Available 24/7 at SENICO ELECTRONICS INTL CO., LIMITED
    SENICO ELECTRONICS INTL CO., LIMITED

    IC Sockets

    Manufacturer Series Packaging Product Status Type Number of Positions or Pins (Grid) Pitch - Mating Contact Finish - Mating Contact Finish Thickness - Mating Contact Material - Mating Mounting Type Features Termination Pitch - Post Contact Finish - Post Contact Finish Thickness - Post Contact Material - Post Housing Material Operating Temperature















































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































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    Photo Mfr. Part # Availability Price Quantity Datasheet RoHs Series Packaging Product Status Type Number of Positions or Pins (Grid) Pitch - Mating Contact Finish - Mating Contact Finish Thickness - Mating Contact Material - Mating Mounting Type Features Termination Pitch - Post Contact Finish - Post Contact Finish Thickness - Post Contact Material - Post Housing Material Operating Temperature
    510-83-160-15-061101

    510-83-160-15-061101

    CONN SOCKET PGA 160POS GOLD

    Preci-Dip

    2,064
    RFQ
    510-83-160-15-061101

    Datasheet

    510-83-160-15-061101 510 Bulk Active PGA 160 (15 x 15) 0.100" (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
    510-83-160-13-001101

    510-83-160-13-001101

    CONN SOCKET PGA 160POS GOLD

    Preci-Dip

    3,774
    RFQ
    510-83-160-13-001101

    Datasheet

    510-83-160-13-001101 510 Bulk Active PGA 160 (13 x 13) 0.100" (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
    510-83-160-14-001101

    510-83-160-14-001101

    CONN SOCKET PGA 160POS GOLD

    Preci-Dip

    4,681
    RFQ
    510-83-160-14-001101

    Datasheet

    510-83-160-14-001101 510 Bulk Active PGA 160 (14 x 14) 0.100" (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
    HLS-0209-G-38

    HLS-0209-G-38

    .100" SCREW MACHINE SOCKET ARRAY

    Samtec Inc.

    4,083
    RFQ
    HLS-0209-G-38

    Datasheet

    HLS-0209-G-38 HLS Tube Active SIP 18 (2 x 9) 0.100" (2.54mm) Gold 30.0µin (0.76µm) - Through Hole Closed Frame Solder 0.100" (2.54mm) Gold 10.0µin (0.25µm) - Thermoplastic -55°C ~ 140°C
    510-83-160-16-081101

    510-83-160-16-081101

    CONN SOCKET PGA 160POS GOLD

    Preci-Dip

    4,372
    RFQ
    510-83-160-16-081101

    Datasheet

    510-83-160-16-081101 510 Bulk Active PGA 160 (16 x 16) 0.100" (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
    124-41-304-41-002000

    124-41-304-41-002000

    CONN IC SKT DBL

    Mill-Max Manufacturing Corp.

    4,612
    RFQ
    124-41-304-41-002000

    Datasheet

    124-41-304-41-002000 124 Tube Active DIP, 0.3" (7.62mm) Row Spacing 4 (2 x 2) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame Wire Wrap 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
    124-91-304-41-002000

    124-91-304-41-002000

    CONN IC SKT DBL

    Mill-Max Manufacturing Corp.

    4,945
    RFQ
    124-91-304-41-002000

    Datasheet

    124-91-304-41-002000 124 Tube Active DIP, 0.3" (7.62mm) Row Spacing 4 (2 x 2) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame Wire Wrap 0.100" (2.54mm) Tin-Lead 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
    11-71000-10

    11-71000-10

    CONN SOCKET SIP 11POS TIN

    Aries Electronics

    2,888
    RFQ
    11-71000-10

    Datasheet

    11-71000-10 700 Elevator Strip-Line™ Bulk Active SIP 11 (1 x 11) 0.100" (2.54mm) Tin 200.0µin (5.08µm) Phosphor Bronze Through Hole Elevated Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Phosphor Bronze Polyamide (PA46), Nylon 4/6, Glass Filled -55°C ~ 105°C
    11-7400-10

    11-7400-10

    CONN SOCKET SIP 11POS TIN

    Aries Electronics

    3,605
    RFQ
    11-7400-10

    Datasheet

    11-7400-10 700 Elevator Strip-Line™ Bulk Active SIP 11 (1 x 11) 0.100" (2.54mm) Tin 200.0µin (5.08µm) Phosphor Bronze Through Hole Elevated Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Phosphor Bronze Polyamide (PA46), Nylon 4/6, Glass Filled -55°C ~ 105°C
    11-7587-10

