Available 24/7 at SENICO ELECTRONICS INTL CO., LIMITED
    SENICO ELECTRONICS INTL CO., LIMITED

    IC Sockets

    Manufacturer Series Packaging Product Status Type Number of Positions or Pins (Grid) Pitch - Mating Contact Finish - Mating Contact Finish Thickness - Mating Contact Material - Mating Mounting Type Features Termination Pitch - Post Contact Finish - Post Contact Finish Thickness - Post Contact Material - Post Housing Material Operating Temperature















































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































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    Photo Mfr. Part # Availability Price Quantity Datasheet RoHs Series Packaging Product Status Type Number of Positions or Pins (Grid) Pitch - Mating Contact Finish - Mating Contact Finish Thickness - Mating Contact Material - Mating Mounting Type Features Termination Pitch - Post Contact Finish - Post Contact Finish Thickness - Post Contact Material - Post Housing Material Operating Temperature
    110-91-432-41-001000

    110-91-432-41-001000

    CONN IC DIP SOCKET 32POS GOLD

    Mill-Max Manufacturing Corp.

    3,592
    RFQ
    110-91-432-41-001000

    Datasheet

    110-91-432-41-001000 110 Tube Active DIP, 0.4" (10.16mm) Row Spacing 32 (2 x 16) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Tin-Lead 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
    110-41-432-41-001000

    110-41-432-41-001000

    CONN IC SKT DBL

    Mill-Max Manufacturing Corp.

    4,708
    RFQ
    110-41-432-41-001000

    Datasheet

    110-41-432-41-001000 110 Tube Active DIP, 0.4" (10.16mm) Row Spacing 32 (2 x 16) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
    HLS-0220-T-11

    HLS-0220-T-11

    .100" SCREW MACHINE SOCKET ARRAY

    Samtec Inc.

    4,767
    RFQ
    HLS-0220-T-11

    Datasheet

    HLS-0220-T-11 HLS Tube Active SIP 40 (2 x 20) 0.100" (2.54mm) Tin - - Through Hole Closed Frame Solder 0.100" (2.54mm) - - - Thermoplastic -55°C ~ 140°C
    210-47-636-41-001000

    210-47-636-41-001000

    STANDRD SOLDRTL DBL SKT

    Mill-Max Manufacturing Corp.

    4,711
    RFQ
    210-47-636-41-001000

    Datasheet

    210-47-636-41-001000 210 Tube Active DIP, 0.6" (15.24mm) Row Spacing 36 (2 x 18) 0.100" (2.54mm) Gold Flash Beryllium Copper Through Hole Closed Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
    714-93-210-31-012000

    714-93-210-31-012000

    SOCKET CARRIER DUAL INLINE 10POS

    Mill-Max Manufacturing Corp.

    4,254
    RFQ
    714-93-210-31-012000

    Datasheet

    714-93-210-31-012000 714 Tube Active DIP, 0.1" (2.54mm) Row Spacing 10 (2 x 5) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Closed Frame Solder 0.100" (2.54mm) Tin-Lead 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
    110-93-318-41-605000

    110-93-318-41-605000

    CONN IC DIP SOCKET 18POS GOLD

    Mill-Max Manufacturing Corp.

    2,136
    RFQ
    110-93-318-41-605000

    Datasheet

    110-93-318-41-605000 110 Tube Active DIP, 0.3" (7.62mm) Row Spacing 18 (2 x 9) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Tin-Lead 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
    14-3508-211

    14-3508-211

    CONN IC DIP SOCKET 14POS GOLD

    Aries Electronics

    4,915
    RFQ
    14-3508-211

    Datasheet

    14-3508-211 508 Bulk Active DIP, 0.3" (7.62mm) Row Spacing 14 (2 x 7) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame Wire Wrap 0.100" (2.54mm) Gold 10.0µin (0.25µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled -55°C ~ 125°C
    30-6820-90C

    30-6820-90C

    CONN IC DIP SOCKET 30POS GOLD

    Aries Electronics

    4,172
    RFQ
    30-6820-90C

    Datasheet

    30-6820-90C Vertisockets™ 800 Bulk Active DIP, 0.6" (15.24mm) Row Spacing 30 (2 x 15) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole, Right Angle, Horizontal Closed Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled -55°C ~ 105°C
    30-6822-90C

    30-6822-90C

    CONN IC DIP SOCKET 30POS GOLD

    Aries Electronics

    4,116
    RFQ
    30-6822-90C

    Datasheet

    30-6822-90C Vertisockets™ 800 Bulk Active DIP, 0.6" (15.24mm) Row Spacing 30 (2 x 15) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole, Right Angle, Horizontal Closed Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled -55°C ~ 105°C
    30-6823-90C

    30-6823-90C

    CONN IC DIP SOCKET 30POS GOLD

    Aries Electronics

    3,063
    RFQ
    30-6823-90C

    Datasheet

    30-6823-90C Vertisockets™ 800 Bulk Active DIP, 0.6" (15.24mm) Row Spacing 30 (2 x 15) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole, Right Angle, Horizontal Closed Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled -55°C ~ 105°C
    612-41-308-41-003000

    612-41-308-41-003000

    SKT CARRIER SOLDRTL

    Mill-Max Manufacturing Corp.

