Available 24/7 at SENICO ELECTRONICS INTL CO., LIMITED
    SENICO ELECTRONICS INTL CO., LIMITED

    IC Sockets

    Manufacturer Series Packaging Product Status Type Number of Positions or Pins (Grid) Pitch - Mating Contact Finish - Mating Contact Finish Thickness - Mating Contact Material - Mating Mounting Type Features Termination Pitch - Post Contact Finish - Post Contact Finish Thickness - Post Contact Material - Post Housing Material Operating Temperature















































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































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    Photo Mfr. Part # Availability Price Quantity Datasheet RoHs Series Packaging Product Status Type Number of Positions or Pins (Grid) Pitch - Mating Contact Finish - Mating Contact Finish Thickness - Mating Contact Material - Mating Mounting Type Features Termination Pitch - Post Contact Finish - Post Contact Finish Thickness - Post Contact Material - Post Housing Material Operating Temperature
    116-87-648-41-001101

    116-87-648-41-001101

    CONN IC DIP SOCKET 48POS GOLD

    Preci-Dip

    3,514
    RFQ
    116-87-648-41-001101

    Datasheet

    116-87-648-41-001101 116 Bulk Active DIP, 0.6" (15.24mm) Row Spacing 48 (2 x 24) 0.100" (2.54mm) Gold Flash Beryllium Copper Through Hole Elevated, Open Frame Solder 0.100" (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
    116-41-304-41-003000

    116-41-304-41-003000

    CONN IC SKT DBL

    Mill-Max Manufacturing Corp.

    4,246
    RFQ
    116-41-304-41-003000

    Datasheet

    116-41-304-41-003000 116 Tube Active DIP, 0.3" (7.62mm) Row Spacing 4 (2 x 2) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Elevated, Open Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
    116-91-304-41-003000

    116-91-304-41-003000

    CONN IC SKT DBL

    Mill-Max Manufacturing Corp.

    2,688
    RFQ
    116-91-304-41-003000

    Datasheet

    116-91-304-41-003000 116 Tube Active DIP, 0.3" (7.62mm) Row Spacing 4 (2 x 2) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Elevated, Open Frame Solder 0.100" (2.54mm) Tin-Lead 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
    07-0501-21

    07-0501-21

    CONN SOCKET SIP 7POS GOLD

    Aries Electronics

    4,699
    RFQ
    07-0501-21

    Datasheet

    07-0501-21 501 Bulk Active SIP 7 (1 x 7) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Phosphor Bronze Through Hole - Wire Wrap 0.100" (2.54mm) Gold 10.0µin (0.25µm) Phosphor Bronze Polyamide (PA46), Nylon 4/6, Glass Filled -55°C ~ 125°C
    07-0501-31

    07-0501-31

    CONN SOCKET SIP 7POS GOLD

    Aries Electronics

    4,434
    RFQ
    07-0501-31

    Datasheet

    07-0501-31 501 Bulk Active SIP 7 (1 x 7) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Phosphor Bronze Through Hole - Wire Wrap 0.100" (2.54mm) Gold 10.0µin (0.25µm) Phosphor Bronze Polyamide (PA46), Nylon 4/6, Glass Filled -55°C ~ 125°C
    ICO-314-AGG

    ICO-314-AGG

    .100" LOW PROFILE SCREW MACHINE

    Samtec Inc.

    3,072
    RFQ
    ICO-314-AGG

    Datasheet

    ICO-314-AGG ICO Tube Active DIP, 0.3" (7.62mm) Row Spacing 14 (2 x 7) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Gold 30.0µin (0.76µm) Brass Polyester, Glass Filled -55°C ~ 125°C
    ICA-314-AGG

    ICA-314-AGG

    .100" SCREW MACHINE DIP SOCKET

    Samtec Inc.

    3,060
    RFQ
    ICA-314-AGG

    Datasheet

    ICA-314-AGG ICA Tube Active DIP, 0.3" (7.62mm) Row Spacing 14 (2 x 7) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Gold 30.0µin (0.76µm) Brass Polyester, Glass Filled -55°C ~ 125°C
    26-3513-11

    26-3513-11

    CONN IC DIP SOCKET 26POS GOLD

    Aries Electronics

    4,080
    RFQ
    26-3513-11

    Datasheet

    26-3513-11 Lo-PRO®file, 513 Bulk Active DIP, 0.3" (7.62mm) Row Spacing 26 (2 x 13) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Closed Frame Solder 0.100" (2.54mm) Gold 10.0µin (0.25µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled -55°C ~ 105°C
    116-87-652-41-011101

    116-87-652-41-011101

    CONN IC DIP SOCKET 52POS GOLD

    Preci-Dip

    3,223
    RFQ
    116-87-652-41-011101

    Datasheet

    116-87-652-41-011101 116 Bulk Active DIP, 0.6" (15.24mm) Row Spacing 52 (2 x 26) 0.100" (2.54mm) Gold Flash Beryllium Copper Through Hole Elevated, Open Frame Solder 0.100" (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
    29-0511-10

    29-0511-10

    CONN SOCKET SIP 29POS TIN

    Aries Electronics

    4,873
    RFQ
    29-0511-10

    Datasheet

    29-0511-10 511 Bulk Active SIP 29 (1 x 29) 0.100" (2.54mm) Tin 50.0µin (1.27µm) Phosphor Bronze Through Hole - Solder 0.100" (2.54mm) Tin 50.0µin (1.27µm) Phosphor Bronze Polyamide (PA46), Nylon 4/6, Glass Filled -55°C ~ 105°C
    22-4513-11H

