Available 24/7 at SENICO ELECTRONICS INTL CO., LIMITED
    SENICO ELECTRONICS INTL CO., LIMITED

    IC Sockets

    Manufacturer Series Packaging Product Status Type Number of Positions or Pins (Grid) Pitch - Mating Contact Finish - Mating Contact Finish Thickness - Mating Contact Material - Mating Mounting Type Features Termination Pitch - Post Contact Finish - Post Contact Finish Thickness - Post Contact Material - Post Housing Material Operating Temperature















































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































    Reset All
    Apply All
    Result:
    Photo Mfr. Part # Availability Price Quantity Datasheet RoHs Series Packaging Product Status Type Number of Positions or Pins (Grid) Pitch - Mating Contact Finish - Mating Contact Finish Thickness - Mating Contact Material - Mating Mounting Type Features Termination Pitch - Post Contact Finish - Post Contact Finish Thickness - Post Contact Material - Post Housing Material Operating Temperature
    614-43-314-31-018000

    614-43-314-31-018000

    SKT CARRIER PGA

    Mill-Max Manufacturing Corp.

    3,585
    RFQ
    614-43-314-31-018000

    Datasheet

    614-43-314-31-018000 614 Tube Active DIP, 0.3" (7.62mm) Row Spacing 14 (2 x 7) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Carrier, Open Frame Solder 0.100" (2.54mm) Tin 30.0µin (0.76µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
    HLS-0311-T-38

    HLS-0311-T-38

    .100" SCREW MACHINE SOCKET ARRAY

    Samtec Inc.

    3,637
    RFQ
    HLS-0311-T-38

    Datasheet

    HLS-0311-T-38 HLS Tube Active SIP 33 (3 x 11) 0.100" (2.54mm) Tin - - Through Hole Closed Frame Solder 0.100" (2.54mm) - - - Thermoplastic -55°C ~ 140°C
    114-41-432-41-117000

    114-41-432-41-117000

    CONN IC SKT DBL

    Mill-Max Manufacturing Corp.

    2,433
    RFQ
    114-41-432-41-117000

    Datasheet

    114-41-432-41-117000 114 Tube Active DIP, 0.4" (10.16mm) Row Spacing 32 (2 x 16) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Surface Mount Open Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
    114-41-632-41-117000

    114-41-632-41-117000

    CONN IC SKT DBL

    Mill-Max Manufacturing Corp.

    2,250
    RFQ
    114-41-632-41-117000

    Datasheet

    114-41-632-41-117000 114 Tube Active DIP, 0.6" (15.24mm) Row Spacing 32 (2 x 16) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Surface Mount Open Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
    114-91-432-41-117000

    114-91-432-41-117000

    CONN IC SKT DBL

    Mill-Max Manufacturing Corp.

    4,950
    RFQ
    114-91-432-41-117000

    Datasheet

    114-91-432-41-117000 114 Tube Active DIP, 0.4" (10.16mm) Row Spacing 32 (2 x 16) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Surface Mount Open Frame Solder 0.100" (2.54mm) Tin-Lead 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
    114-91-632-41-117000

    114-91-632-41-117000

    CONN IC SKT DBL

    Mill-Max Manufacturing Corp.

    4,005
    RFQ
    114-91-632-41-117000

    Datasheet

    114-91-632-41-117000 114 Tube Active DIP, 0.6" (15.24mm) Row Spacing 32 (2 x 16) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Surface Mount Open Frame Solder 0.100" (2.54mm) Tin-Lead 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
    ICO-632-CGG

    ICO-632-CGG

    .100" LOW PROFILE SCREW MACHINE

    Samtec Inc.

    3,174
    RFQ
    ICO-632-CGG

    Datasheet

    ICO-632-CGG ICO Tube Active DIP, 0.6" (15.24mm) Row Spacing 32 (2 x 16) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Gold 30.0µin (0.76µm) Brass Polyester, Glass Filled -55°C ~ 125°C
    712-43-112-41-001000

    712-43-112-41-001000

    SOCKET CARRIER SIP 12POS

    Mill-Max Manufacturing Corp.

    4,854
    RFQ

    -

    712-43-112-41-001000 712 Tube Active SIP 12 (1 x 12) 0.100" (2.54mm) Tin 200.0µin (5.08µm) Beryllium Copper Through Hole - Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
    30-6501-21

    30-6501-21

    CONN IC DIP SOCKET 30POS GOLD

    Aries Electronics

    3,751
    RFQ
    30-6501-21

    Datasheet

    30-6501-21 501 Bulk Active DIP, 0.6" (15.24mm) Row Spacing 30 (2 x 15) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Phosphor Bronze Through Hole Closed Frame Wire Wrap 0.100" (2.54mm) Gold 10.0µin (0.25µm) Phosphor Bronze Polyamide (PA46), Nylon 4/6, Glass Filled -55°C ~ 125°C
    30-6501-31

    30-6501-31

    CONN IC DIP SOCKET 30POS GOLD

    Aries Electronics

    2,193
    RFQ
    30-6501-31

    Datasheet

    30-6501-31 501 Bulk Active DIP, 0.6" (15.24mm) Row Spacing 30 (2 x 15) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Phosphor Bronze Through Hole Closed Frame Wire Wrap 0.100" (2.54mm) Gold 10.0µin (0.25µm) Phosphor Bronze Polyamide (PA46), Nylon 4/6, Glass Filled -55°C ~ 125°C
    HLS-0311-G-11

    HLS-0311-G-11

    .100" SCREW MACHINE SOCKET ARRAY

    Samtec Inc.

