Available 24/7 at SENICO ELECTRONICS INTL CO., LIMITED
    SENICO ELECTRONICS INTL CO., LIMITED

    IC Sockets

    Manufacturer Series Packaging Product Status Type Number of Positions or Pins (Grid) Pitch - Mating Contact Finish - Mating Contact Finish Thickness - Mating Contact Material - Mating Mounting Type Features Termination Pitch - Post Contact Finish - Post Contact Finish Thickness - Post Contact Material - Post Housing Material Operating Temperature















































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































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    Photo Mfr. Part # Availability Price Quantity Datasheet RoHs Series Packaging Product Status Type Number of Positions or Pins (Grid) Pitch - Mating Contact Finish - Mating Contact Finish Thickness - Mating Contact Material - Mating Mounting Type Features Termination Pitch - Post Contact Finish - Post Contact Finish Thickness - Post Contact Material - Post Housing Material Operating Temperature
    38-3513-10H

    38-3513-10H

    CONN IC DIP SOCKET 38POS GOLD

    Aries Electronics

    4,352
    RFQ
    38-3513-10H

    Datasheet

    38-3513-10H Lo-PRO®file, 513 Bulk Active DIP, 0.3" (7.62mm) Row Spacing 38 (2 x 19) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Closed Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled -55°C ~ 105°C
    20-823-90T

    20-823-90T

    CONN IC DIP SOCKET 20POS TIN

    Aries Electronics

    4,984
    RFQ
    20-823-90T

    Datasheet

    20-823-90T Vertisockets™ 800 Bulk Active DIP, 0.3" (7.62mm) Row Spacing 20 (2 x 10) 0.100" (2.54mm) Tin 200.0µin (5.08µm) Phosphor Bronze Through Hole, Right Angle, Horizontal Closed Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Phosphor Bronze Polyamide (PA46), Nylon 4/6 -55°C ~ 105°C
    510-83-143-15-081101

    510-83-143-15-081101

    CONN SOCKET PGA 143POS GOLD

    Preci-Dip

    3,868
    RFQ
    510-83-143-15-081101

    Datasheet

    510-83-143-15-081101 510 Bulk Active PGA 143 (15 x 15) 0.100" (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
    HLS-0116-G-12

    HLS-0116-G-12

    .100" SCREW MACHINE SOCKET ARRAY

    Samtec Inc.

    2,385
    RFQ
    HLS-0116-G-12

    Datasheet

    HLS-0116-G-12 HLS Tube Active SIP 16 (1 x 16) 0.100" (2.54mm) Gold 30.0µin (0.76µm) - Through Hole Closed Frame Solder 0.100" (2.54mm) Gold 10.0µin (0.25µm) - Thermoplastic -55°C ~ 140°C
    4-1437508-0

    4-1437508-0

    CONN TRANSIST TO-5 8POS GOLD

    TE Connectivity AMP Connectors

    4,318
    RFQ

    -

    4-1437508-0 8058 Bulk Obsolete Transistor, TO-5 8 (Round) - Gold - Beryllium Copper Through Hole Closed Frame Solder - Gold - Beryllium Copper Polytetrafluoroethylene (PTFE) -55°C ~ 125°C
    ICA-422-ZSGG

    ICA-422-ZSGG

    .100" SCREW MACHINE DIP SOCKET

    Samtec Inc.

    3,439
    RFQ
    ICA-422-ZSGG

    Datasheet

    ICA-422-ZSGG ICA Tube Active DIP, 0.4" (10.16mm) Row Spacing 22 (2 x 11) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Gold 30.0µin (0.76µm) Brass Polyester, Glass Filled -55°C ~ 125°C
    ICO-422-ZSGG

    ICO-422-ZSGG

    .100" LOW PROFILE SCREW MACHINE

    Samtec Inc.

    2,240
    RFQ
    ICO-422-ZSGG

    Datasheet

    ICO-422-ZSGG ICO Tube Active DIP, 0.4" (10.16mm) Row Spacing 22 (2 x 11) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Gold 30.0µin (0.76µm) Brass Polyester, Glass Filled -55°C ~ 125°C
    510-83-159-16-071101

    510-83-159-16-071101

    CONN SOCKET PGA 159POS GOLD

    Preci-Dip

    4,881
    RFQ
    510-83-159-16-071101

    Datasheet

    510-83-159-16-071101 510 Bulk Active PGA 159 (16 x 16) 0.100" (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
    18-3508-20

    18-3508-20

    CONN IC DIP SOCKET 18POS GOLD

    Aries Electronics

    3,688
    RFQ
    18-3508-20

    Datasheet

    18-3508-20 508 Bulk Active DIP, 0.3" (7.62mm) Row Spacing 18 (2 x 9) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame Wire Wrap 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled -55°C ~ 105°C
    18-3508-30

    18-3508-30

    CONN IC DIP SOCKET 18POS GOLD

    Aries Electronics

    4,798
    RFQ
    18-3508-30

    Datasheet

    18-3508-30 508 Bulk Active DIP, 0.3" (7.62mm) Row Spacing 18 (2 x 9) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame Wire Wrap 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled -55°C ~ 105°C
    APO-322-T-R

    APO-322-T-R

    .100" LOW PROFILE SCREW MACHINE

    Samtec Inc.

