Available 24/7 at SENICO ELECTRONICS INTL CO., LIMITED
    SENICO ELECTRONICS INTL CO., LIMITED

    IC Sockets

    Manufacturer Series Packaging Product Status Type Number of Positions or Pins (Grid) Pitch - Mating Contact Finish - Mating Contact Finish Thickness - Mating Contact Material - Mating Mounting Type Features Termination Pitch - Post Contact Finish - Post Contact Finish Thickness - Post Contact Material - Post Housing Material Operating Temperature















































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































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    Photo Mfr. Part # Availability Price Quantity Datasheet RoHs Series Packaging Product Status Type Number of Positions or Pins (Grid) Pitch - Mating Contact Finish - Mating Contact Finish Thickness - Mating Contact Material - Mating Mounting Type Features Termination Pitch - Post Contact Finish - Post Contact Finish Thickness - Post Contact Material - Post Housing Material Operating Temperature
    510-83-225-15-000101

    510-83-225-15-000101

    CONN SOCKET PGA 225POS GOLD

    Preci-Dip

    4,616
    RFQ
    510-83-225-15-000101

    Datasheet

    510-83-225-15-000101 510 Bulk Active PGA 225 (15 x 15) 0.100" (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Closed Frame Solder 0.100" (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
    8060-1G5

    8060-1G5

    CONN TRANSIST TO-5 3POS GOLD

    TE Connectivity AMP Connectors

    2,851
    RFQ
    8060-1G5

    Datasheet

    8060-1G5 8060 Bulk Obsolete Transistor, TO-5 3 (Round) - Gold - Beryllium Copper Through Hole Closed Frame Solder - Gold - Beryllium Copper Polytetrafluoroethylene (PTFE) -55°C ~ 125°C
    26-3503-20

    26-3503-20

    CONN IC DIP SOCKET 26POS GOLD

    Aries Electronics

    4,406
    RFQ
    26-3503-20

    Datasheet

    26-3503-20 503 Bulk Active DIP, 0.3" (7.62mm) Row Spacing 26 (2 x 13) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Closed Frame Wire Wrap 0.100" (2.54mm) Tin 200.0µin (5.08µm) Phosphor Bronze Polyamide (PA46), Nylon 4/6, Glass Filled -55°C ~ 105°C
    26-3503-30

    26-3503-30

    CONN IC DIP SOCKET 26POS GOLD

    Aries Electronics

    2,479
    RFQ
    26-3503-30

    Datasheet

    26-3503-30 503 Bulk Active DIP, 0.3" (7.62mm) Row Spacing 26 (2 x 13) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Closed Frame Wire Wrap 0.100" (2.54mm) Tin 200.0µin (5.08µm) Phosphor Bronze Polyamide (PA46), Nylon 4/6, Glass Filled -55°C ~ 105°C
    APO-422-T-T

    APO-422-T-T

    .100" LOW PROFILE SCREW MACHINE

    Samtec Inc.

    3,175
    RFQ

    -

    APO-422-T-T * - Active - - - - - - - - - - - - - - -
    210-99-632-41-001000

    210-99-632-41-001000

    CONN IC DIP SOCKET 32POS TINLEAD

    Mill-Max Manufacturing Corp.

    3,438
    RFQ
    210-99-632-41-001000

    Datasheet

    210-99-632-41-001000 210 Tube Active DIP, 0.6" (15.24mm) Row Spacing 32 (2 x 16) 0.100" (2.54mm) Tin-Lead 100.0µin (2.54µm) Beryllium Copper Through Hole Closed Frame Solder 0.100" (2.54mm) Tin-Lead 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
    210-44-632-41-001000

    210-44-632-41-001000

    STANDRD SOLDRTL DBL SKT

    Mill-Max Manufacturing Corp.

    2,665
    RFQ
    210-44-632-41-001000

    Datasheet

    210-44-632-41-001000 210 Tube Active DIP, 0.6" (15.24mm) Row Spacing 32 (2 x 16) 0.100" (2.54mm) Tin 100.0µin (2.54µm) Beryllium Copper Through Hole Closed Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
    317-47-113-41-005000

    317-47-113-41-005000

    STANDRD SOLDRTL SNG SKT

    Mill-Max Manufacturing Corp.

    4,012
    RFQ
    317-47-113-41-005000

    Datasheet

    317-47-113-41-005000 317 Bulk Active SIP 13 (1 x 13) 0.070" (1.78mm) Gold Flash Beryllium Copper Through Hole - Solder 0.070" (1.78mm) Tin 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
    104-11-308-41-780000

    104-11-308-41-780000

    CONN IC SKT DBL

    Mill-Max Manufacturing Corp.

    4,063
    RFQ
    104-11-308-41-780000

    Datasheet

    104-11-308-41-780000 104 Tube Active DIP, 0.3" (7.62mm) Row Spacing 8 (2 x 4) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame Press-Fit 0.100" (2.54mm) Gold 10.0µin (0.25µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
    110-41-318-41-105000

    110-41-318-41-105000

    CONN IC SKT DBL

    Mill-Max Manufacturing Corp.