    3,964
    RFQ
    612-41-308-41-003000

    Datasheet

    612-41-308-41-003000 612 Tube Active DIP, 0.3" (7.62mm) Row Spacing 8 (2 x 4) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Carrier, Open Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
    612-91-308-41-003000

    612-91-308-41-003000

    SKT CARRIER SOLDRTL

    Mill-Max Manufacturing Corp.

    2,635
    RFQ
    612-91-308-41-003000

    Datasheet

    612-91-308-41-003000 612 Tube Active DIP, 0.3" (7.62mm) Row Spacing 8 (2 x 4) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Carrier, Open Frame Solder 0.100" (2.54mm) Tin-Lead 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
    115-47-632-41-001000

    115-47-632-41-001000

    CONN IC DIP SOCKET 32POS GOLD

    Mill-Max Manufacturing Corp.

    2,281
    RFQ
    115-47-632-41-001000

    Datasheet

    115-47-632-41-001000 115 Tube Active DIP, 0.6" (15.24mm) Row Spacing 32 (2 x 16) 0.100" (2.54mm) Gold Flash Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
    115-47-432-41-001000

    115-47-432-41-001000

    STANDRD SOLDRTL DBL SKT

    Mill-Max Manufacturing Corp.

    4,499
    RFQ
    115-47-432-41-001000

    Datasheet

    115-47-432-41-001000 115 Tube Active DIP, 0.4" (10.16mm) Row Spacing 32 (2 x 16) 0.100" (2.54mm) Gold Flash Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
    121-11-306-41-001000

    121-11-306-41-001000

    CONN IC SKT DBL

    Mill-Max Manufacturing Corp.

    4,656
    RFQ
    121-11-306-41-001000

    Datasheet

    121-11-306-41-001000 121 Tube Active DIP, 0.3" (7.62mm) Row Spacing 6 (2 x 3) 0.100" (2.54mm) - - Beryllium Copper Through Hole Open Frame Wire Wrap 0.100" (2.54mm) - - Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
    510-83-237-17-061101

    510-83-237-17-061101

    CONN SOCKET PGA 237POS GOLD

    Preci-Dip

    4,781
    RFQ
    510-83-237-17-061101

    Datasheet

    510-83-237-17-061101 510 Bulk Active PGA 237 (17 x 17) 0.100" (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
    612-41-310-41-003000

    612-41-310-41-003000

    SKT CARRIER SOLDRTL

    Mill-Max Manufacturing Corp.

    4,937
    RFQ
    612-41-310-41-003000

    Datasheet

    612-41-310-41-003000 612 Tube Active DIP, 0.3" (7.62mm) Row Spacing 10 (2 x 5) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Carrier, Open Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
    612-91-310-41-003000

    612-91-310-41-003000

    SKT CARRIER SOLDRTL

    Mill-Max Manufacturing Corp.

    2,345
    RFQ
    612-91-310-41-003000

    Datasheet

    612-91-310-41-003000 612 Tube Active DIP, 0.3" (7.62mm) Row Spacing 10 (2 x 5) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Carrier, Open Frame Solder 0.100" (2.54mm) Tin-Lead 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
    26-3513-11H

    26-3513-11H

    CONN IC DIP SOCKET 26POS GOLD

    Aries Electronics

    3,911
    RFQ
    26-3513-11H

    Datasheet

    26-3513-11H Lo-PRO®file, 513 Bulk Active DIP, 0.3" (7.62mm) Row Spacing 26 (2 x 13) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Closed Frame Solder 0.100" (2.54mm) Gold 10.0µin (0.25µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled -55°C ~ 105°C
    28-3508-202

    28-3508-202

    CONN IC DIP SOCKET 28POS GOLD

    Aries Electronics

    4,520
    RFQ
    28-3508-202

    Datasheet

    28-3508-202 508 Bulk Active DIP, 0.3" (7.62mm) Row Spacing 28 (2 x 14) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame Wire Wrap 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled -55°C ~ 105°C
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