Available 24/7 at SENICO ELECTRONICS INTL CO., LIMITED
    SENICO ELECTRONICS INTL CO., LIMITED

    IC Sockets

    Manufacturer Series Packaging Product Status Type Number of Positions or Pins (Grid) Pitch - Mating Contact Finish - Mating Contact Finish Thickness - Mating Contact Material - Mating Mounting Type Features Termination Pitch - Post Contact Finish - Post Contact Finish Thickness - Post Contact Material - Post Housing Material Operating Temperature















































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































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    Photo Mfr. Part # Availability Price Quantity Datasheet RoHs Series Packaging Product Status Type Number of Positions or Pins (Grid) Pitch - Mating Contact Finish - Mating Contact Finish Thickness - Mating Contact Material - Mating Mounting Type Features Termination Pitch - Post Contact Finish - Post Contact Finish Thickness - Post Contact Material - Post Housing Material Operating Temperature
    ICA-632-ZAGG

    ICA-632-ZAGG

    .100" SCREW MACHINE DIP SOCKET

    Samtec Inc.

    4,982
    RFQ
    ICA-632-ZAGG

    Datasheet

    ICA-632-ZAGG ICA Tube Active DIP, 0.6" (15.24mm) Row Spacing 32 (2 x 16) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Gold 30.0µin (0.76µm) Brass Polyester, Glass Filled -55°C ~ 125°C
    116-47-318-41-006000

    116-47-318-41-006000

    STANDRD SOLDRTL DBL SKT

    Mill-Max Manufacturing Corp.

    4,851
    RFQ
    116-47-318-41-006000

    Datasheet

    116-47-318-41-006000 116 Tube Active DIP, 0.3" (7.62mm) Row Spacing 18 (2 x 9) 0.100" (2.54mm) Gold Flash Beryllium Copper Through Hole Elevated, Open Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
    612-11-306-41-001000

    612-11-306-41-001000

    SKT CARRIER SOLDRTL

    Mill-Max Manufacturing Corp.

    4,309
    RFQ
    612-11-306-41-001000

    Datasheet

    612-11-306-41-001000 612 Tube Active DIP, 0.3" (7.62mm) Row Spacing 6 (2 x 3) 0.100" (2.54mm) - - Beryllium Copper Through Hole Carrier, Open Frame Solder 0.100" (2.54mm) - - Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
    32-6511-11

    32-6511-11

    CONN IC DIP SOCKET 32POS GOLD

    Aries Electronics

    4,994
    RFQ
    32-6511-11

    Datasheet

    32-6511-11 511 Bulk Active DIP, 0.6" (15.24mm) Row Spacing 32 (2 x 16) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Phosphor Bronze Through Hole Closed Frame Solder 0.100" (2.54mm) Gold 10.0µin (0.25µm) Phosphor Bronze Polyamide (PA46), Nylon 4/6, Glass Filled -55°C ~ 125°C
    317-91-115-41-005000

    317-91-115-41-005000

    CONN SKT SNG

    Mill-Max Manufacturing Corp.

    4,043
    RFQ
    317-91-115-41-005000

    Datasheet

    317-91-115-41-005000 317 Bulk Active SIP 15 (1 x 15) 0.070" (1.78mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole - Solder 0.070" (1.78mm) Tin-Lead 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
    HLS-0310-G-11

    HLS-0310-G-11

    .100" SCREW MACHINE SOCKET ARRAY

    Samtec Inc.

    3,231
    RFQ
    HLS-0310-G-11

    Datasheet

    HLS-0310-G-11 HLS Tube Active SIP 27 (3 x 9) 0.100" (2.54mm) Gold 30.0µin (0.76µm) - Through Hole Closed Frame Solder 0.100" (2.54mm) Gold 10.0µin (0.25µm) - Thermoplastic -55°C ~ 140°C
    317-93-109-41-005000

    317-93-109-41-005000

    CONN SKT SNG

    Mill-Max Manufacturing Corp.

    2,027
    RFQ
    317-93-109-41-005000

    Datasheet

    317-93-109-41-005000 317 Tube Active SIP 9 (1 x 9) 0.070" (1.78mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole - Solder 0.070" (1.78mm) Tin-Lead 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
    APO-324-T-B

    APO-324-T-B

    .100" LOW PROFILE SCREW MACHINE

    Samtec Inc.