    11-7587-10

    CONN SOCKET SIP 11POS TIN

    Aries Electronics

    4,360
    RFQ
    11-7587-10

    Datasheet

    11-7587-10 700 Elevator Strip-Line™ Bulk Active SIP 11 (1 x 11) 0.100" (2.54mm) Tin 200.0µin (5.08µm) Phosphor Bronze Through Hole Elevated Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Phosphor Bronze Polyamide (PA46), Nylon 4/6, Glass Filled -55°C ~ 105°C
    08-6621-30

    08-6621-30

    CONN IC DIP SOCKET 8POS TIN

    Aries Electronics

    2,987
    RFQ
    08-6621-30

    Datasheet

    08-6621-30 6621 Bulk Active DIP, 0.6" (15.24mm) Row Spacing 8 (2 x 4) 0.100" (2.54mm) Tin 200.0µin (5.08µm) Phosphor Bronze Through Hole, Bottom Entry; Through Board Closed Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Phosphor Bronze Polyamide (PA46), Nylon 4/6, Glass Filled -55°C ~ 105°C
    09-0501-30

    09-0501-30

    CONN SOCKET SIP 9POS TIN

    Aries Electronics

    2,852
    RFQ
    09-0501-30

    Datasheet

    09-0501-30 501 Bulk Active SIP 9 (1 x 9) 0.100" (2.54mm) Tin 200.0µin (5.08µm) Phosphor Bronze Through Hole - Wire Wrap 0.100" (2.54mm) Tin 200.0µin (5.08µm) Phosphor Bronze Polyamide (PA46), Nylon 4/6, Glass Filled -55°C ~ 105°C
    ICO-320-CGG

    ICO-320-CGG

    .100" LOW PROFILE SCREW MACHINE

    Samtec Inc.

    3,302
    RFQ
    ICO-320-CGG

    Datasheet

    ICO-320-CGG ICO Tube Active DIP, 0.3" (7.62mm) Row Spacing 20 (2 x 10) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Gold 30.0µin (0.76µm) Brass Polyester, Glass Filled -55°C ~ 125°C
    546-87-085-11-002135

    546-87-085-11-002135

    CONN SOCKET PGA 85POS GOLD

    Preci-Dip

    2,951
    RFQ
    546-87-085-11-002135

    Datasheet

    546-87-085-11-002135 546 Bulk Active PGA 85 (11 x 11) 0.050" (1.27mm) Gold Flash Beryllium Copper Through Hole Open Frame Press-Fit 0.100" (2.54mm) Tin - Bronze Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
    30-9513-11

    30-9513-11

    CONN IC DIP SOCKET 30POS GOLD

    Aries Electronics

    2,851
    RFQ
    30-9513-11

    Datasheet

    30-9513-11 Lo-PRO®file, 513 Bulk Active DIP, 0.9" (22.86mm) Row Spacing 30 (2 x 15) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Closed Frame Solder 0.100" (2.54mm) Gold 10.0µin (0.25µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled -55°C ~ 105°C
    13-0508-21

    13-0508-21

    CONN SOCKET SIP 13POS GOLD

    Aries Electronics

    3,402
    RFQ
    13-0508-21

    Datasheet

    13-0508-21 508 Bulk Active SIP 13 (1 x 13) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole - Wire Wrap - Gold 10.0µin (0.25µm) Brass Polyamide (PA46), Nylon 4/6 -55°C ~ 125°C
    13-0508-31

    13-0508-31

    CONN SOCKET SIP 13POS GOLD

    Aries Electronics

    3,458
    RFQ
    13-0508-31

    Datasheet

    13-0508-31 508 Bulk Active SIP 13 (1 x 13) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole - Wire Wrap - Gold 10.0µin (0.25µm) Brass Polyamide (PA46), Nylon 4/6 -55°C ~ 125°C
    18-3508-301

    18-3508-301

    CONN IC DIP SOCKET 18POS GOLD

    Aries Electronics

    2,085
    RFQ
    18-3508-301

    Datasheet

    18-3508-301 508 Bulk Active DIP, 0.3" (7.62mm) Row Spacing 18 (2 x 9) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame Wire Wrap 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled -55°C ~ 105°C
    14-6823-90

    14-6823-90

    CONN IC DIP SOCKET 14POS GOLD

    Aries Electronics

    4,049
    RFQ
    14-6823-90

    Datasheet

    14-6823-90 Vertisockets™ 800 Bulk Active DIP, 0.6" (15.24mm) Row Spacing 14 (2 x 7) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Phosphor Bronze Through Hole, Right Angle, Horizontal Closed Frame Solder 0.100" (2.54mm) Gold 10.0µin (0.25µm) Phosphor Bronze Polyamide (PA46), Nylon 4/6 -
    550-80-069-11-001101

    550-80-069-11-001101

    PGA SOLDER TAIL

    Preci-Dip

    2,989
    RFQ
    550-80-069-11-001101

    Datasheet

    550-80-069-11-001101 550 Bulk Active PGA 69 (11 x 11) 0.100" (2.54mm) Tin - Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
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