Available 24/7 at SENICO ELECTRONICS INTL CO., LIMITED
    SENICO ELECTRONICS INTL CO., LIMITED

    IC Sockets

    Manufacturer Series Packaging Product Status Type Number of Positions or Pins (Grid) Pitch - Mating Contact Finish - Mating Contact Finish Thickness - Mating Contact Material - Mating Mounting Type Features Termination Pitch - Post Contact Finish - Post Contact Finish Thickness - Post Contact Material - Post Housing Material Operating Temperature















































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































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    Photo Mfr. Part # Availability Price Quantity Datasheet RoHs Series Packaging Product Status Type Number of Positions or Pins (Grid) Pitch - Mating Contact Finish - Mating Contact Finish Thickness - Mating Contact Material - Mating Mounting Type Features Termination Pitch - Post Contact Finish - Post Contact Finish Thickness - Post Contact Material - Post Housing Material Operating Temperature
    ICO-324-JGG

    ICO-324-JGG

    .100" LOW PROFILE SCREW MACHINE

    Samtec Inc.

    4,282
    RFQ
    ICO-324-JGG

    Datasheet

    ICO-324-JGG ICO Tube Active DIP, 0.3" (7.62mm) Row Spacing 24 (2 x 12) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Gold 30.0µin (0.76µm) Brass Polyester, Glass Filled -55°C ~ 125°C
    ICA-624-JGG

    ICA-624-JGG

    .100" SCREW MACHINE DIP SOCKET

    Samtec Inc.

    4,024
    RFQ
    ICA-624-JGG

    Datasheet

    ICA-624-JGG ICA Tube Active DIP, 0.6" (15.24mm) Row Spacing 24 (2 x 12) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Gold 30.0µin (0.76µm) Brass Polyester, Glass Filled -55°C ~ 125°C
    614-41-320-31-007000

    614-41-320-31-007000

    SKT CARRIER PGA

    Mill-Max Manufacturing Corp.

    2,276
    RFQ
    614-41-320-31-007000

    Datasheet

    614-41-320-31-007000 614 Tube Active DIP, 0.3" (7.62mm) Row Spacing 20 (2 x 10) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Carrier, Open Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
    614-41-420-31-007000

    614-41-420-31-007000

    SKT CARRIER PGA

    Mill-Max Manufacturing Corp.

    3,305
    RFQ
    614-41-420-31-007000

    Datasheet

    614-41-420-31-007000 614 Tube Active DIP, 0.4" (10.16mm) Row Spacing 20 (2 x 10) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Carrier, Open Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
    614-91-320-31-007000

    614-91-320-31-007000

    SKT CARRIER PGA

    Mill-Max Manufacturing Corp.

    4,699
    RFQ
    614-91-320-31-007000

    Datasheet

    614-91-320-31-007000 614 Tube Active DIP, 0.3" (7.62mm) Row Spacing 20 (2 x 10) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Carrier, Open Frame Solder 0.100" (2.54mm) Tin-Lead 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
    614-91-420-31-007000

    614-91-420-31-007000

    SKT CARRIER PGA

    Mill-Max Manufacturing Corp.

    2,582
    RFQ
    614-91-420-31-007000

    Datasheet

    614-91-420-31-007000 614 Tube Active DIP, 0.4" (10.16mm) Row Spacing 20 (2 x 10) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Carrier, Open Frame Solder 0.100" (2.54mm) Tin-Lead 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
    116-41-328-41-006000

    116-41-328-41-006000

    CONN IC SKT DBL

    Mill-Max Manufacturing Corp.

    2,808
    RFQ
    116-41-328-41-006000

    Datasheet

    116-41-328-41-006000 116 Tube Active DIP, 0.3" (7.62mm) Row Spacing 28 (2 x 14) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Elevated, Open Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
    116-41-428-41-006000

    116-41-428-41-006000

    CONN IC SKT DBL

    Mill-Max Manufacturing Corp.

    4,297
    RFQ
    116-41-428-41-006000

    Datasheet

    116-41-428-41-006000 116 Tube Active DIP, 0.4" (10.16mm) Row Spacing 28 (2 x 14) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Elevated, Open Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
    116-41-628-41-006000

    116-41-628-41-006000

    CONN IC SKT DBL

    Mill-Max Manufacturing Corp.

    2,062
    RFQ
    116-41-628-41-006000

    Datasheet

    116-41-628-41-006000 116 Tube Active DIP, 0.6" (15.24mm) Row Spacing 28 (2 x 14) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Elevated, Open Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
    116-91-328-41-006000

    116-91-328-41-006000

    CONN IC SKT DBL

    Mill-Max Manufacturing Corp.

