18

    Datasheet

    HLS-0114-T-18 HLS Tube Active SIP 14 (1 x 14) 0.100" (2.54mm) Tin - - Through Hole Closed Frame Solder 0.100" (2.54mm) - - - Thermoplastic -55°C ~ 140°C
    27-0511-10

    27-0511-10

    CONN SOCKET SIP 27POS TIN

    Aries Electronics

    2,351
    RFQ
    27-0511-10

    Datasheet

    27-0511-10 511 Bulk Active SIP 27 (1 x 27) 0.100" (2.54mm) Tin 50.0µin (1.27µm) Phosphor Bronze Through Hole - Solder 0.100" (2.54mm) Tin 50.0µin (1.27µm) Phosphor Bronze Polyamide (PA46), Nylon 4/6, Glass Filled -55°C ~ 105°C
    116-83-624-41-013101

    116-83-624-41-013101

    CONN IC DIP SOCKET 24POS GOLD

    Preci-Dip

    3,916
    RFQ
    116-83-624-41-013101

    Datasheet

    116-83-624-41-013101 116 Bulk Active DIP, 0.6" (15.24mm) Row Spacing 24 (2 x 12) 0.100" (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Elevated, Open Frame Solder 0.100" (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
    03-71250-10

    03-71250-10

    CONN SOCKET SIP 3POS TIN

    Aries Electronics

    4,527
    RFQ
    03-71250-10

    Datasheet

    03-71250-10 700 Elevator Strip-Line™ Bulk Active SIP 3 (1 x 3) 0.100" (2.54mm) Tin 200.0µin (5.08µm) Phosphor Bronze Through Hole Elevated Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Phosphor Bronze Polyamide (PA46), Nylon 4/6, Glass Filled -55°C ~ 105°C
    03-7360-10

    03-7360-10

    CONN SOCKET SIP 3POS TIN

    Aries Electronics

    2,891
    RFQ
    03-7360-10

    Datasheet

    03-7360-10 700 Elevator Strip-Line™ Bulk Active SIP 3 (1 x 3) 0.100" (2.54mm) Tin 200.0µin (5.08µm) Phosphor Bronze Through Hole Elevated Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Phosphor Bronze Polyamide (PA46), Nylon 4/6, Glass Filled -55°C ~ 105°C
    03-7630-10

    03-7630-10

    CONN SOCKET SIP 3POS TIN

    Aries Electronics

    4,870
    RFQ
    03-7630-10

    Datasheet

    03-7630-10 700 Elevator Strip-Line™ Bulk Active SIP 3 (1 x 3) 0.100" (2.54mm) Tin 200.0µin (5.08µm) Phosphor Bronze Through Hole Elevated Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Phosphor Bronze Polyamide (PA46), Nylon 4/6, Glass Filled -55°C ~ 105°C
    03-7880-10

    03-7880-10

    CONN SOCKET SIP 3POS TIN

    Aries Electronics

    4,679
    RFQ
    03-7880-10

    Datasheet

    03-7880-10 700 Elevator Strip-Line™ Bulk Active SIP 3 (1 x 3) 0.100" (2.54mm) Tin 200.0µin (5.08µm) Phosphor Bronze Through Hole Elevated Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Phosphor Bronze Polyamide (PA46), Nylon 4/6, Glass Filled -55°C ~ 105°C
    10-0503-21

    10-0503-21

    CONN SOCKET SIP 10POS GOLD

    Aries Electronics

    3,786
    RFQ
    10-0503-21

    Datasheet

    10-0503-21 0503 Bulk Active SIP 10 (1 x 10) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole - Wire Wrap 0.100" (2.54mm) Gold 10.0µin (0.25µm) Brass Polyamide (PA), Nylon, Glass Filled -
    10-0503-31

    10-0503-31

    CONN SOCKET SIP 10POS GOLD

    Aries Electronics

    2,891
    RFQ
    10-0503-31

    Datasheet

    10-0503-31 0503 Bulk Active SIP 10 (1 x 10) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole - Wire Wrap 0.100" (2.54mm) Gold 10.0µin (0.25µm) Brass Polyamide (PA), Nylon, Glass Filled -
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