    22-4513-11H

    CONN IC DIP SOCKET 22POS GOLD

    Aries Electronics

    3,698
    RFQ
    22-4513-11H

    Datasheet

    22-4513-11H Lo-PRO®file, 513 Bulk Active DIP, 0.4" (10.16mm) Row Spacing 22 (2 x 11) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Closed Frame Solder 0.100" (2.54mm) Gold 10.0µin (0.25µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled -55°C ~ 105°C
    18-3503-20

    18-3503-20

    CONN IC DIP SOCKET 18POS GOLD

    Aries Electronics

    4,868
    RFQ
    18-3503-20

    Datasheet

    18-3503-20 503 Bulk Active DIP, 0.3" (7.62mm) Row Spacing 18 (2 x 9) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Closed Frame Wire Wrap 0.100" (2.54mm) Tin 200.0µin (5.08µm) Phosphor Bronze Polyamide (PA46), Nylon 4/6, Glass Filled -55°C ~ 105°C
    18-3503-30

    18-3503-30

    CONN IC DIP SOCKET 18POS GOLD

    Aries Electronics

    2,251
    RFQ
    18-3503-30

    Datasheet

    18-3503-30 503 Bulk Active DIP, 0.3" (7.62mm) Row Spacing 18 (2 x 9) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Closed Frame Wire Wrap 0.100" (2.54mm) Tin 200.0µin (5.08µm) Phosphor Bronze Polyamide (PA46), Nylon 4/6, Glass Filled -55°C ~ 105°C
    299-87-626-10-002101

    299-87-626-10-002101

    CONN IC DIP SOCKET 26POS GOLD

    Preci-Dip

    3,646
    RFQ
    299-87-626-10-002101

    Datasheet

    299-87-626-10-002101 299 Bulk Active DIP, 0.6" (15.24mm) Row Spacing 26 (2 x 13) 0.100" (2.54mm) Gold Flash Beryllium Copper Through Hole, Right Angle, Horizontal Closed Frame Solder 0.100" (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
    APA-318-T-P

    APA-318-T-P

    ADAPTER PLUG

    Samtec Inc.

    3,481
    RFQ
    APA-318-T-P

    Datasheet

    APA-318-T-P APA Tube Active - 18 (2 x 9) 0.100" (2.54mm) Tin - Phosphor Bronze Through Hole Open Frame Solder 0.100" (2.54mm) Tin - Phosphor Bronze Polybutylene Terephthalate (PBT), Glass Filled -
    ICF-316-STL-I

    ICF-316-STL-I

    .100" SURFACE MOUNT SCREW MACHIN

    Samtec Inc.

    4,464
    RFQ
    ICF-316-STL-I

    Datasheet

    ICF-316-STL-I ICF Bulk Active DIP, 0.3" (7.62mm) Row Spacing 16 (2 x 8) 0.100" (2.54mm) Tin - Beryllium Copper Surface Mount Open Frame Solder 0.100" (2.54mm) Tin - Beryllium Copper Liquid Crystal Polymer (LCP) -55°C ~ 125°C
    ICF-316-STL-O

    ICF-316-STL-O

    .100" SURFACE MOUNT SCREW MACHIN

    Samtec Inc.

    3,879
    RFQ
    ICF-316-STL-O

    Datasheet

    ICF-316-STL-O ICF Bulk Active DIP, 0.3" (7.62mm) Row Spacing 16 (2 x 8) 0.100" (2.54mm) Tin - Beryllium Copper Surface Mount Open Frame Solder 0.100" (2.54mm) Tin - Beryllium Copper Liquid Crystal Polymer (LCP) -55°C ~ 125°C
    10-0501-20

    10-0501-20

    CONN SOCKET SIP 10POS TIN

    Aries Electronics

    4,004
    RFQ
    10-0501-20

    Datasheet

    10-0501-20 501 Bulk Active SIP 10 (1 x 10) 0.100" (2.54mm) Tin 200.0µin (5.08µm) Phosphor Bronze Through Hole - Wire Wrap 0.100" (2.54mm) Tin 200.0µin (5.08µm) Phosphor Bronze Polyamide (PA46), Nylon 4/6, Glass Filled -55°C ~ 105°C
    10-0501-30

    10-0501-30

    CONN SOCKET SIP 10POS TIN

    Aries Electronics

    3,382
    RFQ
    10-0501-30

    Datasheet

    10-0501-30 501 Bulk Active SIP 10 (1 x 10) 0.100" (2.54mm) Tin 200.0µin (5.08µm) Phosphor Bronze Through Hole - Wire Wrap 0.100" (2.54mm) Tin 200.0µin (5.08µm) Phosphor Bronze Polyamide (PA46), Nylon 4/6, Glass Filled -55°C ~ 105°C
    ICA-624-ZSGT-L

    ICA-624-ZSGT-L

    .100" SCREW MACHINE DIP SOCKET

    Samtec Inc.

    2,898
    RFQ
    ICA-624-ZSGT-L

    Datasheet

    ICA-624-ZSGT-L ICA Tube Active DIP, 0.6" (15.24mm) Row Spacing 24 (2 x 12) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Tin 10.0µin (0.25µm) Brass Polyester, Glass Filled -55°C ~ 125°C
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