    4,440
    RFQ
    APO-324-T-B

    Datasheet

    APO-324-T-B APO Bulk Active DIP, 0.3" (7.62mm) Row Spacing 24 (2 x 12) 0.100" (2.54mm) Tin - Phosphor Bronze Through Hole Open Frame Solder 0.100" (2.54mm) Tin - Phosphor Bronze Polybutylene Terephthalate (PBT), Glass Filled -
    116-41-314-41-003000

    116-41-314-41-003000

    CONN IC SKT DBL

    Mill-Max Manufacturing Corp.

    2,123
    RFQ
    116-41-314-41-003000

    Datasheet

    116-41-314-41-003000 116 Tube Active DIP, 0.3" (7.62mm) Row Spacing 14 (2 x 7) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Elevated, Open Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
    116-91-314-41-003000

    116-91-314-41-003000

    CONN IC SKT DBL

    Mill-Max Manufacturing Corp.

    4,289
    RFQ
    116-91-314-41-003000

    Datasheet

    116-91-314-41-003000 116 Tube Active DIP, 0.3" (7.62mm) Row Spacing 14 (2 x 7) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Elevated, Open Frame Solder 0.100" (2.54mm) Tin-Lead 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
    116-47-320-41-006000

    116-47-320-41-006000

    STANDRD SOLDRTL DBL SKT

    Mill-Max Manufacturing Corp.

    4,080
    RFQ
    116-47-320-41-006000

    Datasheet

    116-47-320-41-006000 116 Tube Active DIP, 0.3" (7.62mm) Row Spacing 20 (2 x 10) 0.100" (2.54mm) Gold Flash Beryllium Copper Through Hole Elevated, Open Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
    116-47-420-41-006000

    116-47-420-41-006000

    STANDRD SOLDRTL

    Mill-Max Manufacturing Corp.

    2,533
    RFQ
    116-47-420-41-006000

    Datasheet

    116-47-420-41-006000 116 Tube Active DIP, 0.4" (10.16mm) Row Spacing 20 (2 x 10) 0.100" (2.54mm) Gold Flash Beryllium Copper Through Hole Elevated, Open Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
    88-PGM13041-10

    88-PGM13041-10

    CONN SOCKET PGA GOLD

    Aries Electronics

    4,422
    RFQ
    88-PGM13041-10

    Datasheet

    88-PGM13041-10 PGM Bulk Active PGA - 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole - Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled -55°C ~ 105°C
    APH-0426-T-T

    APH-0426-T-T

    APH-0426-T-T

    Samtec Inc.

    3,513
    RFQ

    -

    APH-0426-T-T * - Active - - - - - - - - - - - - - - -
    APH-0926-T-T

    APH-0926-T-T

    APH-0926-T-T

    Samtec Inc.

    2,298
    RFQ

    -

    APH-0926-T-T * - Active - - - - - - - - - - - - - - -
    APH-0626-T-T

    APH-0626-T-T

    APH-0626-T-T

    Samtec Inc.

    4,949
    RFQ

    -

    APH-0626-T-T * - Active - - - - - - - - - - - - - - -
    APH-0826-T-T

    APH-0826-T-T

    APH-0826-T-T

    Samtec Inc.

    3,855
    RFQ

    -

    APH-0826-T-T * - Active - - - - - - - - - - - - - - -
    115-44-422-41-003000

    115-44-422-41-003000

    CONN IC SKT DBL

    Mill-Max Manufacturing Corp.

    2,426
    RFQ
    115-44-422-41-003000

    Datasheet

    115-44-422-41-003000 115 Tube Active DIP, 0.4" (10.16mm) Row Spacing 22 (2 x 11) 0.100" (2.54mm) Tin 100.0µin (2.54µm) Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
    25-0503-20

    25-0503-20

    CONN SOCKET SIP 25POS GOLD

    Aries Electronics

    4,566
    RFQ
    25-0503-20

    Datasheet

    25-0503-20 0503 Bulk Active SIP 25 (1 x 25) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole - Wire Wrap 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Polyamide (PA), Nylon, Glass Filled -
    50-9518-10H

    50-9518-10H

    CONN IC DIP SOCKET 50POS GOLD

    Aries Electronics

    4,551
    RFQ
    50-9518-10H

    Datasheet

    50-9518-10H 518 Bulk Active DIP, 0.9" (22.86mm) Row Spacing 50 (2 x 25) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled -
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