Available 24/7 at SENICO ELECTRONICS INTL CO., LIMITED
    SENICO ELECTRONICS INTL CO., LIMITED

    IC Sockets

    Manufacturer Series Packaging Product Status Type Number of Positions or Pins (Grid) Pitch - Mating Contact Finish - Mating Contact Finish Thickness - Mating Contact Material - Mating Mounting Type Features Termination Pitch - Post Contact Finish - Post Contact Finish Thickness - Post Contact Material - Post Housing Material Operating Temperature















































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































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    Photo Mfr. Part # Availability Price Quantity Datasheet RoHs Series Packaging Product Status Type Number of Positions or Pins (Grid) Pitch - Mating Contact Finish - Mating Contact Finish Thickness - Mating Contact Material - Mating Mounting Type Features Termination Pitch - Post Contact Finish - Post Contact Finish Thickness - Post Contact Material - Post Housing Material Operating Temperature
    510-83-149-15-064101

    510-83-149-15-064101

    CONN SOCKET PGA 149POS GOLD

    Preci-Dip

    2,218
    RFQ
    510-83-149-15-064101

    Datasheet

    510-83-149-15-064101 510 Bulk Active PGA 149 (15 x 15) 0.100" (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
    15-0501-30

    15-0501-30

    CONN SOCKET SIP 15POS TIN

    Aries Electronics

    4,299
    RFQ
    15-0501-30

    Datasheet

    15-0501-30 501 Bulk Active SIP 15 (1 x 15) 0.100" (2.54mm) Tin 200.0µin (5.08µm) Phosphor Bronze Through Hole - Wire Wrap 0.100" (2.54mm) Tin 200.0µin (5.08µm) Phosphor Bronze Polyamide (PA46), Nylon 4/6, Glass Filled -55°C ~ 105°C
    22-6503-20

    22-6503-20

    CONN IC DIP SOCKET 22POS GOLD

    Aries Electronics

    3,843
    RFQ
    22-6503-20

    Datasheet

    22-6503-20 503 Bulk Active DIP, 0.6" (15.24mm) Row Spacing 22 (2 x 11) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Closed Frame Wire Wrap 0.100" (2.54mm) Tin 200.0µin (5.08µm) Phosphor Bronze Polyamide (PA46), Nylon 4/6, Glass Filled -55°C ~ 105°C
    22-6503-30

    22-6503-30

    CONN IC DIP SOCKET 22POS GOLD

    Aries Electronics

    4,320
    RFQ
    22-6503-30

    Datasheet

    22-6503-30 503 Bulk Active DIP, 0.6" (15.24mm) Row Spacing 22 (2 x 11) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Closed Frame Wire Wrap 0.100" (2.54mm) Tin 200.0µin (5.08µm) Phosphor Bronze Polyamide (PA46), Nylon 4/6, Glass Filled -55°C ~ 105°C
    32-C212-10H

    32-C212-10H

    CONN IC DIP SOCKET 32POS GOLD

    Aries Electronics

    2,070
    RFQ
    32-C212-10H

    Datasheet

    32-C212-10H EJECT-A-DIP™ Bulk Active DIP, 0.6" (15.24mm) Row Spacing 32 (2 x 16) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Closed Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled -55°C ~ 105°C
    116-83-652-41-001101

    116-83-652-41-001101

    CONN IC DIP SOCKET 52POS GOLD

    Preci-Dip

    4,388
    RFQ
    116-83-652-41-001101

    Datasheet

    116-83-652-41-001101 116 Bulk Active DIP, 0.6" (15.24mm) Row Spacing 52 (2 x 26) 0.100" (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Elevated, Open Frame Solder 0.100" (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
    APA-316-T -N

    APA-316-T -N

    .100" SCREW MACHINE DIP ADAPTOR

    Samtec Inc.

    4,733
    RFQ

    -

    APA-316-T -N * - Active - - - - - - - - - - - - - - -
    510-83-145-17-001101

    510-83-145-17-001101

    CONN SOCKET PGA 145POS GOLD

    Preci-Dip

    2,502
    RFQ
    510-83-145-17-001101

    Datasheet

    510-83-145-17-001101 510 Bulk Active PGA 145 (17 x 17) 0.100" (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
    30-6513-11H

    30-6513-11H

    CONN IC DIP SOCKET 30POS GOLD

    Aries Electronics

    2,309
    RFQ
    30-6513-11H

    Datasheet

    30-6513-11H Lo-PRO®file, 513 Bulk Active DIP, 0.6" (15.24mm) Row Spacing 30 (2 x 15) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Closed Frame Solder 0.100" (2.54mm) Gold 10.0µin (0.25µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled -55°C ~ 105°C
    APO-628-G-J

    APO-628-G-J

    .100" LOW PROFILE SCREW MACHINE

    Samtec Inc.

