Available 24/7 at SENICO ELECTRONICS INTL CO., LIMITED
    SENICO ELECTRONICS INTL CO., LIMITED

    IC Sockets

    Manufacturer Series Packaging Product Status Type Number of Positions or Pins (Grid) Pitch - Mating Contact Finish - Mating Contact Finish Thickness - Mating Contact Material - Mating Mounting Type Features Termination Pitch - Post Contact Finish - Post Contact Finish Thickness - Post Contact Material - Post Housing Material Operating Temperature















































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































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    Photo Mfr. Part # Availability Price Quantity Datasheet RoHs Series Packaging Product Status Type Number of Positions or Pins (Grid) Pitch - Mating Contact Finish - Mating Contact Finish Thickness - Mating Contact Material - Mating Mounting Type Features Termination Pitch - Post Contact Finish - Post Contact Finish Thickness - Post Contact Material - Post Housing Material Operating Temperature
    100-014-051

    100-014-051

    CONN IC DIP SOCKET 14POS GOLD

    3M

    4,973
    RFQ
    100-014-051

    Datasheet

    100-014-051 100 Bulk Obsolete DIP, 0.3" (7.62mm) Row Spacing 14 (2 x 7) 0.100" (2.54mm) Gold 8.00µin (0.203µm) Beryllium Copper Through Hole Closed Frame, Seal Tape Solder 0.100" (2.54mm) Gold Flash Brass Polyphenylene Sulfide (PPS), Glass Filled -65°C ~ 125°C
    130-024-050

    130-024-050

    CONN IC DIP SOCKET 24POS GOLD

    3M

    4,685
    RFQ
    130-024-050

    Datasheet

    130-024-050 100 Bulk Obsolete DIP, 0.3" (7.62mm) Row Spacing 24 (2 x 12) 0.100" (2.54mm) Gold 8.00µin (0.203µm) Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Gold Flash Brass Polyphenylene Sulfide (PPS), Glass Filled -65°C ~ 125°C
    300-032-000

    300-032-000

    CONN SOCKET SIP 32POS GOLD

    3M

    2,946
    RFQ

    -

    300-032-000 300 - Obsolete SIP 32 (1 x 32) 0.100" (2.54mm) Gold 8.00µin (0.203µm) - Through Hole Closed Frame - 0.100" (2.54mm) Gold 8.00µin (0.203µm) - - -
    400-028-000

    400-028-000

    CONN IC DIP SOCKET 28POS GOLD

    3M

    4,794
    RFQ

    -

    400-028-000 400 - Obsolete DIP, 0.6" (15.24mm) Row Spacing 28 (2 x 14) 0.100" (2.54mm) Gold 8.00µin (0.203µm) - Through Hole Open Frame - 0.100" (2.54mm) Gold 8.00µin (0.203µm) - - -
    130-028-050

    130-028-050

    CONN IC DIP SOCKET 28POS GOLD

    3M

    2,184
    RFQ
    130-028-050

    Datasheet

    130-028-050 100 Bulk Obsolete DIP, 0.3" (7.62mm) Row Spacing 28 (2 x 14) 0.100" (2.54mm) Gold 8.00µin (0.203µm) Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Gold Flash Brass Polyphenylene Sulfide (PPS), Glass Filled -65°C ~ 125°C
    300-014-000

    300-014-000

    CONN SOCKET SIP 14POS GOLD

    3M

    2,969
    RFQ

    -

    300-014-000 300 - Obsolete SIP 14 (1 x 14) 0.100" (2.54mm) Gold 8.00µin (0.203µm) - Through Hole Closed Frame - 0.100" (2.54mm) Gold 8.00µin (0.203µm) - - -
    400-032-000

    400-032-000

    CONN IC DIP SOCKET 32POS GOLD

    3M

    2,633
    RFQ

    -

    400-032-000 400 - Obsolete DIP, 0.6" (15.24mm) Row Spacing 32 (2 x 16) 0.100" (2.54mm) Gold 8.00µin (0.203µm) - Through Hole Open Frame - 0.100" (2.54mm) Gold 8.00µin (0.203µm) - - -
    110-024-050

    110-024-050

    CONN IC DIP SOCKET 24POS GOLD

    3M

    3,347
    RFQ
    110-024-050

    Datasheet

    110-024-050 100 Bulk Obsolete DIP, 0.4" (10.16mm) Row Spacing 24 (2 x 12) 0.100" (2.54mm) Gold 8.00µin (0.203µm) Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Gold Flash Brass Polyphenylene Sulfide (PPS), Glass Filled -65°C ~ 125°C
    500-032-000

    500-032-000

    CONN SOCKET SIP 32POS GOLD

    3M

    3,267
    RFQ

    -

    500-032-000 - - Obsolete SIP 32 (1 x 32) 0.100" (2.54mm) Gold 8.00µin (0.203µm) - Through Hole Closed Frame - 0.100" (2.54mm) Gold 8.00µin (0.203µm) - - -
    400-028-050

    400-028-050

    CONN IC DIP SOCKET 28POS GOLD

    3M

    2,520
    RFQ
    400-028-050

    Datasheet

    400-028-050 400 Box Obsolete DIP, 0.6" (15.24mm) Row Spacing 28 (2 x 14) 0.100" (2.54mm) Gold 8.00µin (0.203µm) - Through Hole Open Frame - 0.100" (2.54mm) Gold 8.00µin (0.203µm) - - -
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