Available 24/7 at SENICO ELECTRONICS INTL CO., LIMITED
    SENICO ELECTRONICS INTL CO., LIMITED

    IC Sockets

    Manufacturer Series Packaging Product Status Type Number of Positions or Pins (Grid) Pitch - Mating Contact Finish - Mating Contact Finish Thickness - Mating Contact Material - Mating Mounting Type Features Termination Pitch - Post Contact Finish - Post Contact Finish Thickness - Post Contact Material - Post Housing Material Operating Temperature















































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































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    Photo Mfr. Part # Availability Price Quantity Datasheet RoHs Series Packaging Product Status Type Number of Positions or Pins (Grid) Pitch - Mating Contact Finish - Mating Contact Finish Thickness - Mating Contact Material - Mating Mounting Type Features Termination Pitch - Post Contact Finish - Post Contact Finish Thickness - Post Contact Material - Post Housing Material Operating Temperature
    APH-1618-T-H

    APH-1618-T-H

    APH-1618-T-H

    Samtec Inc.

    4,307
    RFQ

    -

    APH-1618-T-H * - Active - - - - - - - - - - - - - - -
    ICO-628-ZNGT

    ICO-628-ZNGT

    .100" LOW PROFILE SCREW MACHINE

    Samtec Inc.

    3,033
    RFQ
    ICO-628-ZNGT

    Datasheet

    ICO-628-ZNGT ICO Tube Active DIP, 0.6" (15.24mm) Row Spacing 28 (2 x 14) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Tin 10.0µin (0.25µm) Brass Polyester, Glass Filled -55°C ~ 125°C
    32-6513-11H

    32-6513-11H

    CONN IC DIP SOCKET 32POS GOLD

    Aries Electronics

    3,243
    RFQ
    32-6513-11H

    Datasheet

    32-6513-11H Lo-PRO®file, 513 Bulk Active DIP, 0.6" (15.24mm) Row Spacing 32 (2 x 16) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Closed Frame Solder 0.100" (2.54mm) Gold 10.0µin (0.25µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled -55°C ~ 105°C
    12-6810-90TWR

    12-6810-90TWR

    CONN IC DIP SOCKET 12POS TIN

    Aries Electronics

    2,115
    RFQ
    12-6810-90TWR

    Datasheet

    12-6810-90TWR Vertisockets™ 800 Bulk Active DIP, 0.6" (15.24mm) Row Spacing 12 (2 x 6) 0.100" (2.54mm) Tin 200.0µin (5.08µm) Phosphor Bronze Through Hole, Right Angle, Vertical Closed Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Phosphor Bronze Polyamide (PA46), Nylon 4/6 -
    346-93-136-41-013000

    346-93-136-41-013000

    CONN SOCKET SIP 36POS GOLD

    Mill-Max Manufacturing Corp.

    4,846
    RFQ
    346-93-136-41-013000

    Datasheet

    346-93-136-41-013000 346 Bulk Active SIP 36 (1 x 36) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole - Press-Fit 0.100" (2.54mm) Tin-Lead 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
    346-43-136-41-013000

    346-43-136-41-013000

    CONN SOCKET SIP 36POS GOLD

    Mill-Max Manufacturing Corp.

    3,885
    RFQ
    346-43-136-41-013000

    Datasheet

    346-43-136-41-013000 346 Bulk Active SIP 36 (1 x 36) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole - Press-Fit 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
    510-83-180-18-111101

    510-83-180-18-111101

    CONN SOCKET PGA 180POS GOLD

    Preci-Dip

    2,889
    RFQ
    510-83-180-18-111101

    Datasheet

    510-83-180-18-111101 510 Bulk Active PGA 180 (18 x 18) 0.100" (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
    20-3508-20

    20-3508-20

    CONN IC DIP SOCKET 20POS GOLD

    Aries Electronics

    3,787
    RFQ
    20-3508-20

    Datasheet

    20-3508-20 508 Bulk Active DIP, 0.3" (7.62mm) Row Spacing 20 (2 x 10) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame Wire Wrap 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled -55°C ~ 105°C
    24-6518-01

    24-6518-01

    CONN IC DIP SOCKET 24POS GOLD

    Aries Electronics

    2,269
    RFQ
    24-6518-01

    Datasheet

    24-6518-01 518 Bulk Active DIP, 0.6" (15.24mm) Row Spacing 24 (2 x 12) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Gold 10.0µin (0.25µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled -
    16-81250-610C