    2,037
    RFQ
    APO-628-G-J

    Datasheet

    APO-628-G-J APO Tube Active DIP, 0.6" (15.24mm) Row Spacing 28 (2 x 14) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Phosphor Bronze Through Hole Open Frame Solder 0.100" (2.54mm) Gold 10.0µin (0.25µm) Phosphor Bronze Polybutylene Terephthalate (PBT), Glass Filled -
    20-6511-11

    20-6511-11

    CONN IC DIP SOCKET 20POS GOLD

    Aries Electronics

    4,257
    RFQ
    20-6511-11

    Datasheet

    20-6511-11 511 Bulk Active DIP, 0.6" (15.24mm) Row Spacing 20 (2 x 10) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Phosphor Bronze Through Hole Closed Frame Solder 0.100" (2.54mm) Gold 10.0µin (0.25µm) Phosphor Bronze Polyamide (PA46), Nylon 4/6, Glass Filled -55°C ~ 125°C
    APO-316-G-A1

    APO-316-G-A1

    .100" LOW PROFILE SCREW MACHINE

    Samtec Inc.

    4,179
    RFQ
    APO-316-G-A1

    Datasheet

    APO-316-G-A1 APO Bulk Active DIP, 0.3" (7.62mm) Row Spacing 16 (2 x 8) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Phosphor Bronze Through Hole Open Frame Solder 0.100" (2.54mm) Gold 10.0µin (0.25µm) Phosphor Bronze Polybutylene Terephthalate (PBT), Glass Filled -
    ICF-648-TL-I

    ICF-648-TL-I

    .100" SURFACE MOUNT SCREW MACHIN

    Samtec Inc.

    3,121
    RFQ
    ICF-648-TL-I

    Datasheet

    ICF-648-TL-I ICF Bulk Active DIP, 0.6" (15.24mm) Row Spacing 48 (2 x 24) 0.100" (2.54mm) Tin - Beryllium Copper Surface Mount Open Frame Solder 0.100" (2.54mm) Tin - Beryllium Copper Liquid Crystal Polymer (LCP) -55°C ~ 125°C
    HLS-0708-TT-2

    HLS-0708-TT-2

    .100" SCREW MACHINE SOCKET ARRAY

    Samtec Inc.

    4,067
    RFQ
    HLS-0708-TT-2

    Datasheet

    HLS-0708-TT-2 HLS Bulk Active SIP 56 (7 x 8) 0.100" (2.54mm) Tin - - Through Hole Closed Frame Solder 0.100" (2.54mm) Tin - - Thermoplastic -55°C ~ 140°C
    ICA-628-ZWGT-3

    ICA-628-ZWGT-3

    .100" SCREW MACHINE DIP SOCKET

    Samtec Inc.

    2,975
    RFQ
    ICA-628-ZWGT-3

    Datasheet

    ICA-628-ZWGT-3 ICA Tube Active DIP, 0.6" (15.24mm) Row Spacing 28 (2 x 14) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Tin 10.0µin (0.25µm) Brass Polyester, Glass Filled -55°C ~ 125°C
    HLS-0114-G-12

    HLS-0114-G-12

    .100" SCREW MACHINE SOCKET ARRAY

    Samtec Inc.

    3,673
    RFQ
    HLS-0114-G-12

    Datasheet

    HLS-0114-G-12 HLS Tube Active SIP 14 (1 x 14) 0.100" (2.54mm) Gold 30.0µin (0.76µm) - Through Hole Closed Frame Solder 0.100" (2.54mm) Gold 10.0µin (0.25µm) - Thermoplastic -55°C ~ 140°C
    ICA-318-ZWGG

    ICA-318-ZWGG

    .100" SCREW MACHINE DIP SOCKET

    Samtec Inc.

    4,440
    RFQ
    ICA-318-ZWGG

    Datasheet

    ICA-318-ZWGG ICA Tube Active DIP, 0.3" (7.62mm) Row Spacing 18 (2 x 9) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Gold 30.0µin (0.76µm) Brass Polyester, Glass Filled -55°C ~ 125°C
    10-9503-21

    10-9503-21

    CONN IC DIP SOCKET 10POS GOLD

    Aries Electronics

    3,183
    RFQ
    10-9503-21

    Datasheet

    10-9503-21 503 Bulk Active DIP, 0.9" (22.86mm) Row Spacing 10 (2 x 5) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Closed Frame Wire Wrap 0.100" (2.54mm) Gold 10.0µin (0.25µm) Phosphor Bronze Polyamide (PA46), Nylon 4/6, Glass Filled -55°C ~ 125°C
    10-9503-31

    10-9503-31

    CONN IC DIP SOCKET 10POS GOLD

    Aries Electronics

    3,593
    RFQ
    10-9503-31

    Datasheet

    10-9503-31 503 Bulk Active DIP, 0.9" (22.86mm) Row Spacing 10 (2 x 5) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Closed Frame Wire Wrap 0.100" (2.54mm) Gold 10.0µin (0.25µm) Phosphor Bronze Polyamide (PA46), Nylon 4/6, Glass Filled -55°C ~ 125°C
    26-1508-20

    26-1508-20

    CONN IC DIP SOCKET 26POS GOLD

    Aries Electronics

    3,416
    RFQ
    26-1508-20

    Datasheet

    26-1508-20 508 Bulk Active DIP, 0.2" (5.08mm) Row Spacing 26 (2 x 13) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Closed Frame Wire Wrap 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Polyamide (PA46), Nylon 4/6 -55°C ~ 105°C
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