Available 24/7 at SENICO ELECTRONICS INTL CO., LIMITED
    SENICO ELECTRONICS INTL CO., LIMITED

    IC Sockets

    Manufacturer Series Packaging Product Status Type Number of Positions or Pins (Grid) Pitch - Mating Contact Finish - Mating Contact Finish Thickness - Mating Contact Material - Mating Mounting Type Features Termination Pitch - Post Contact Finish - Post Contact Finish Thickness - Post Contact Material - Post Housing Material Operating Temperature















































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































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    Photo Mfr. Part # Availability Price Quantity Datasheet RoHs Series Packaging Product Status Type Number of Positions or Pins (Grid) Pitch - Mating Contact Finish - Mating Contact Finish Thickness - Mating Contact Material - Mating Mounting Type Features Termination Pitch - Post Contact Finish - Post Contact Finish Thickness - Post Contact Material - Post Housing Material Operating Temperature
    28-6518-10E

    28-6518-10E

    CONN IC DIP SOCKET 28POS GOLD

    Aries Electronics

    3,104
    RFQ
    28-6518-10E

    Datasheet

    28-6518-10E 518 Bulk Active DIP, 0.6" (15.24mm) Row Spacing 28 (2 x 14) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled -
    12-6503-21

    12-6503-21

    CONN IC DIP SOCKET 12POS GOLD

    Aries Electronics

    3,554
    RFQ
    12-6503-21

    Datasheet

    12-6503-21 503 Bulk Active DIP, 0.6" (15.24mm) Row Spacing 12 (2 x 6) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Closed Frame Wire Wrap 0.100" (2.54mm) Gold 10.0µin (0.25µm) Phosphor Bronze Polyamide (PA46), Nylon 4/6, Glass Filled -55°C ~ 125°C
    12-6503-31

    12-6503-31

    CONN IC DIP SOCKET 12POS GOLD

    Aries Electronics

    3,461
    RFQ
    12-6503-31

    Datasheet

    12-6503-31 503 Bulk Active DIP, 0.6" (15.24mm) Row Spacing 12 (2 x 6) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Closed Frame Wire Wrap 0.100" (2.54mm) Gold 10.0µin (0.25µm) Phosphor Bronze Polyamide (PA46), Nylon 4/6, Glass Filled -55°C ~ 125°C
    APA-632-T-N

    APA-632-T-N

    ADAPTER PLUG

    Samtec Inc.

    4,644
    RFQ
    APA-632-T-N

    Datasheet

    APA-632-T-N APA Tube Active - 32 (2 x 16) 0.100" (2.54mm) Tin - Phosphor Bronze Through Hole Open Frame Solder 0.100" (2.54mm) Tin - Phosphor Bronze Polybutylene Terephthalate (PBT), Glass Filled -
    299-83-628-10-002101

    299-83-628-10-002101

    CONN IC DIP SOCKET 28POS GOLD

    Preci-Dip

    4,835
    RFQ
    299-83-628-10-002101

    Datasheet

    299-83-628-10-002101 299 Bulk Active DIP, 0.6" (15.24mm) Row Spacing 28 (2 x 14) 0.100" (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole, Right Angle, Horizontal Closed Frame Solder 0.100" (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
    510-83-148-15-062101

    510-83-148-15-062101

    CONN SOCKET PGA 148POS GOLD

    Preci-Dip

    2,247
    RFQ
    510-83-148-15-062101

    Datasheet

    510-83-148-15-062101 510 Bulk Active PGA 148 (15 x 15) 0.100" (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
    APA-648-T-A1

    APA-648-T-A1

    ADAPTER PLUG

    Samtec Inc.

