Available 24/7 at SENICO ELECTRONICS INTL CO., LIMITED
    SENICO ELECTRONICS INTL CO., LIMITED

    IC Sockets

    Manufacturer Series Packaging Product Status Type Number of Positions or Pins (Grid) Pitch - Mating Contact Finish - Mating Contact Finish Thickness - Mating Contact Material - Mating Mounting Type Features Termination Pitch - Post Contact Finish - Post Contact Finish Thickness - Post Contact Material - Post Housing Material Operating Temperature















































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































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    Photo Mfr. Part # Availability Price Quantity Datasheet RoHs Series Packaging Product Status Type Number of Positions or Pins (Grid) Pitch - Mating Contact Finish - Mating Contact Finish Thickness - Mating Contact Material - Mating Mounting Type Features Termination Pitch - Post Contact Finish - Post Contact Finish Thickness - Post Contact Material - Post Housing Material Operating Temperature
    110-41-636-41-105000

    110-41-636-41-105000

    CONN IC SKT DBL

    Mill-Max Manufacturing Corp.

    4,287
    RFQ
    110-41-636-41-105000

    Datasheet

    110-41-636-41-105000 110 Tube Active DIP, 0.6" (15.24mm) Row Spacing 36 (2 x 18) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Surface Mount Open Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
    110-91-636-41-105000

    110-91-636-41-105000

    CONN IC SKT DBL

    Mill-Max Manufacturing Corp.

    2,265
    RFQ
    110-91-636-41-105000

    Datasheet

    110-91-636-41-105000 110 Tube Active DIP, 0.6" (15.24mm) Row Spacing 36 (2 x 18) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Surface Mount Open Frame Solder 0.100" (2.54mm) Tin-Lead 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
    123-91-318-41-001000

    123-91-318-41-001000

    SOCKET IC OPEN 3 LVL .300 18POS

    Mill-Max Manufacturing Corp.

    2,463
    RFQ

    -

    123-91-318-41-001000 123 Tube Active DIP, 0.3" (7.62mm) Row Spacing 18 (2 x 9) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame Wire Wrap 0.100" (2.54mm) Tin-Lead 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
    123-41-318-41-001000

    123-41-318-41-001000

    CONN IC SKT DBL

    Mill-Max Manufacturing Corp.

    3,521
    RFQ
    123-41-318-41-001000

    Datasheet

    123-41-318-41-001000 123 Tube Active DIP, 0.3" (7.62mm) Row Spacing 18 (2 x 9) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame Wire Wrap 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
    28-7750-10

    28-7750-10

    CONN SOCKET SIP 28POS TIN

    Aries Electronics

    2,215
    RFQ
    28-7750-10

    Datasheet

    28-7750-10 700 Elevator Strip-Line™ Bulk Active SIP 28 (1 x 28) 0.100" (2.54mm) Tin 200.0µin (5.08µm) Phosphor Bronze Through Hole Elevated Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Phosphor Bronze Polyamide (PA46), Nylon 4/6, Glass Filled -55°C ~ 105°C
    40-C182-00

    40-C182-00

    CONN IC DIP SOCKET 40POS GOLD

    Aries Electronics

    4,512
    RFQ
    40-C182-00

    Datasheet

    40-C182-00 EJECT-A-DIP™ Bulk Active DIP, 0.6" (15.24mm) Row Spacing 40 (2 x 20) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Closed Frame Wire Wrap 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled -55°C ~ 105°C
    40-C212-00

    40-C212-00

    CONN IC DIP SOCKET 40POS GOLD

    Aries Electronics

    4,915
    RFQ
    40-C212-00

    Datasheet

    40-C212-00 EJECT-A-DIP™ Bulk Active DIP, 0.6" (15.24mm) Row Spacing 40 (2 x 20) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Surface Mount Closed Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled -55°C ~ 105°C
    40-C300-00

    40-C300-00

    CONN IC DIP SOCKET 40POS GOLD

    Aries Electronics

    3,040
    RFQ
    40-C300-00

    Datasheet

    40-C300-00 EJECT-A-DIP™ Bulk Active DIP, 0.6" (15.24mm) Row Spacing 40 (2 x 20) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Surface Mount Closed Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled -55°C ~ 105°C
    116-41-324-41-007000

    116-41-324-41-007000

    CONN IC SKT DBL

    Mill-Max Manufacturing Corp.

    4,451
    RFQ
    116-41-324-41-007000

    Datasheet

    116-41-324-41-007000 116 Tube Active DIP, 0.3" (7.62mm) Row Spacing 24 (2 x 12) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Elevated, Open Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
    116-41-424-41-007000

    116-41-424-41-007000

    CONN IC SKT DBL

    Mill-Max Manufacturing Corp.