    3,707
    RFQ
    HLS-0311-G-11

    Datasheet

    HLS-0311-G-11 HLS Tube Active SIP 33 (3 x 11) 0.100" (2.54mm) Gold 30.0µin (0.76µm) - Through Hole Closed Frame Solder 0.100" (2.54mm) Gold 10.0µin (0.25µm) - Thermoplastic -55°C ~ 140°C
    116-41-316-41-008000

    116-41-316-41-008000

    CONN IC SKT DBL

    Mill-Max Manufacturing Corp.

    3,958
    RFQ
    116-41-316-41-008000

    Datasheet

    116-41-316-41-008000 116 Tube Active DIP, 0.3" (7.62mm) Row Spacing 16 (2 x 8) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Elevated, Open Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
    116-91-316-41-008000

    116-91-316-41-008000

    CONN IC SKT DBL

    Mill-Max Manufacturing Corp.

    3,670
    RFQ
    116-91-316-41-008000

    Datasheet

    116-91-316-41-008000 116 Tube Active DIP, 0.3" (7.62mm) Row Spacing 16 (2 x 8) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Elevated, Open Frame Solder 0.100" (2.54mm) Tin-Lead 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
    116-41-314-41-001000

    116-41-314-41-001000

    CONN IC SKT DBL

    Mill-Max Manufacturing Corp.

    4,473
    RFQ
    116-41-314-41-001000

    Datasheet

    116-41-314-41-001000 116 Tube Active DIP, 0.3" (7.62mm) Row Spacing 14 (2 x 7) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Elevated, Open Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
    116-91-314-41-001000

    116-91-314-41-001000

    CONN IC SKT DBL

    Mill-Max Manufacturing Corp.

    3,360
    RFQ
    116-91-314-41-001000

    Datasheet

    116-91-314-41-001000 116 Tube Active DIP, 0.3" (7.62mm) Row Spacing 14 (2 x 7) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Elevated, Open Frame Solder 0.100" (2.54mm) Tin-Lead 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
    605-93-210-11-480000

    605-93-210-11-480000

    SOCKET CARRIER LOWPRO .200 10POS

    Mill-Max Manufacturing Corp.

    4,378
    RFQ
    605-93-210-11-480000

    Datasheet

    605-93-210-11-480000 605 Tube Active DIP, 0.2" (5.08mm) Row Spacing 10 (2 x 5) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Carrier, Open Frame Solder 0.100" (2.54mm) Tin-Lead 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
    605-43-210-11-480000

    605-43-210-11-480000

    SKT CARRIER LOWPRO

    Mill-Max Manufacturing Corp.

    3,814
    RFQ
    605-43-210-11-480000

    Datasheet

    605-43-210-11-480000 605 Tube Active DIP, 0.2" (5.08mm) Row Spacing 10 (2 x 5) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Carrier, Open Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
    APO-640-T-T

    APO-640-T-T

    .100" LOW PROFILE SCREW MACHINE

    Samtec Inc.

    3,933
    RFQ
    APO-640-T-T

    Datasheet

    APO-640-T-T APO Bulk Active DIP, 0.6" (15.24mm) Row Spacing 40 (2 x 20) 0.100" (2.54mm) Tin - Phosphor Bronze Through Hole Open Frame Solder 0.100" (2.54mm) Tin - Phosphor Bronze Polybutylene Terephthalate (PBT), Glass Filled -
    28-3551-10

    28-3551-10

    CONN IC DIP SOCKET ZIF 28POS TIN

    Aries Electronics

    3,225
    RFQ
    28-3551-10

    Datasheet

    28-3551-10 55 Bulk Active DIP, ZIF (ZIP), 0.3" (7.62mm) Row Spacing 28 (2 x 14) 0.100" (2.54mm) Tin 200.0µin (5.08µm) Beryllium Copper Through Hole Closed Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Beryllium Copper Polyphenylene Sulfide (PPS), Glass Filled -
    28-3552-10

    28-3552-10

    CONN IC DIP SOCKET ZIF 28POS TIN

    Aries Electronics

    2,324
    RFQ
    28-3552-10

    Datasheet

    28-3552-10 55 Bulk Active DIP, ZIF (ZIP), 0.3" (7.62mm) Row Spacing 28 (2 x 14) 0.100" (2.54mm) Tin 200.0µin (5.08µm) Beryllium Copper Through Hole Closed Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Beryllium Copper Polyphenylene Sulfide (PPS), Glass Filled -
    Total 19086 Record«Prev1... 554555556557558559560561...955Next»
    HOME

    HOME

    PRODUCT

    PRODUCT

    PHONE

    PHONE

    USER

    USER