    16-81250-610C

    CONN IC DIP SOCKET 16POS GOLD

    Aries Electronics

    3,982
    RFQ
    16-81250-610C

    Datasheet

    16-81250-610C 8 Bulk Active DIP, 0.6" (15.24mm) Row Spacing 16 (2 x 8) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Closed Frame, Elevated Solder 0.100" (2.54mm) Gold 10.0µin (0.25µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled -55°C ~ 105°C
    16-8300-610C

    16-8300-610C

    CONN IC DIP SOCKET 16POS GOLD

    Aries Electronics

    2,107
    RFQ
    16-8300-610C

    Datasheet

    16-8300-610C 8 Bulk Active DIP, 0.6" (15.24mm) Row Spacing 16 (2 x 8) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Closed Frame, Elevated Solder 0.100" (2.54mm) Gold 10.0µin (0.25µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled -55°C ~ 105°C
    16-8350-610C

    16-8350-610C

    CONN IC DIP SOCKET 16POS GOLD

    Aries Electronics

    2,587
    RFQ
    16-8350-610C

    Datasheet

    16-8350-610C 8 Bulk Active DIP, 0.6" (15.24mm) Row Spacing 16 (2 x 8) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Closed Frame, Elevated Solder 0.100" (2.54mm) Gold 10.0µin (0.25µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled -55°C ~ 105°C
    16-8400-610C

    16-8400-610C

    CONN IC DIP SOCKET 16POS GOLD

    Aries Electronics

    4,614
    RFQ
    16-8400-610C

    Datasheet

    16-8400-610C 8 Bulk Active DIP, 0.6" (15.24mm) Row Spacing 16 (2 x 8) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Closed Frame, Elevated Solder 0.100" (2.54mm) Gold 10.0µin (0.25µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled -55°C ~ 105°C
    16-8540-610C

    16-8540-610C

    CONN IC DIP SOCKET 16POS GOLD

    Aries Electronics

    4,312
    RFQ
    16-8540-610C

    Datasheet

    16-8540-610C 8 Bulk Active DIP, 0.6" (15.24mm) Row Spacing 16 (2 x 8) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Closed Frame, Elevated Solder 0.100" (2.54mm) Gold 10.0µin (0.25µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled -55°C ~ 105°C
    16-8625-610C

    16-8625-610C

    CONN IC DIP SOCKET 16POS GOLD

    Aries Electronics

    2,719
    RFQ
    16-8625-610C

    Datasheet

    16-8625-610C 8 Bulk Active DIP, 0.6" (15.24mm) Row Spacing 16 (2 x 8) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Closed Frame, Elevated Solder 0.100" (2.54mm) Gold 10.0µin (0.25µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled -55°C ~ 105°C
    16-8700-610C

    16-8700-610C

    CONN IC DIP SOCKET 16POS GOLD

    Aries Electronics

    4,656
    RFQ
    16-8700-610C

    Datasheet

    16-8700-610C 8 Bulk Active DIP, 0.6" (15.24mm) Row Spacing 16 (2 x 8) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Closed Frame, Elevated Solder 0.100" (2.54mm) Gold 10.0µin (0.25µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled -55°C ~ 105°C
    510-83-175-15-061101

    510-83-175-15-061101

    CONN SOCKET PGA 175POS GOLD

    Preci-Dip

    4,124
    RFQ
    510-83-175-15-061101

    Datasheet

    510-83-175-15-061101 510 Bulk Active PGA 175 (15 x 15) 0.100" (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
    510-83-175-16-001101

    510-83-175-16-001101

    CONN SOCKET PGA 175POS GOLD

    Preci-Dip

    4,651
    RFQ
    510-83-175-16-001101

    Datasheet

    510-83-175-16-001101 510 Bulk Active PGA 175 (16 x 16) 0.100" (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
    510-83-175-16-071101

    510-83-175-16-071101

    CONN SOCKET PGA 175POS GOLD

    Preci-Dip

    2,886
    RFQ
    510-83-175-16-071101

    Datasheet

    510-83-175-16-071101 510 Bulk Active PGA 175 (16 x 16) 0.100" (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
    510-83-175-16-072101

    510-83-175-16-072101

    CONN SOCKET PGA 175POS GOLD

    Preci-Dip

    4,476
    RFQ
    510-83-175-16-072101

    Datasheet

    510-83-175-16-072101 510 Bulk Active PGA 175 (16 x 16) 0.100" (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
    Total 19086 Record«Prev1... 415416417418419420421422...955Next»
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