    4,415
    RFQ
    116-91-328-41-006000

    Datasheet

    116-91-328-41-006000 116 Tube Active DIP, 0.3" (7.62mm) Row Spacing 28 (2 x 14) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Elevated, Open Frame Solder 0.100" (2.54mm) Tin-Lead 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
    116-91-428-41-006000

    116-91-428-41-006000

    CONN IC SKT DBL

    Mill-Max Manufacturing Corp.

    4,894
    RFQ
    116-91-428-41-006000

    Datasheet

    116-91-428-41-006000 116 Tube Active DIP, 0.4" (10.16mm) Row Spacing 28 (2 x 14) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Elevated, Open Frame Solder 0.100" (2.54mm) Tin-Lead 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
    116-91-628-41-006000

    116-91-628-41-006000

    CONN IC SKT DBL

    Mill-Max Manufacturing Corp.

    3,224
    RFQ
    116-91-628-41-006000

    Datasheet

    116-91-628-41-006000 116 Tube Active DIP, 0.6" (15.24mm) Row Spacing 28 (2 x 14) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Elevated, Open Frame Solder 0.100" (2.54mm) Tin-Lead 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
    614-41-318-31-002000

    614-41-318-31-002000

    SKT CARRIER PGA

    Mill-Max Manufacturing Corp.

    2,438
    RFQ
    614-41-318-31-002000

    Datasheet

    614-41-318-31-002000 614 Tube Active DIP, 0.3" (7.62mm) Row Spacing 18 (2 x 9) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Carrier, Open Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
    614-91-318-31-002000

    614-91-318-31-002000

    SKT CARRIER PGA

    Mill-Max Manufacturing Corp.

    3,516
    RFQ
    614-91-318-31-002000

    Datasheet

    614-91-318-31-002000 614 Tube Active DIP, 0.3" (7.62mm) Row Spacing 18 (2 x 9) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Carrier, Open Frame Solder 0.100" (2.54mm) Tin-Lead 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
    614-41-318-31-007000

    614-41-318-31-007000

    SKT CARRIER PGA

    Mill-Max Manufacturing Corp.

    2,266
    RFQ
    614-41-318-31-007000

    Datasheet

    614-41-318-31-007000 614 Tube Active DIP, 0.3" (7.62mm) Row Spacing 18 (2 x 9) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Carrier, Open Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
    614-91-318-31-007000

    614-91-318-31-007000

    SKT CARRIER PGA

    Mill-Max Manufacturing Corp.

    4,781
    RFQ
    614-91-318-31-007000

    Datasheet

    614-91-318-31-007000 614 Tube Active DIP, 0.3" (7.62mm) Row Spacing 18 (2 x 9) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Carrier, Open Frame Solder 0.100" (2.54mm) Tin-Lead 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
    410-93-214-10-002000

    410-93-214-10-002000

    SOCKET DUAL IN-LINE SLDRTL 14POS

    Mill-Max Manufacturing Corp.

    3,112
    RFQ
    410-93-214-10-002000

    Datasheet

    410-93-214-10-002000 410 Tube Active Zig-Zag, Right Stackable 14 (2 x 7) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Closed Frame Solder 0.100" (2.54mm) Tin-Lead 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
    20-8730-310C

    20-8730-310C

    CONN IC DIP SOCKET 20POS GOLD

    Aries Electronics

    2,213
    RFQ
    20-8730-310C

    Datasheet

    20-8730-310C 8 Bulk Active DIP, 0.3" (7.62mm) Row Spacing 20 (2 x 10) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Closed Frame, Elevated Solder 0.100" (2.54mm) Gold 10.0µin (0.25µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled -55°C ~ 105°C
    20-8770-310C

    20-8770-310C

    CONN IC DIP SOCKET 20POS GOLD

    Aries Electronics

    2,727
    RFQ
    20-8770-310C

    Datasheet

    20-8770-310C 8 Bulk Active DIP, 0.3" (7.62mm) Row Spacing 20 (2 x 10) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Closed Frame, Elevated Solder 0.100" (2.54mm) Gold 10.0µin (0.25µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled -55°C ~ 105°C
    126-41-320-41-001000

    126-41-320-41-001000

    CONN IC SKT DBL

    Mill-Max Manufacturing Corp.

    4,998
    RFQ
    126-41-320-41-001000

    Datasheet

    126-41-320-41-001000 126 Tube Active DIP, 0.3" (7.62mm) Row Spacing 20 (2 x 10) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame Wire Wrap 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
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