Available 24/7 at SENICO ELECTRONICS INTL CO., LIMITED
    SENICO ELECTRONICS INTL CO., LIMITED

    IC Sockets

    Manufacturer Series Packaging Product Status Type Number of Positions or Pins (Grid) Pitch - Mating Contact Finish - Mating Contact Finish Thickness - Mating Contact Material - Mating Mounting Type Features Termination Pitch - Post Contact Finish - Post Contact Finish Thickness - Post Contact Material - Post Housing Material Operating Temperature















































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































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    Photo Mfr. Part # Availability Price Quantity Datasheet RoHs Series Packaging Product Status Type Number of Positions or Pins (Grid) Pitch - Mating Contact Finish - Mating Contact Finish Thickness - Mating Contact Material - Mating Mounting Type Features Termination Pitch - Post Contact Finish - Post Contact Finish Thickness - Post Contact Material - Post Housing Material Operating Temperature
    116-43-420-41-006000

    116-43-420-41-006000

    CONN IC SKT DBL

    Mill-Max Manufacturing Corp.

    4,279
    RFQ
    116-43-420-41-006000

    Datasheet

    116-43-420-41-006000 116 Tube Active DIP, 0.4" (10.16mm) Row Spacing 20 (2 x 10) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Elevated, Open Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
    614-41-210-31-007000

    614-41-210-31-007000

    SKT CARRIER PGA

    Mill-Max Manufacturing Corp.

    3,784
    RFQ
    614-41-210-31-007000

    Datasheet

    614-41-210-31-007000 614 Tube Active DIP, 0.2" (5.08mm) Row Spacing 10 (2 x 5) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Carrier, Open Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
    614-91-210-31-007000

    614-91-210-31-007000

    SKT CARRIER PGA

    Mill-Max Manufacturing Corp.

    4,084
    RFQ
    614-91-210-31-007000

    Datasheet

    614-91-210-31-007000 614 Tube Active DIP, 0.2" (5.08mm) Row Spacing 10 (2 x 5) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Carrier, Open Frame Solder 0.100" (2.54mm) Tin-Lead 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
    HLS-0312-T-32

    HLS-0312-T-32

    .100" SCREW MACHINE SOCKET ARRAY

    Samtec Inc.

    4,066
    RFQ
    HLS-0312-T-32

    Datasheet

    HLS-0312-T-32 HLS Tube Active SIP 36 (3 x 12) 0.100" (2.54mm) Tin - - Through Hole Closed Frame Solder 0.100" (2.54mm) - - - Thermoplastic -55°C ~ 140°C
    124-41-308-41-002000

    124-41-308-41-002000

    CONN IC SKT DBL

    Mill-Max Manufacturing Corp.

    3,079
    RFQ
    124-41-308-41-002000

    Datasheet

    124-41-308-41-002000 124 Tube Active DIP, 0.3" (7.62mm) Row Spacing 8 (2 x 4) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame Wire Wrap 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
    124-91-308-41-002000

    124-91-308-41-002000

    CONN IC SKT DBL

    Mill-Max Manufacturing Corp.

    4,196
    RFQ
    124-91-308-41-002000

    Datasheet

    124-91-308-41-002000 124 Tube Active DIP, 0.3" (7.62mm) Row Spacing 8 (2 x 4) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame Wire Wrap 0.100" (2.54mm) Tin-Lead 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
    210-11-324-41-001000

    210-11-324-41-001000

    CONN IC SKT DBL

    Mill-Max Manufacturing Corp.

    3,743
    RFQ
    210-11-324-41-001000

    Datasheet

    210-11-324-41-001000 210 Tube Active DIP, 0.3" (7.62mm) Row Spacing 24 (2 x 12) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Closed Frame Solder 0.100" (2.54mm) Gold 10.0µin (0.25µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
    210-11-424-41-001000

    210-11-424-41-001000

    CONN IC SKT DBL

    Mill-Max Manufacturing Corp.

    4,127
    RFQ
    210-11-424-41-001000

    Datasheet

    210-11-424-41-001000 210 Tube Active DIP, 0.4" (10.16mm) Row Spacing 24 (2 x 12) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Closed Frame Solder 0.100" (2.54mm) Gold 10.0µin (0.25µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
    210-11-624-41-001000

    210-11-624-41-001000

    CONN IC SKT DBL

    Mill-Max Manufacturing Corp.

    4,408
    RFQ
    210-11-624-41-001000

    Datasheet

    210-11-624-41-001000 210 Tube Active DIP, 0.6" (15.24mm) Row Spacing 24 (2 x 12) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Closed Frame Solder 0.100" (2.54mm) Gold 10.0µin (0.25µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
    114-93-324-41-117000

    114-93-324-41-117000

    CONN IC DIP SOCKET 24POS GOLD

    Mill-Max Manufacturing Corp.

