Available 24/7 at SENICO ELECTRONICS INTL CO., LIMITED
    SENICO ELECTRONICS INTL CO., LIMITED

    IC Sockets

    Manufacturer Series Packaging Product Status Type Number of Positions or Pins (Grid) Pitch - Mating Contact Finish - Mating Contact Finish Thickness - Mating Contact Material - Mating Mounting Type Features Termination Pitch - Post Contact Finish - Post Contact Finish Thickness - Post Contact Material - Post Housing Material Operating Temperature















































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































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    Photo Mfr. Part # Availability Price Quantity Datasheet RoHs Series Packaging Product Status Type Number of Positions or Pins (Grid) Pitch - Mating Contact Finish - Mating Contact Finish Thickness - Mating Contact Material - Mating Mounting Type Features Termination Pitch - Post Contact Finish - Post Contact Finish Thickness - Post Contact Material - Post Housing Material Operating Temperature
    714-43-139-31-018000

    714-43-139-31-018000

    CONN SOCKET SIP 39POS GOLD

    Mill-Max Manufacturing Corp.

    4,433
    RFQ
    714-43-139-31-018000

    Datasheet

    714-43-139-31-018000 714 Bulk Active SIP 39 (1 x 39) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Carrier Solder 0.100" (2.54mm) Gold 30.0µin (0.76µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
    116-47-314-41-007000

    116-47-314-41-007000

    STANDRD SOLDRTL DBL SKT

    Mill-Max Manufacturing Corp.

    4,246
    RFQ
    116-47-314-41-007000

    Datasheet

    116-47-314-41-007000 116 Tube Active DIP, 0.3" (7.62mm) Row Spacing 14 (2 x 7) 0.100" (2.54mm) Gold Flash Beryllium Copper Through Hole Elevated, Open Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
    146-41-314-41-013000

    146-41-314-41-013000

    CONN SKT DBL

    Mill-Max Manufacturing Corp.

    2,935
    RFQ
    146-41-314-41-013000

    Datasheet

    146-41-314-41-013000 146 Tube Active DIP, 0.3" (7.62mm) Row Spacing 14 (2 x 7) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame Press-Fit 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
    146-91-314-41-013000

    146-91-314-41-013000

    CONN SKT DBL

    Mill-Max Manufacturing Corp.

    2,933
    RFQ
    146-91-314-41-013000

    Datasheet

    146-91-314-41-013000 146 Tube Active DIP, 0.3" (7.62mm) Row Spacing 14 (2 x 7) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame Press-Fit 0.100" (2.54mm) Tin-Lead 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
    115-91-420-41-003000

    115-91-420-41-003000

    SOCKET IC OPEN LOWPRO .400 20POS

    Mill-Max Manufacturing Corp.

    3,859
    RFQ

    -

    115-91-420-41-003000 115 Tube Active DIP, 0.3" (7.62mm) Row Spacing 20 (2 x 10) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Tin-Lead 200.0µin (5.08µm) Brass Alloy Thermoplastic -55°C ~ 125°C
    115-41-420-41-003000

    115-41-420-41-003000

    CONN IC SKT DBL

    Mill-Max Manufacturing Corp.

    2,497
    RFQ
    115-41-420-41-003000

    Datasheet

    115-41-420-41-003000 115 Tube Active DIP, 0.4" (10.16mm) Row Spacing 20 (2 x 10) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
    121-11-308-41-001000

    121-11-308-41-001000

    CONN IC SKT DBL

    Mill-Max Manufacturing Corp.

    4,905
    RFQ
    121-11-308-41-001000

    Datasheet

    121-11-308-41-001000 121 Tube Active DIP, 0.3" (7.62mm) Row Spacing 8 (2 x 4) 0.100" (2.54mm) - - Beryllium Copper Through Hole Open Frame Wire Wrap 0.100" (2.54mm) - - Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
    37-0508-20

    37-0508-20

    CONN SOCKET SIP 37POS GOLD

    Aries Electronics

    3,037
    RFQ
    37-0508-20

    Datasheet

    37-0508-20 508 Bulk Active SIP 37 (1 x 37) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole - Wire Wrap - Gold 10.0µin (0.25µm) Brass Polyamide (PA46), Nylon 4/6 -55°C ~ 105°C
    37-0508-30

    37-0508-30

    CONN SOCKET SIP 37POS GOLD

    Aries Electronics

    4,467
    RFQ
    37-0508-30

    Datasheet

    37-0508-30 508 Bulk Active SIP 37 (1 x 37) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole - Wire Wrap - Gold 10.0µin (0.25µm) Brass Polyamide (PA46), Nylon 4/6 -55°C ~ 105°C
    18-6621-30

    18-6621-30

    CONN IC DIP SOCKET 18POS TIN

    Aries Electronics

    2,229
    RFQ
    18-6621-30

    Datasheet

    18-6621-30 6621 Bulk Active DIP, 0.6" (15.24mm) Row Spacing 18 (2 x 9) 0.100" (2.54mm) Tin 200.0µin (5.08µm) Phosphor Bronze Through Hole, Bottom Entry; Through Board Closed Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Phosphor Bronze Polyamide (PA46), Nylon 4/6, Glass Filled -55°C ~ 105°C
    917-41-210-41-001000

    917-41-210-41-001000

    CONN SKT TRANSISTOR

    Mill-Max Manufacturing Corp.

