Available 24/7 at SENICO ELECTRONICS INTL CO., LIMITED
    SENICO ELECTRONICS INTL CO., LIMITED

    IC Sockets

    Manufacturer Series Packaging Product Status Type Number of Positions or Pins (Grid) Pitch - Mating Contact Finish - Mating Contact Finish Thickness - Mating Contact Material - Mating Mounting Type Features Termination Pitch - Post Contact Finish - Post Contact Finish Thickness - Post Contact Material - Post Housing Material Operating Temperature















































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































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    Photo Mfr. Part # Availability Price Quantity Datasheet RoHs Series Packaging Product Status Type Number of Positions or Pins (Grid) Pitch - Mating Contact Finish - Mating Contact Finish Thickness - Mating Contact Material - Mating Mounting Type Features Termination Pitch - Post Contact Finish - Post Contact Finish Thickness - Post Contact Material - Post Housing Material Operating Temperature
    614-41-210-31-012000

    614-41-210-31-012000

    SKT CARRIER PGA

    Mill-Max Manufacturing Corp.

    4,187
    RFQ
    614-41-210-31-012000

    Datasheet

    614-41-210-31-012000 614 Tube Active DIP, 0.2" (5.08mm) Row Spacing 10 (2 x 5) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Carrier, Open Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
    614-91-210-31-012000

    614-91-210-31-012000

    SKT CARRIER PGA

    Mill-Max Manufacturing Corp.

    3,711
    RFQ
    614-91-210-31-012000

    Datasheet

    614-91-210-31-012000 614 Tube Active DIP, 0.2" (5.08mm) Row Spacing 10 (2 x 5) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Carrier, Open Frame Solder 0.100" (2.54mm) Tin-Lead 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
    146-93-316-41-012000

    146-93-316-41-012000

    CONN IC DIP SOCKET 16POS GOLD

    Mill-Max Manufacturing Corp.

    3,993
    RFQ
    146-93-316-41-012000

    Datasheet

    146-93-316-41-012000 146 Tube Active DIP, 0.3" (7.62mm) Row Spacing 16 (2 x 8) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame Press-Fit 0.100" (2.54mm) Tin-Lead 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
    146-43-316-41-012000

    146-43-316-41-012000

    CONN SKT DBL

    Mill-Max Manufacturing Corp.

    3,830
    RFQ
    146-43-316-41-012000

    Datasheet

    146-43-316-41-012000 146 Tube Active DIP, 0.3" (7.62mm) Row Spacing 16 (2 x 8) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame Press-Fit 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
    116-83-650-41-013101

    116-83-650-41-013101

    CONN IC DIP SOCKET 50POS GOLD

    Preci-Dip

    2,173
    RFQ
    116-83-650-41-013101

    Datasheet

    116-83-650-41-013101 116 Bulk Active DIP, 0.6" (15.24mm) Row Spacing 50 (2 x 25) 0.100" (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Elevated, Open Frame Solder 0.100" (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
    116-41-322-41-003000

    116-41-322-41-003000

    CONN IC SKT DBL

    Mill-Max Manufacturing Corp.

    3,373
    RFQ
    116-41-322-41-003000

    Datasheet

    116-41-322-41-003000 116 Tube Active DIP, 0.3" (7.62mm) Row Spacing 22 (2 x 11) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Elevated, Open Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
    116-41-422-41-003000

    116-41-422-41-003000

    CONN IC SKT DBL

    Mill-Max Manufacturing Corp.

    2,348
    RFQ
    116-41-422-41-003000

    Datasheet

    116-41-422-41-003000 116 Tube Active DIP, 0.4" (10.16mm) Row Spacing 22 (2 x 11) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Elevated, Open Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
    116-91-322-41-003000

    116-91-322-41-003000

    CONN IC SKT DBL

    Mill-Max Manufacturing Corp.

    2,619
    RFQ
    116-91-322-41-003000

    Datasheet

    116-91-322-41-003000 116 Tube Active DIP, 0.3" (7.62mm) Row Spacing 22 (2 x 11) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Elevated, Open Frame Solder 0.100" (2.54mm) Tin-Lead 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
    116-91-422-41-003000

    116-91-422-41-003000

    CONN IC SKT DBL

    Mill-Max Manufacturing Corp.

    4,049
    RFQ
    116-91-422-41-003000

    Datasheet

    116-91-422-41-003000 116 Tube Active DIP, 0.4" (10.16mm) Row Spacing 22 (2 x 11) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Elevated, Open Frame Solder 0.100" (2.54mm) Tin-Lead 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
    HLS-0406-T-18

    HLS-0406-T-18

    .100" SCREW MACHINE SOCKET ARRAY

    Samtec Inc.