    3,725
    RFQ
    APA-648-T-A1

    Datasheet

    APA-648-T-A1 APA Bulk Active - 48 (2 x 24) 0.100" (2.54mm) Tin - Phosphor Bronze Through Hole Open Frame Solder 0.100" (2.54mm) Tin - Phosphor Bronze Polybutylene Terephthalate (PBT), Glass Filled -
    60-9513-10

    60-9513-10

    CONN IC DIP SOCKET 60POS GOLD

    Aries Electronics

    3,885
    RFQ
    60-9513-10

    Datasheet

    60-9513-10 Lo-PRO®file, 513 Bulk Active DIP, 0.9" (22.86mm) Row Spacing 60 (2 x 30) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Closed Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled -55°C ~ 105°C
    36-6513-11

    36-6513-11

    CONN IC DIP SOCKET 36POS GOLD

    Aries Electronics

    3,252
    RFQ
    36-6513-11

    Datasheet

    36-6513-11 Lo-PRO®file, 513 Bulk Active DIP, 0.6" (15.24mm) Row Spacing 36 (2 x 18) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Closed Frame Solder 0.100" (2.54mm) Gold 10.0µin (0.25µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled -55°C ~ 105°C
    ICA-316-WGG

    ICA-316-WGG

    .100" SCREW MACHINE DIP SOCKET

    Samtec Inc.

    2,606
    RFQ
    ICA-316-WGG

    Datasheet

    ICA-316-WGG ICA Tube Active DIP, 0.3" (7.62mm) Row Spacing 16 (2 x 8) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Gold 30.0µin (0.76µm) Brass Polyester, Glass Filled -55°C ~ 125°C
    4-1437538-8

    4-1437538-8

    CONN IC DIP SOCKET 64POS GOLD

    TE Connectivity AMP Connectors

    4,269
    RFQ
    4-1437538-8

    Datasheet

    4-1437538-8 800 Tube Obsolete DIP, 0.9" (22.86mm) Row Spacing 64 (2 x 32) 0.100" (2.54mm) Gold 25.0µin (0.63µm) Copper Alloy Through Hole Open Frame Solder 0.100" (2.54mm) - - - Polyester -55°C ~ 105°C
    4-1437531-9

    4-1437531-9

    CONN IC DIP SOCKET 16POS TIN

    TE Connectivity AMP Connectors

    2,533
    RFQ

    -

    4-1437531-9 500 Tube Obsolete DIP, 0.3" (7.62mm) Row Spacing 16 (2 x 8) 0.100" (2.54mm) Tin - Copper Alloy Through Hole Closed Frame Wire Wrap 0.100" (2.54mm) Tin - Copper Alloy - -55°C ~ 105°C
    ICO-632-ZLGT

    ICO-632-ZLGT

    .100" LOW PROFILE SCREW MACHINE

    Samtec Inc.

    3,852
    RFQ
    ICO-632-ZLGT

    Datasheet

    ICO-632-ZLGT ICO Tube Active DIP, 0.6" (15.24mm) Row Spacing 32 (2 x 16) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Tin 10.0µin (0.25µm) Brass Polyester, Glass Filled -55°C ~ 125°C
    APH-1910-T-H

    APH-1910-T-H

    APH-1910-T-H

    Samtec Inc.

    3,665
    RFQ

    -

    APH-1910-T-H * - Active - - - - - - - - - - - - - - -
    APH-1510-T-H

    APH-1510-T-H

    APH-1510-T-H

    Samtec Inc.

    4,770
    RFQ

    -

    APH-1510-T-H * - Active - - - - - - - - - - - - - - -
    APH-1810-T-H

    APH-1810-T-H

    APH-1810-T-H

    Samtec Inc.

    4,853
    RFQ

    -

    APH-1810-T-H * - Active - - - - - - - - - - - - - - -
    APH-0410-T-H

    APH-0410-T-H

    APH-0410-T-H

    Samtec Inc.

    4,957
    RFQ

    -

    APH-0410-T-H * - Active - - - - - - - - - - - - - - -
    APH-0810-T-H

    APH-0810-T-H

    APH-0810-T-H

    Samtec Inc.

    2,226
    RFQ

    -

    APH-0810-T-H * - Active - - - - - - - - - - - - - - -
    510-83-149-15-003101

    510-83-149-15-003101

    CONN SOCKET PGA 149POS GOLD

    Preci-Dip

    3,254
    RFQ
    510-83-149-15-003101

    Datasheet

    510-83-149-15-003101 510 Bulk Active PGA 149 (15 x 15) 0.100" (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
    510-83-149-15-061101

    510-83-149-15-061101

    CONN SOCKET PGA 149POS GOLD

    Preci-Dip

    4,596
    RFQ
    510-83-149-15-061101

    Datasheet

    510-83-149-15-061101 510 Bulk Active PGA 149 (15 x 15) 0.100" (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
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