    4,741
    RFQ
    917-41-210-41-001000

    Datasheet

    917-41-210-41-001000 917 Tube Active Transistor, TO-100 10 (Round) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Surface Mount Closed Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
    115-47-328-41-003000

    115-47-328-41-003000

    CONN IC DIP SOCKET 28POS GOLD

    Mill-Max Manufacturing Corp.

    3,021
    RFQ
    115-47-328-41-003000

    Datasheet

    115-47-328-41-003000 115 Tube Active DIP, 0.3" (7.62mm) Row Spacing 28 (2 x 14) 0.100" (2.54mm) Gold Flash Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
    110-99-642-41-001000

    110-99-642-41-001000

    CONN IC DIP SOCKET 42POS TINLEAD

    Mill-Max Manufacturing Corp.

    4,879
    RFQ
    110-99-642-41-001000

    Datasheet

    110-99-642-41-001000 110 Tube Active DIP, 0.6" (15.24mm) Row Spacing 42 (2 x 21) 0.100" (2.54mm) Tin-Lead 200.0µin (5.08µm) Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Tin-Lead 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
    110-93-316-10-003000

    110-93-316-10-003000

    CONN IC DIP SOCKET 16POS GOLD

    Mill-Max Manufacturing Corp.

    4,336
    RFQ
    110-93-316-10-003000

    Datasheet

    110-93-316-10-003000 110 Tube Active DIP, 0.3" (7.62mm) Row Spacing 16 (2 x 8), 8 Loaded 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Tin-Lead 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
    614-93-308-31-018000

    614-93-308-31-018000

    SOCKET CARRIER LOWPRO .300 8POS

    Mill-Max Manufacturing Corp.

    2,042
    RFQ
    614-93-308-31-018000

    Datasheet

    614-93-308-31-018000 614 Tube Active DIP, 0.3" (7.62mm) Row Spacing 8 (2 x 4) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Carrier, Open Frame Solder 0.100" (2.54mm) Tin-Lead 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
    614-43-308-31-018000

    614-43-308-31-018000

    SKT CARRIER PGA

    Mill-Max Manufacturing Corp.

    4,200
    RFQ
    614-43-308-31-018000

    Datasheet

    614-43-308-31-018000 614 Tube Active DIP, 0.3" (7.62mm) Row Spacing 8 (2 x 4) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Carrier, Open Frame Solder 0.100" (2.54mm) Tin 30.0µin (0.76µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
    ICF-324-STL-I

    ICF-324-STL-I

    .100" SURFACE MOUNT SCREW MACHIN

    Samtec Inc.

    3,876
    RFQ
    ICF-324-STL-I

    Datasheet

    ICF-324-STL-I ICF Bulk Active DIP, 0.3" (7.62mm) Row Spacing 24 (2 x 12) 0.100" (2.54mm) Tin - Beryllium Copper Surface Mount Open Frame Solder 0.100" (2.54mm) Tin - Beryllium Copper Liquid Crystal Polymer (LCP) -55°C ~ 125°C
    ICF-324-STL-O

    ICF-324-STL-O

    .100" SURFACE MOUNT SCREW MACHIN

    Samtec Inc.

    4,779
    RFQ
    ICF-324-STL-O

    Datasheet

    ICF-324-STL-O ICF Bulk Active DIP, 0.3" (7.62mm) Row Spacing 24 (2 x 12) 0.100" (2.54mm) Tin - Beryllium Copper Surface Mount Open Frame Solder 0.100" (2.54mm) Tin - Beryllium Copper Liquid Crystal Polymer (LCP) -55°C ~ 125°C
    26-0501-20

    26-0501-20

    CONN SOCKET SIP 26POS TIN

    Aries Electronics

    4,269
    RFQ
    26-0501-20

    Datasheet

    26-0501-20 501 Bulk Active SIP 26 (1 x 26) 0.100" (2.54mm) Tin 200.0µin (5.08µm) Phosphor Bronze Through Hole - Wire Wrap 0.100" (2.54mm) Tin 200.0µin (5.08µm) Phosphor Bronze Polyamide (PA46), Nylon 4/6, Glass Filled -55°C ~ 105°C
    114-41-322-41-117000

    114-41-322-41-117000

    CONN IC SKT DBL

    Mill-Max Manufacturing Corp.

    2,010
    RFQ
    114-41-322-41-117000

    Datasheet

    114-41-322-41-117000 114 Tube Active DIP, 0.3" (7.62mm) Row Spacing 22 (2 x 11) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Surface Mount Open Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
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