    4,389
    RFQ
    HLS-0406-T-18

    Datasheet

    HLS-0406-T-18 HLS Bulk Active SIP 24 (4 x 6) 0.100" (2.54mm) Tin - - Through Hole Closed Frame Solder 0.100" (2.54mm) - - - Thermoplastic -55°C ~ 140°C
    ICA-322-ZHGT

    ICA-322-ZHGT

    .100" SCREW MACHINE DIP SOCKET

    Samtec Inc.

    4,799
    RFQ
    ICA-322-ZHGT

    Datasheet

    ICA-322-ZHGT ICA Bulk Active DIP, 0.3" (7.62mm) Row Spacing 22 (2 x 11) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Tin 10.0µin (0.25µm) Brass Polyester, Glass Filled -55°C ~ 125°C
    104-11-314-41-780000

    104-11-314-41-780000

    CONN IC SKT DBL

    Mill-Max Manufacturing Corp.

    2,832
    RFQ
    104-11-314-41-780000

    Datasheet

    104-11-314-41-780000 104 Tube Active DIP, 0.3" (7.62mm) Row Spacing 14 (2 x 7) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame Press-Fit 0.100" (2.54mm) Gold 10.0µin (0.25µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
    116-93-318-41-006000

    116-93-318-41-006000

    CONN IC DIP SOCKET 18POS GOLD

    Mill-Max Manufacturing Corp.

    3,757
    RFQ
    116-93-318-41-006000

    Datasheet

    116-93-318-41-006000 116 Tube Active DIP, 0.3" (7.62mm) Row Spacing 18 (2 x 9) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Elevated, Open Frame Solder 0.100" (2.54mm) Tin-Lead 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
    116-43-318-41-006000

    116-43-318-41-006000

    CONN IC SKT DBL

    Mill-Max Manufacturing Corp.

    2,292
    RFQ
    116-43-318-41-006000

    Datasheet

    116-43-318-41-006000 116 Tube Active DIP, 0.3" (7.62mm) Row Spacing 18 (2 x 9) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Elevated, Open Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
    614-41-210-31-002000

    614-41-210-31-002000

    SKT CARRIER PGA

    Mill-Max Manufacturing Corp.

    4,187
    RFQ
    614-41-210-31-002000

    Datasheet

    614-41-210-31-002000 614 Tube Active DIP, 0.2" (5.08mm) Row Spacing 10 (2 x 5) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Carrier, Open Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
    614-91-210-31-002000

    614-91-210-31-002000

    SKT CARRIER PGA

    Mill-Max Manufacturing Corp.

    3,063
    RFQ
    614-91-210-31-002000

    Datasheet

    614-91-210-31-002000 614 Tube Active DIP, 0.2" (5.08mm) Row Spacing 10 (2 x 5) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Carrier, Open Frame Solder 0.100" (2.54mm) Tin-Lead 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
    13-0511-11

    13-0511-11

    CONN SOCKET SIP 13POS GOLD

    Aries Electronics

    3,751
    RFQ
    13-0511-11

    Datasheet

    13-0511-11 511 Bulk Active SIP 13 (1 x 13) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Phosphor Bronze Through Hole - Solder 0.100" (2.54mm) Gold 10.0µin (0.25µm) Phosphor Bronze Polyamide (PA46), Nylon 4/6, Glass Filled -55°C ~ 125°C
    20-6621-30

    20-6621-30

    CONN IC DIP SOCKET 20POS TIN

    Aries Electronics

    4,566
    RFQ
    20-6621-30

    Datasheet

    20-6621-30 6621 Bulk Active DIP, 0.6" (15.24mm) Row Spacing 20 (2 x 10) 0.100" (2.54mm) Tin 200.0µin (5.08µm) Phosphor Bronze Through Hole, Bottom Entry; Through Board Closed Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Phosphor Bronze Polyamide (PA46), Nylon 4/6, Glass Filled -55°C ~ 105°C
    116-93-320-41-006000

    116-93-320-41-006000

    CONN IC DIP SOCKET 20POS GOLD

    Mill-Max Manufacturing Corp.

    3,581
    RFQ
    116-93-320-41-006000

    Datasheet

    116-93-320-41-006000 116 Tube Active DIP, 0.3" (7.62mm) Row Spacing 20 (2 x 10) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Elevated, Open Frame Solder 0.100" (2.54mm) Tin-Lead 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
    116-93-420-41-006000

    116-93-420-41-006000

    CONN IC DIP SOCKET 20POS GOLD

    Mill-Max Manufacturing Corp.

    2,205
    RFQ
    116-93-420-41-006000

    Datasheet

    116-93-420-41-006000 116 Tube Active DIP, 0.4" (10.16mm) Row Spacing 20 (2 x 10) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Elevated, Open Frame Solder 0.100" (2.54mm) Tin-Lead 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
    Total 19086 Record«Prev1... 549550551552553554555556...955Next»
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