    4,924
    RFQ
    APO-322-T-R

    Datasheet

    APO-322-T-R APO Bulk Active DIP, 0.3" (7.62mm) Row Spacing 22 (2 x 11) 0.100" (2.54mm) Tin - Phosphor Bronze Through Hole Open Frame Solder 0.100" (2.54mm) Tin - Phosphor Bronze Polybutylene Terephthalate (PBT), Glass Filled -
    116-83-652-41-011101

    116-83-652-41-011101

    CONN IC DIP SOCKET 52POS GOLD

    Preci-Dip

    2,229
    RFQ
    116-83-652-41-011101

    Datasheet

    116-83-652-41-011101 116 Bulk Active DIP, 0.6" (15.24mm) Row Spacing 52 (2 x 26) 0.100" (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Elevated, Open Frame Solder 0.100" (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
    ICA-316-WGG-2

    ICA-316-WGG-2

    .100" SCREW MACHINE DIP SOCKET

    Samtec Inc.

    3,371
    RFQ
    ICA-316-WGG-2

    Datasheet

    ICA-316-WGG-2 ICA Tube Active DIP, 0.3" (7.62mm) Row Spacing 16 (2 x 8) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Gold 30.0µin (0.76µm) Brass Polyester, Glass Filled -55°C ~ 125°C
    ICA-318-ZWGG-3

    ICA-318-ZWGG-3

    .100" SCREW MACHINE DIP SOCKET

    Samtec Inc.

    2,167
    RFQ
    ICA-318-ZWGG-3

    Datasheet

    ICA-318-ZWGG-3 ICA Tube Active DIP, 0.3" (7.62mm) Row Spacing 18 (2 x 9) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Gold 30.0µin (0.76µm) Brass Polyester, Glass Filled -55°C ~ 125°C
    126-93-304-41-003000

    126-93-304-41-003000

    CONN IC DIP SOCKET 4POS GOLD

    Mill-Max Manufacturing Corp.

    4,720
    RFQ
    126-93-304-41-003000

    Datasheet

    126-93-304-41-003000 126 Tube Active DIP, 0.3" (7.62mm) Row Spacing 4 (2 x 2) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame Wire Wrap 0.100" (2.54mm) Tin-Lead 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
    126-43-304-41-003000

    126-43-304-41-003000

    CONN IC SKT DBL

    Mill-Max Manufacturing Corp.

    3,102
    RFQ
    126-43-304-41-003000

    Datasheet

    126-43-304-41-003000 126 Tube Active DIP, 0.3" (7.62mm) Row Spacing 4 (2 x 2) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame Wire Wrap 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
    14-6501-21

    14-6501-21

    CONN IC DIP SOCKET 14POS GOLD

    Aries Electronics

    2,350
    RFQ
    14-6501-21

    Datasheet

    14-6501-21 501 Bulk Active DIP, 0.6" (15.24mm) Row Spacing 14 (2 x 7) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Phosphor Bronze Through Hole Closed Frame Wire Wrap 0.100" (2.54mm) Gold 10.0µin (0.25µm) Phosphor Bronze Polyamide (PA46), Nylon 4/6, Glass Filled -55°C ~ 125°C
    14-6501-31

    14-6501-31

    CONN IC DIP SOCKET 14POS GOLD

    Aries Electronics

    3,444
    RFQ
    14-6501-31

    Datasheet

    14-6501-31 501 Bulk Active DIP, 0.6" (15.24mm) Row Spacing 14 (2 x 7) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Phosphor Bronze Through Hole Closed Frame Wire Wrap 0.100" (2.54mm) Gold 10.0µin (0.25µm) Phosphor Bronze Polyamide (PA46), Nylon 4/6, Glass Filled -55°C ~ 125°C
    510-83-144-15-001101

    510-83-144-15-001101

    CONN SOCKET PGA 144POS GOLD

    Preci-Dip

    2,170
    RFQ
    510-83-144-15-001101

    Datasheet

    510-83-144-15-001101 510 Bulk Active PGA 144 (15 x 15) 0.100" (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
    28-3518-11H

    28-3518-11H

    CONN IC DIP SOCKET 28POS GOLD

    Aries Electronics

    4,514
    RFQ
    28-3518-11H

    Datasheet

    28-3518-11H 518 Bulk Active DIP, 0.3" (7.62mm) Row Spacing 28 (2 x 14) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Gold 10.0µin (0.25µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled -
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