    3,282
    RFQ
    110-41-318-41-105000

    Datasheet

    110-41-318-41-105000 110 Tube Active DIP, 0.3" (7.62mm) Row Spacing 18 (2 x 9) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Surface Mount Open Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
    110-91-318-41-105000

    110-91-318-41-105000

    CONN IC SKT DBL

    Mill-Max Manufacturing Corp.

    2,220
    RFQ
    110-91-318-41-105000

    Datasheet

    110-91-318-41-105000 110 Tube Active DIP, 0.3" (7.62mm) Row Spacing 18 (2 x 9) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Surface Mount Open Frame Solder 0.100" (2.54mm) Tin-Lead 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
    110-41-320-41-105000

    110-41-320-41-105000

    CONN IC SKT DBL

    Mill-Max Manufacturing Corp.

    2,252
    RFQ
    110-41-320-41-105000

    Datasheet

    110-41-320-41-105000 110 Tube Active DIP, 0.3" (7.62mm) Row Spacing 20 (2 x 10) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Surface Mount Open Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
    110-41-420-41-105000

    110-41-420-41-105000

    CONN IC SKT DBL

    Mill-Max Manufacturing Corp.

    2,600
    RFQ
    110-41-420-41-105000

    Datasheet

    110-41-420-41-105000 110 Tube Active DIP, 0.4" (10.16mm) Row Spacing 20 (2 x 10) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Surface Mount Open Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
    110-91-320-41-105000

    110-91-320-41-105000

    CONN IC SKT DBL

    Mill-Max Manufacturing Corp.

    4,244
    RFQ
    110-91-320-41-105000

    Datasheet

    110-91-320-41-105000 110 Tube Active DIP, 0.3" (7.62mm) Row Spacing 20 (2 x 10) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Surface Mount Open Frame Solder 0.100" (2.54mm) Tin-Lead 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
    110-91-420-41-105000

    110-91-420-41-105000

    CONN IC SKT DBL

    Mill-Max Manufacturing Corp.

    2,423
    RFQ
    110-91-420-41-105000

    Datasheet

    110-91-420-41-105000 110 Tube Active DIP, 0.4" (10.16mm) Row Spacing 20 (2 x 10) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Surface Mount Open Frame Solder 0.100" (2.54mm) Tin-Lead 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
    24-3552-10

    24-3552-10

    CONN IC DIP SOCKET ZIF 24POS TIN

    Aries Electronics

    3,379
    RFQ
    24-3552-10

    Datasheet

    24-3552-10 55 Bulk Active DIP, ZIF (ZIP), 0.3" (7.62mm) Row Spacing 24 (2 x 12) 0.100" (2.54mm) Tin 200.0µin (5.08µm) Beryllium Copper Through Hole Closed Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Beryllium Copper Polyphenylene Sulfide (PPS), Glass Filled -
    24-3553-10

    24-3553-10

    CONN IC DIP SOCKET ZIF 24POS TIN

    Aries Electronics

    4,628
    RFQ
    24-3553-10

    Datasheet

    24-3553-10 55 Bulk Active DIP, ZIF (ZIP), 0.3" (7.62mm) Row Spacing 24 (2 x 12) 0.100" (2.54mm) Tin 200.0µin (5.08µm) Beryllium Copper Through Hole Closed Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Beryllium Copper Polyphenylene Sulfide (PPS), Glass Filled -
    24-6551-10

    24-6551-10

    CONN IC DIP SOCKET ZIF 24POS TIN

    Aries Electronics

    2,004
    RFQ
    24-6551-10

    Datasheet

    24-6551-10 55 Bulk Active DIP, ZIF (ZIP), 0.6" (15.24mm) Row Spacing 24 (2 x 12) 0.100" (2.54mm) Tin 200.0µin (5.08µm) Beryllium Copper Through Hole Closed Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Beryllium Copper Polyphenylene Sulfide (PPS), Glass Filled -
    24-6552-10

    24-6552-10

    CONN IC DIP SOCKET ZIF 24POS TIN

    Aries Electronics

    3,133
    RFQ
    24-6552-10

    Datasheet

    24-6552-10 55 Bulk Active DIP, ZIF (ZIP), 0.6" (15.24mm) Row Spacing 24 (2 x 12) 0.100" (2.54mm) Tin 200.0µin (5.08µm) Beryllium Copper Through Hole Closed Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Beryllium Copper Polyphenylene Sulfide (PPS), Glass Filled -
    24-6553-10

    24-6553-10

    CONN IC DIP SOCKET ZIF 24POS TIN

    Aries Electronics

    4,652
    RFQ
    24-6553-10

    Datasheet

    24-6553-10 55 Bulk Active DIP, ZIF (ZIP), 0.6" (15.24mm) Row Spacing 24 (2 x 12) 0.100" (2.54mm) Tin 200.0µin (5.08µm) Beryllium Copper Through Hole Closed Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Beryllium Copper Polyphenylene Sulfide (PPS), Glass Filled -
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