    2,141
    RFQ
    116-41-424-41-007000

    Datasheet

    116-41-424-41-007000 116 Tube Active DIP, 0.4" (10.16mm) Row Spacing 24 (2 x 12) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Elevated, Open Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
    116-41-624-41-007000

    116-41-624-41-007000

    CONN IC SKT DBL

    Mill-Max Manufacturing Corp.

    4,348
    RFQ
    116-41-624-41-007000

    Datasheet

    116-41-624-41-007000 116 Tube Active DIP, 0.6" (15.24mm) Row Spacing 24 (2 x 12) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Elevated, Open Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
    116-91-324-41-007000

    116-91-324-41-007000

    CONN IC SKT DBL

    Mill-Max Manufacturing Corp.

    4,319
    RFQ
    116-91-324-41-007000

    Datasheet

    116-91-324-41-007000 116 Tube Active DIP, 0.3" (7.62mm) Row Spacing 24 (2 x 12) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Elevated, Open Frame Solder 0.100" (2.54mm) Tin-Lead 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
    116-91-424-41-007000

    116-91-424-41-007000

    CONN IC SKT DBL

    Mill-Max Manufacturing Corp.

    3,550
    RFQ
    116-91-424-41-007000

    Datasheet

    116-91-424-41-007000 116 Tube Active DIP, 0.4" (10.16mm) Row Spacing 24 (2 x 12) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Elevated, Open Frame Solder 0.100" (2.54mm) Tin-Lead 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
    116-91-624-41-007000

    116-91-624-41-007000

    CONN IC SKT DBL

    Mill-Max Manufacturing Corp.

    2,793
    RFQ
    116-91-624-41-007000

    Datasheet

    116-91-624-41-007000 116 Tube Active DIP, 0.6" (15.24mm) Row Spacing 24 (2 x 12) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Elevated, Open Frame Solder 0.100" (2.54mm) Tin-Lead 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
    110-13-422-41-801000

    110-13-422-41-801000

    CONN IC DIP SOCKET 22POS GOLD

    Mill-Max Manufacturing Corp.

    4,312
    RFQ
    110-13-422-41-801000

    Datasheet

    110-13-422-41-801000 110 Tube Obsolete DIP, 0.4" (10.16mm) Row Spacing 22 (2 x 11) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame, Decoupling Capacitor Solder 0.100" (2.54mm) Gold 10.0µin (0.25µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
    614-93-210-41-001000

    614-93-210-41-001000

    SOCKET CARRIER LOWPRO .200 10POS

    Mill-Max Manufacturing Corp.

    2,184
    RFQ
    614-93-210-41-001000

    Datasheet

    614-93-210-41-001000 614 Tube Active DIP, 0.2" (5.08mm) Row Spacing 10 (2 x 5) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Carrier, Open Frame Solder 0.100" (2.54mm) Tin-Lead 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
    614-43-210-41-001000

    614-43-210-41-001000

    SKT CARRIER PGA

    Mill-Max Manufacturing Corp.

    4,980
    RFQ
    614-43-210-41-001000

    Datasheet

    614-43-210-41-001000 614 Tube Active DIP, 0.2" (5.08mm) Row Spacing 10 (2 x 5) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Carrier, Open Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
    121-11-314-41-001000

    121-11-314-41-001000

    CONN IC SKT DBL

    Mill-Max Manufacturing Corp.

    4,353
    RFQ
    121-11-314-41-001000

    Datasheet

    121-11-314-41-001000 121 Tube Active DIP, 0.3" (7.62mm) Row Spacing 14 (2 x 7) 0.100" (2.54mm) - - Beryllium Copper Through Hole Open Frame Wire Wrap 0.100" (2.54mm) - - Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
    614-41-316-41-001000

    614-41-316-41-001000

    SKT CARRIER PGA

    Mill-Max Manufacturing Corp.

    4,826
    RFQ
    614-41-316-41-001000

    Datasheet

    614-41-316-41-001000 614 Tube Active DIP, 0.3" (7.62mm) Row Spacing 16 (2 x 8) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Carrier, Open Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
    614-91-316-41-001000

    614-91-316-41-001000

    SKT CARRIER PGA

    Mill-Max Manufacturing Corp.

    3,071
    RFQ
    614-91-316-41-001000

    Datasheet

    614-91-316-41-001000 614 Tube Active DIP, 0.3" (7.62mm) Row Spacing 16 (2 x 8) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Carrier, Open Frame Solder 0.100" (2.54mm) Tin-Lead 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
    Total 19086 Record«Prev1... 568569570571572573574575...955Next»
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