    4,659
    RFQ
    114-93-324-41-117000

    Datasheet

    114-93-324-41-117000 114 Tube Active DIP, 0.3" (7.62mm) Row Spacing 24 (2 x 12) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Surface Mount Open Frame Solder 0.100" (2.54mm) Tin-Lead 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
    114-93-424-41-117000

    114-93-424-41-117000

    CONN IC DIP SOCKET 24POS GOLD

    Mill-Max Manufacturing Corp.

    2,071
    RFQ
    114-93-424-41-117000

    Datasheet

    114-93-424-41-117000 114 Tube Active DIP, 0.4" (10.16mm) Row Spacing 24 (2 x 12) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Surface Mount Open Frame Solder 0.100" (2.54mm) Tin-Lead 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
    114-93-624-41-117000

    114-93-624-41-117000

    CONN IC DIP SOCKET 24POS GOLD

    Mill-Max Manufacturing Corp.

    3,374
    RFQ
    114-93-624-41-117000

    Datasheet

    114-93-624-41-117000 114 Tube Active DIP, 0.6" (15.24mm) Row Spacing 24 (2 x 12) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Surface Mount Open Frame Solder 0.100" (2.54mm) Tin-Lead 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
    114-43-324-41-117000

    114-43-324-41-117000

    CONN IC SKT DBL

    Mill-Max Manufacturing Corp.

    2,659
    RFQ
    114-43-324-41-117000

    Datasheet

    114-43-324-41-117000 114 Tube Active DIP, 0.3" (7.62mm) Row Spacing 24 (2 x 12) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Surface Mount Open Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
    114-43-424-41-117000

    114-43-424-41-117000

    CONN IC SKT DBL

    Mill-Max Manufacturing Corp.

    4,173
    RFQ
    114-43-424-41-117000

    Datasheet

    114-43-424-41-117000 114 Tube Active DIP, 0.4" (10.16mm) Row Spacing 24 (2 x 12) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Surface Mount Open Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
    114-43-624-41-117000

    114-43-624-41-117000

    CONN IC SKT DBL

    Mill-Max Manufacturing Corp.

    4,887
    RFQ
    114-43-624-41-117000

    Datasheet

    114-43-624-41-117000 114 Tube Active DIP, 0.6" (15.24mm) Row Spacing 24 (2 x 12) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Surface Mount Open Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
    HLS-0314-G-2

    HLS-0314-G-2

    .100" SCREW MACHINE SOCKET ARRAY

    Samtec Inc.

    3,921
    RFQ
    HLS-0314-G-2

    Datasheet

    HLS-0314-G-2 HLS Tube Active SIP 42 (3 x 14) 0.100" (2.54mm) Gold 30.0µin (0.76µm) - Through Hole Closed Frame Solder 0.100" (2.54mm) Gold 10.0µin (0.25µm) - Thermoplastic -55°C ~ 140°C
    ICA-648-ATT

    ICA-648-ATT

    .100" SCREW MACHINE DIP SOCKET

    Samtec Inc.

    2,941
    RFQ
    ICA-648-ATT

    Datasheet

    ICA-648-ATT ICA Tube Active DIP, 0.6" (15.24mm) Row Spacing 48 (2 x 24) 0.100" (2.54mm) Tin - Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Tin - Brass Polyester, Glass Filled -55°C ~ 105°C
    14-0511-11

    14-0511-11

    CONN SOCKET SIP 14POS GOLD

    Aries Electronics

    3,940
    RFQ
    14-0511-11

    Datasheet

    14-0511-11 511 Bulk Active SIP 14 (1 x 14) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Phosphor Bronze Through Hole - Solder 0.100" (2.54mm) Gold 10.0µin (0.25µm) Phosphor Bronze Polyamide (PA46), Nylon 4/6, Glass Filled -55°C ~ 125°C
    29-0501-20

    29-0501-20

    CONN SOCKET SIP 29POS TIN

    Aries Electronics

    2,877
    RFQ
    29-0501-20

    Datasheet

    29-0501-20 501 Bulk Active SIP 29 (1 x 29) 0.100" (2.54mm) Tin 200.0µin (5.08µm) Phosphor Bronze Through Hole - Wire Wrap 0.100" (2.54mm) Tin 200.0µin (5.08µm) Phosphor Bronze Polyamide (PA46), Nylon 4/6, Glass Filled -55°C ~ 105°C
    29-0501-30

    29-0501-30

    CONN SOCKET SIP 29POS TIN

    Aries Electronics

    3,566
    RFQ
    29-0501-30

    Datasheet

    29-0501-30 501 Bulk Active SIP 29 (1 x 29) 0.100" (2.54mm) Tin 200.0µin (5.08µm) Phosphor Bronze Through Hole - Wire Wrap 0.100" (2.54mm) Tin 200.0µin (5.08µm) Phosphor Bronze Polyamide (PA46), Nylon 4/6, Glass Filled -55°C ~ 105°C
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