Available 24/7 at SENICO ELECTRONICS INTL CO., LIMITED
    SENICO ELECTRONICS INTL CO., LIMITED

    IC Sockets

    Manufacturer Series Packaging Product Status Type Number of Positions or Pins (Grid) Pitch - Mating Contact Finish - Mating Contact Finish Thickness - Mating Contact Material - Mating Mounting Type Features Termination Pitch - Post Contact Finish - Post Contact Finish Thickness - Post Contact Material - Post Housing Material Operating Temperature















































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































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    Photo Mfr. Part # Availability Price Quantity Datasheet RoHs Series Packaging Product Status Type Number of Positions or Pins (Grid) Pitch - Mating Contact Finish - Mating Contact Finish Thickness - Mating Contact Material - Mating Mounting Type Features Termination Pitch - Post Contact Finish - Post Contact Finish Thickness - Post Contact Material - Post Housing Material Operating Temperature
    24-3554-10

    24-3554-10

    CONN IC DIP SOCKET ZIF 24POS TIN

    Aries Electronics

    2,864
    RFQ
    24-3554-10

    Datasheet

    24-3554-10 55 Bulk Active DIP, ZIF (ZIP), 0.3" (7.62mm) Row Spacing 24 (2 x 12) 0.100" (2.54mm) Tin 200.0µin (5.08µm) Beryllium Copper Through Hole Closed Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Beryllium Copper Polyphenylene Sulfide (PPS), Glass Filled -
    116-93-210-41-003000

    116-93-210-41-003000

    CONN IC DIP SOCKET 10POS GOLD

    Mill-Max Manufacturing Corp.

    4,362
    RFQ
    116-93-210-41-003000

    Datasheet

    116-93-210-41-003000 116 Tube Active DIP, 0.2" (5.08mm) Row Spacing 10 (2 x 5) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Elevated, Open Frame Solder 0.100" (2.54mm) Tin-Lead 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
    116-43-210-41-003000

    116-43-210-41-003000

    CONN IC SKT DBL

    Mill-Max Manufacturing Corp.

    2,222
    RFQ
    116-43-210-41-003000

    Datasheet

    116-43-210-41-003000 116 Tube Active DIP, 0.2" (5.08mm) Row Spacing 10 (2 x 5) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Elevated, Open Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
    111-47-322-41-001000

    111-47-322-41-001000

    STANDRD SOLDRTL DBL SKT

    Mill-Max Manufacturing Corp.

    2,020
    RFQ
    111-47-322-41-001000

    Datasheet

    111-47-322-41-001000 111 Tube Active DIP, 0.3" (7.62mm) Row Spacing 22 (2 x 11) 0.100" (2.54mm) Gold Flash Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
    111-47-422-41-001000

    111-47-422-41-001000

    STANDRD SOLDRTL DBL SKT

    Mill-Max Manufacturing Corp.

    4,433
    RFQ
    111-47-422-41-001000

    Datasheet

    111-47-422-41-001000 111 Tube Active DIP, 0.4" (10.16mm) Row Spacing 22 (2 x 11) 0.100" (2.54mm) Gold Flash Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
    32-3503-20

    32-3503-20

    CONN IC DIP SOCKET 32POS GOLD

    Aries Electronics

    2,108
    RFQ
    32-3503-20

    Datasheet

    32-3503-20 503 Bulk Active DIP, 0.3" (7.62mm) Row Spacing 32 (2 x 16) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Closed Frame Wire Wrap 0.100" (2.54mm) Tin 200.0µin (5.08µm) Phosphor Bronze Polyamide (PA46), Nylon 4/6, Glass Filled -55°C ~ 105°C
    32-3503-30

    32-3503-30

    CONN IC DIP SOCKET 32POS GOLD

    Aries Electronics

    4,239
    RFQ
    32-3503-30

    Datasheet

    32-3503-30 503 Bulk Active DIP, 0.3" (7.62mm) Row Spacing 32 (2 x 16) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Closed Frame Wire Wrap 0.100" (2.54mm) Tin 200.0µin (5.08µm) Phosphor Bronze Polyamide (PA46), Nylon 4/6, Glass Filled -55°C ~ 105°C
    605-41-308-11-480000

    605-41-308-11-480000

    SKT CARRIER LOWPRO

    Mill-Max Manufacturing Corp.

    3,873
    RFQ
    605-41-308-11-480000

    Datasheet

    605-41-308-11-480000 605 Tube Active DIP, 0.3" (7.62mm) Row Spacing 8 (2 x 4) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Carrier, Open Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
    605-91-308-11-480000

    605-91-308-11-480000

    SKT CARRIER LOWPRO

    Mill-Max Manufacturing Corp.

    4,649
    RFQ
    605-91-308-11-480000

    Datasheet

    605-91-308-11-480000 605 Tube Active DIP, 0.3" (7.62mm) Row Spacing 8 (2 x 4) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Carrier, Open Frame Solder 0.100" (2.54mm) Tin-Lead 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
    ICA-422-AGG

    ICA-422-AGG

    .100" SCREW MACHINE DIP SOCKET

    Samtec Inc.

    3,626
    RFQ
    ICA-422-AGG

    Datasheet

    ICA-422-AGG ICA Tube Active DIP, 0.4" (10.16mm) Row Spacing 22 (2 x 11) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Gold 30.0µin (0.76µm) Brass Polyester, Glass Filled -55°C ~ 125°C
    HLS-0214-G-11

    HLS-0214-G-11

    .100" SCREW MACHINE SOCKET ARRAY

    Samtec Inc.

    2,181
    RFQ
    HLS-0214-G-11

    Datasheet

    HLS-0214-G-11 HLS Tube Active SIP 28 (2 x 14) 0.100" (2.54mm) Gold 30.0µin (0.76µm) - Through Hole Closed Frame Solder 0.100" (2.54mm) Gold 10.0µin (0.25µm) - Thermoplastic -55°C ~ 140°C
    110-47-322-41-105000

    110-47-322-41-105000

    STANDRD SOLDRTL

    Mill-Max Manufacturing Corp.

    4,025
    RFQ
    110-47-322-41-105000

    Datasheet

    110-47-322-41-105000 110 Tube Active DIP, 0.3" (7.62mm) Row Spacing 22 (2 x 11) 0.100" (2.54mm) Gold Flash Beryllium Copper Surface Mount Open Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
    110-47-422-41-105000

    110-47-422-41-105000

    STANDRD SOLDRTL

    Mill-Max Manufacturing Corp.

    2,584
    RFQ
    110-47-422-41-105000

    Datasheet

    110-47-422-41-105000 110 Tube Active DIP, 0.4" (10.16mm) Row Spacing 22 (2 x 11) 0.100" (2.54mm) Gold Flash Beryllium Copper Surface Mount Open Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
    HLS-0320-S-2

    HLS-0320-S-2

    .100" SCREW MACHINE SOCKET ARRAY

    Samtec Inc.

    4,843
    RFQ
    HLS-0320-S-2

    Datasheet

    HLS-0320-S-2 HLS Tube Active SIP 60 (3 x 20) 0.100" (2.54mm) Gold - - Through Hole Closed Frame Solder 0.100" (2.54mm) - - - Thermoplastic -55°C ~ 140°C
    126-93-306-41-002000

    126-93-306-41-002000

    CONN IC DIP SOCKET 6POS GOLD

    Mill-Max Manufacturing Corp.

    2,466
    RFQ
    126-93-306-41-002000

    Datasheet

    126-93-306-41-002000 126 Tube Active DIP, 0.3" (7.62mm) Row Spacing 6 (2 x 3) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame Wire Wrap 0.100" (2.54mm) Tin-Lead 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
    126-43-306-41-002000

    126-43-306-41-002000

    CONN IC SKT DBL

    Mill-Max Manufacturing Corp.

    4,799
    RFQ
    126-43-306-41-002000

    Datasheet

    126-43-306-41-002000 126 Tube Active DIP, 0.3" (7.62mm) Row Spacing 6 (2 x 3) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame Wire Wrap 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
    32-820-90C

    32-820-90C

    CONN IC DIP SOCKET 32POS GOLD

    Aries Electronics

    2,599
    RFQ
    32-820-90C

    Datasheet

    32-820-90C Vertisockets™ 800 Bulk Active DIP, 0.3" (7.62mm) Row Spacing 32 (2 x 16) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole, Right Angle, Horizontal Closed Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled -55°C ~ 105°C
    317-91-112-41-005000

    317-91-112-41-005000

    CONN SKT SNG

    Mill-Max Manufacturing Corp.

    2,596
    RFQ
    317-91-112-41-005000

    Datasheet

    317-91-112-41-005000 317 Bulk Active SIP 12 (1 x 12) 0.070" (1.78mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole - Solder 0.070" (1.78mm) Tin-Lead 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
    HLS-0120-G-18

    HLS-0120-G-18

    .100" SCREW MACHINE SOCKET ARRAY

    Samtec Inc.

    3,184
    RFQ
    HLS-0120-G-18

    Datasheet

    HLS-0120-G-18 HLS Tube Active SIP 20 (1 x 20) 0.100" (2.54mm) Gold 30.0µin (0.76µm) - Through Hole Closed Frame Solder 0.100" (2.54mm) Gold 10.0µin (0.25µm) - Thermoplastic -55°C ~ 140°C
    116-93-308-41-007000

    116-93-308-41-007000

    CONN IC DIP SOCKET 8POS GOLD

    Mill-Max Manufacturing Corp.

    3,130
    RFQ
    116-93-308-41-007000

    Datasheet

    116-93-308-41-007000 116 Tube Active DIP, 0.3" (7.62mm) Row Spacing 8 (2 x 4) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Elevated, Open Frame Solder 0.100" (2.54mm) Tin-Lead 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
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